GB1477544A - Semiconductor assemblies - Google Patents

Semiconductor assemblies

Info

Publication number
GB1477544A
GB1477544A GB2159775A GB2159775A GB1477544A GB 1477544 A GB1477544 A GB 1477544A GB 2159775 A GB2159775 A GB 2159775A GB 2159775 A GB2159775 A GB 2159775A GB 1477544 A GB1477544 A GB 1477544A
Authority
GB
United Kingdom
Prior art keywords
silicon
substrate
silicon member
bonds
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2159775A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of GB1477544A publication Critical patent/GB1477544A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/69—
    • H10W90/401—
    • H10W99/00—
    • H10W72/07236—
    • H10W72/07532—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB2159775A 1974-08-19 1975-05-20 Semiconductor assemblies Expired GB1477544A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49848774A 1974-08-19 1974-08-19

Publications (1)

Publication Number Publication Date
GB1477544A true GB1477544A (en) 1977-06-22

Family

ID=23981286

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2159775A Expired GB1477544A (en) 1974-08-19 1975-05-20 Semiconductor assemblies

Country Status (4)

Country Link
JP (1) JPS5145978A (OSRAM)
DE (1) DE2536624A1 (OSRAM)
FR (1) FR2282720A1 (OSRAM)
GB (1) GB1477544A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
JPS6080264A (ja) * 1983-10-07 1985-05-08 Toshiba Corp 半導体装置
US5081563A (en) * 1990-04-27 1992-01-14 International Business Machines Corporation Multi-layer package incorporating a recessed cavity for a semiconductor chip
CN1139117C (zh) * 1995-03-20 2004-02-18 株式会社东芝 氮化硅电路板
EP0766307B1 (en) * 1995-03-20 2007-08-08 Kabushiki Kaisha Toshiba Silicon nitride circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices

Also Published As

Publication number Publication date
JPS5145978A (OSRAM) 1976-04-19
FR2282720A1 (fr) 1976-03-19
FR2282720B1 (OSRAM) 1977-07-22
DE2536624A1 (de) 1976-03-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee