FR2282720A1 - Assemblage de supports et de dispositifs semi-conducteurs - Google Patents

Assemblage de supports et de dispositifs semi-conducteurs

Info

Publication number
FR2282720A1
FR2282720A1 FR7521476A FR7521476A FR2282720A1 FR 2282720 A1 FR2282720 A1 FR 2282720A1 FR 7521476 A FR7521476 A FR 7521476A FR 7521476 A FR7521476 A FR 7521476A FR 2282720 A1 FR2282720 A1 FR 2282720A1
Authority
FR
France
Prior art keywords
silicon
substrate
silicon member
bonds
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7521476A
Other languages
English (en)
French (fr)
Other versions
FR2282720B1 (OSRAM
Inventor
Lawrence V Gregor
Robert G Shepheard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2282720A1 publication Critical patent/FR2282720A1/fr
Application granted granted Critical
Publication of FR2282720B1 publication Critical patent/FR2282720B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/69—
    • H10W90/401—
    • H10W99/00—
    • H10W72/07236—
    • H10W72/07532—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7521476A 1974-08-19 1975-07-03 Assemblage de supports et de dispositifs semi-conducteurs Granted FR2282720A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49848774A 1974-08-19 1974-08-19

Publications (2)

Publication Number Publication Date
FR2282720A1 true FR2282720A1 (fr) 1976-03-19
FR2282720B1 FR2282720B1 (OSRAM) 1977-07-22

Family

ID=23981286

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7521476A Granted FR2282720A1 (fr) 1974-08-19 1975-07-03 Assemblage de supports et de dispositifs semi-conducteurs

Country Status (4)

Country Link
JP (1) JPS5145978A (OSRAM)
DE (1) DE2536624A1 (OSRAM)
FR (1) FR2282720A1 (OSRAM)
GB (1) GB1477544A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2409500A1 (fr) * 1977-11-18 1979-06-15 Philips Nv Transducteur a semiconducteur en boitier

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices
JPS6080264A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体装置
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
CN1139117C (zh) * 1995-03-20 2004-02-18 株式会社东芝 氮化硅电路板
EP0766307B1 (en) * 1995-03-20 2007-08-08 Kabushiki Kaisha Toshiba Silicon nitride circuit board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2012333A1 (OSRAM) * 1968-07-05 1970-03-20 Ibm

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2012333A1 (OSRAM) * 1968-07-05 1970-03-20 Ibm

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN", VOLUME 10,DECEMBRE 1967 "MONOLITHIC CIRCUIT PACKAGE" R.J.BETZ, PAGE 877) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2409500A1 (fr) * 1977-11-18 1979-06-15 Philips Nv Transducteur a semiconducteur en boitier

Also Published As

Publication number Publication date
JPS5145978A (OSRAM) 1976-04-19
GB1477544A (en) 1977-06-22
FR2282720B1 (OSRAM) 1977-07-22
DE2536624A1 (de) 1976-03-04

Similar Documents

Publication Publication Date Title
GB1254795A (en) Electrical connector assembly
GB1276095A (en) Microcircuits and processes for their manufacture
GB1488759A (en) Electrical assemblies
GB1469085A (en) Semiconductor wafers
IT1182219B (it) Perfezionamento nei moduli di circuiti integrati ad alta densita' e procedimento di fabbricazione
GB1443338A (en) Method of fabricating spaced electrically-insulated through- connection in a conductive sheet
FR2373944A1 (fr) Substrat ceramique comportant un plan de masse et supportant des circuits integres et son procede de fabrication
EP0110285A3 (en) Interconnection of integrated circuits
GB1373008A (en) Electronic components
ATE54776T1 (de) Halbleiterelement und herstellungsverfahren.
GB1213726A (en) Improvements relating to electrical circuit assemblies
UST955008I4 (en) Flip chip structure including a silicon semiconductor element bonded to an Si3 N4 base substrate
FR2282720A1 (fr) Assemblage de supports et de dispositifs semi-conducteurs
JP3113005B2 (ja) キャリアのない集積回路パッケージ
GB1457866A (en) Interconnection structure
KR920001697A (ko) 수직형 반도체 상호 접촉 방법 및 그 구조
GB1376939A (en) Integrated circuit mounting and connection systems
GB1143531A (OSRAM)
US3447038A (en) Method and apparatus for interconnecting microelectronic circuit wafers
GB1146603A (en) Method of producing a solid-state circuit
US3504098A (en) Printed circuit panel
JP3867875B2 (ja) 半導体装置
JPS53110371A (en) Ceramic package type semiconductor device
JP3701242B2 (ja) 接続システム
GB999689A (en) Miniaturized electronic circuits and method of fabricating same

Legal Events

Date Code Title Description
ST Notification of lapse