FR2241180B1 - - Google Patents

Info

Publication number
FR2241180B1
FR2241180B1 FR7410380A FR7410380A FR2241180B1 FR 2241180 B1 FR2241180 B1 FR 2241180B1 FR 7410380 A FR7410380 A FR 7410380A FR 7410380 A FR7410380 A FR 7410380A FR 2241180 B1 FR2241180 B1 FR 2241180B1
Authority
FR
France
Prior art keywords
solder
boards
holes
hot gas
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7410380A
Other languages
English (en)
Other versions
FR2241180A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
US Atomic Energy Commission (AEC)
Original Assignee
US Atomic Energy Commission (AEC)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by US Atomic Energy Commission (AEC) filed Critical US Atomic Energy Commission (AEC)
Publication of FR2241180A1 publication Critical patent/FR2241180A1/fr
Application granted granted Critical
Publication of FR2241180B1 publication Critical patent/FR2241180B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/045—Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
FR7410380A 1973-08-14 1974-03-26 Expired FR2241180B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US388305A US3865298A (en) 1973-08-14 1973-08-14 Solder leveling

Publications (2)

Publication Number Publication Date
FR2241180A1 FR2241180A1 (fr) 1975-03-14
FR2241180B1 true FR2241180B1 (fr) 1980-08-08

Family

ID=23533563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7410380A Expired FR2241180B1 (fr) 1973-08-14 1974-03-26

Country Status (9)

Country Link
US (1) US3865298A (fr)
JP (1) JPS5631918B2 (fr)
CA (1) CA981531A (fr)
DE (1) DE2411854B2 (fr)
FR (1) FR2241180B1 (fr)
GB (1) GB1457325A (fr)
IT (1) IT1009735B (fr)
NO (1) NO741100L (fr)
SE (1) SE405785B (fr)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519262A (en) * 1974-07-12 1976-01-24 Asahi Purinto Kogyo Kk Insatsuhaisenbanno handashoriho
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
JPS5344178A (en) * 1976-10-01 1978-04-20 Sanyo Electric Co Ltd Solder thin film forming method
JPS5392357A (en) * 1977-01-25 1978-08-14 Kondo Kenji Soldering method and solder tank
US4319708A (en) * 1977-02-15 1982-03-16 Lomerson Robert B Mechanical bonding of surface conductive layers
GB1602779A (en) * 1977-12-02 1981-11-18 Cooper Ind Inc Methods and apparatus for mass soldering of printed circuit boards
USRE32982E (en) * 1978-04-18 1989-07-11 Hollis Automation, Inc. Mass soldering system
US4401253A (en) * 1978-04-18 1983-08-30 Cooper Industries, Inc. Mass soldering system
US4315042A (en) * 1978-07-14 1982-02-09 Hybrid Technology Corporation Solder removal technique
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
US4402448A (en) * 1978-10-12 1983-09-06 Cooper Industries, Inc. Mass soldering system
JPS5556682A (en) * 1978-10-20 1980-04-25 Nippon Electric Co Method of and device for coating solder on printed circuit board
CH641708A5 (de) * 1979-11-02 1984-03-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
JPS56104179U (fr) * 1980-01-08 1981-08-14
JPS56148468A (en) * 1980-04-21 1981-11-17 Mitsumi Electric Co Ltd Method and device for solder coating
CH656769A5 (de) * 1980-09-09 1986-07-15 Sinter Ltd Vorrichtung zum aufbringen von lot auf leiterplatten.
US4619841A (en) * 1982-09-13 1986-10-28 Schwerin Thomas E Solder leveler
DE3339887A1 (de) * 1983-11-04 1985-05-15 Klaus 6107 Reinheim Obermann Vorrichtung zum verzinnen von leiterplatten
US4541358A (en) * 1983-11-28 1985-09-17 The Htc Corporation Method and apparatus for solder removal
GB8334122D0 (en) * 1983-12-22 1984-02-01 Lymn P P A Solder leveller
US4664308A (en) * 1985-10-30 1987-05-12 Hollis Automation, Inc. Mass soldering system providing an oscillating air blast
US4706602A (en) * 1985-12-27 1987-11-17 Gyrex Corporation Solder coater board clamp
US4679720A (en) * 1986-10-23 1987-07-14 Hollis Automation, Inc. Mass soldering system providing a sweeping fluid blast
US4851614A (en) * 1987-05-22 1989-07-25 Compaq Computer Corporation Non-occluding mounting hole with solder pad for printed circuit boards
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
US5048549A (en) * 1988-03-02 1991-09-17 General Dynamics Corp., Air Defense Systems Div. Apparatus for cleaning and/or fluxing circuit card assemblies
US4986462A (en) * 1988-03-02 1991-01-22 General Dynamics Corporation Method for cleaning and/or fluxing circuit card assemblies
US5158616A (en) * 1988-07-22 1992-10-27 Tokyo Electron Limited Apparatus for cleaning a substrate
DE3843984A1 (de) * 1988-12-27 1990-07-05 Asea Brown Boveri Verfahren zum loeten eines drahtlosen bauelementes sowie leiterplatte mit angeloetetem, drahtlosem bauelement
US5357991A (en) * 1989-03-27 1994-10-25 Semitool, Inc. Gas phase semiconductor processor with liquid phase mixing
US5125556A (en) * 1990-09-17 1992-06-30 Electrovert Ltd. Inerted IR soldering system
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5228614A (en) * 1990-07-09 1993-07-20 Electrovert Ltd. Solder nozzle with gas knife jet
US5110036A (en) * 1990-12-17 1992-05-05 At&T Bell Laboratories Method and apparatus for solder leveling of printed circuit boards
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5340013A (en) * 1993-12-10 1994-08-23 International Business Machines Corporation Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process
US5458281A (en) * 1994-06-30 1995-10-17 International Business Machines Corporation Method for removing meltable material from a substrate
US5593499A (en) * 1994-12-30 1997-01-14 Photocircuits Corporation Dual air knife for hot air solder levelling
US5954911A (en) * 1995-10-12 1999-09-21 Semitool, Inc. Semiconductor processing using vapor mixtures
JP2955990B2 (ja) * 1996-06-28 1999-10-04 株式会社沖電気コミュニケーションシステムズ スクリーン版洗浄装置
US6168065B1 (en) 1998-02-17 2001-01-02 Soltec B.V. Movable selective debridging apparatus for debridging soldered joints on printed circuit boards
NL1010214C2 (nl) * 1998-09-29 2000-03-30 Lantronic Bv Inrichting voor het behandelen van printplaten.
US6516816B1 (en) 1999-04-08 2003-02-11 Applied Materials, Inc. Spin-rinse-dryer
JP3799200B2 (ja) * 1999-09-22 2006-07-19 キヤノン株式会社 はんだ回収方法およびはんだ回収装置
US6216938B1 (en) * 1999-09-30 2001-04-17 International Business Machines Corporation Machine and process for reworking circuit boards
SE516892C2 (sv) * 1999-12-15 2002-03-19 Btg Pulp And Paper Technology Sätt och anordning för avlägsnande av kantöverskott vid bestrykning av löpande bana
EP1168422B1 (fr) * 2000-06-27 2009-12-16 Imec Méthode et appareil pour nettoyer et sécher un substrat
US20040000574A1 (en) * 2002-03-08 2004-01-01 Haruo Watanabe Solder applying method and solder applying apparatus
WO2004012242A1 (fr) * 2002-07-26 2004-02-05 Applied Materials, Inc. Composants hydrophiles pour une rinceuse-secheuse centrifuge
US8084866B2 (en) 2003-12-10 2011-12-27 Micron Technology, Inc. Microelectronic devices and methods for filling vias in microelectronic devices
US7091124B2 (en) * 2003-11-13 2006-08-15 Micron Technology, Inc. Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
US20050247894A1 (en) * 2004-05-05 2005-11-10 Watkins Charles M Systems and methods for forming apertures in microfeature workpieces
US7232754B2 (en) 2004-06-29 2007-06-19 Micron Technology, Inc. Microelectronic devices and methods for forming interconnects in microelectronic devices
US7425499B2 (en) * 2004-08-24 2008-09-16 Micron Technology, Inc. Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
US7083425B2 (en) 2004-08-27 2006-08-01 Micron Technology, Inc. Slanted vias for electrical circuits on circuit boards and other substrates
US7918383B2 (en) * 2004-09-01 2011-04-05 Micron Technology, Inc. Methods for placing substrates in contact with molten solder
US7300857B2 (en) * 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7271482B2 (en) * 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7845540B2 (en) * 2005-08-30 2010-12-07 Micron Technology, Inc. Systems and methods for depositing conductive material into openings in microfeature workpieces
US20070045120A1 (en) * 2005-09-01 2007-03-01 Micron Technology, Inc. Methods and apparatus for filling features in microfeature workpieces
US7863187B2 (en) * 2005-09-01 2011-01-04 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7622377B2 (en) 2005-09-01 2009-11-24 Micron Technology, Inc. Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
US7262134B2 (en) * 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7749899B2 (en) * 2006-06-01 2010-07-06 Micron Technology, Inc. Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpieces
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
US7902643B2 (en) * 2006-08-31 2011-03-08 Micron Technology, Inc. Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
SG150410A1 (en) 2007-08-31 2009-03-30 Micron Technology Inc Partitioned through-layer via and associated systems and methods
US7884015B2 (en) * 2007-12-06 2011-02-08 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
JP5692170B2 (ja) 2012-06-11 2015-04-01 千住金属工業株式会社 溶融はんだ薄膜被覆装置、薄膜はんだ被覆部材及びその製造方法
US9480282B2 (en) * 2013-07-31 2016-11-01 Evans Mactavish Agricraft, Inc. Feed device for linear airflow separator
US10362720B2 (en) * 2014-08-06 2019-07-23 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
CN111702282A (zh) * 2020-07-13 2020-09-25 迈普通信技术股份有限公司 通孔元件拆焊装置、系统及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1521406B2 (de) * 1963-05-22 1971-04-15 National Steel Corp , Pittsburgh, Pa (V St A ) Verfahren und vorrichtung zur steuerung der ueberzugs dicke des metallueberzugs eines metallischen bandes insbe sondere eines verzinkten stahlbandes
US3298588A (en) * 1964-01-23 1967-01-17 Sanders Associates Inc Printed circuit board and machine for soldering same
US3459587A (en) * 1967-02-02 1969-08-05 United States Steel Corp Method of controlling coating thickness
US3435801A (en) * 1967-03-02 1969-04-01 Alexander F Carini Solder deposit and leveling machines
US3491779A (en) * 1967-07-06 1970-01-27 Brown Eng Co Inc Solder leveling apparatus
US3603329A (en) * 1968-11-06 1971-09-07 Brown Eng Co Inc Apparatus for manufacturing printed circuits
US3653572A (en) * 1969-09-05 1972-04-04 Ibm Hot gas solder removal
US3667425A (en) * 1971-03-01 1972-06-06 Inland Steel Co Apparatus for controlling coating thickness

Also Published As

Publication number Publication date
DE2411854B2 (de) 1980-05-29
IT1009735B (it) 1976-12-20
GB1457325A (en) 1976-12-01
DE2411854A1 (de) 1975-02-20
US3865298A (en) 1975-02-11
SE7403310L (fr) 1975-02-15
CA981531A (en) 1976-01-13
SE405785B (sv) 1978-12-27
JPS5631918B2 (fr) 1981-07-24
NO741100L (fr) 1975-03-10
JPS5045965A (fr) 1975-04-24
FR2241180A1 (fr) 1975-03-14

Similar Documents

Publication Publication Date Title
FR2241180B1 (fr)
GB1521782A (en) Printed circuit board electrical component mounting method and apparatus
AU459650B2 (en) Connector for printed circuit board
DK140780B (da) Stikpropkontaktorgan til montering på kredsløbskort.
JPS52145769A (en) Method of surface treating printed circuit copper foil
GB1541893A (en) Printed circuit board and method for preparing the same
KR870004649A (ko) 납땜 장치
FR2442570A1 (fr) Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu
GB1422769A (en) Process for peeling off an aluminium foil
DK140510B (da) Konnektor til trykte kredsløbskort.
JPS5222770A (en) Method of mounting circuit parts on circuit board
JPS5235281A (en) Peparation of flexible base for printed circuit
JPS5222078A (en) Insulating board for plating
JPS5238947A (en) Electrochromic display device
JPS5347969A (en) Method of soldering printed circuit board
FR2247051A1 (en) Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists
JPS5375476A (en) Method of soldering printed board
JPS51116974A (en) Method of soldering parts on printed board
JPS525467A (en) Method of plating throughhholes opposite copper surfaces of printed circuit wiring board
JPS5273378A (en) Method of soldering printed circuit board
JPS5340866A (en) Method of inspecting printed circuit board
IT1042823B (it) Procedimento e dispositivo di fissaggio per trattenere circuiti flessibili durante la saldatura
JPS5233556A (en) Leakage test method
JPS56115599A (en) Method of soldering electronic circuit component on printed circuit board
JPS5567188A (en) Method of soldering printed circuit board