FR2247051A1 - Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists - Google Patents

Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists

Info

Publication number
FR2247051A1
FR2247051A1 FR7335697A FR7335697A FR2247051A1 FR 2247051 A1 FR2247051 A1 FR 2247051A1 FR 7335697 A FR7335697 A FR 7335697A FR 7335697 A FR7335697 A FR 7335697A FR 2247051 A1 FR2247051 A1 FR 2247051A1
Authority
FR
France
Prior art keywords
lacquer
glycerophthalic
screen printing
circuit boards
printing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7335697A
Other languages
French (fr)
Other versions
FR2247051B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Association des Ouvriers en Instruments de Precision
Original Assignee
Association des Ouvriers en Instruments de Precision
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Association des Ouvriers en Instruments de Precision filed Critical Association des Ouvriers en Instruments de Precision
Priority to FR7335697A priority Critical patent/FR2247051A1/en
Publication of FR2247051A1 publication Critical patent/FR2247051A1/en
Application granted granted Critical
Publication of FR2247051B1 publication Critical patent/FR2247051B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Printed circuits are made by screen printing onto a copper clad insulating substrate a glycerophthalic lacquer over the region to be preserved, curing the lacquer by heating 1 hr. at 120 degrees C then removing the exposed region chemically esp. using iron perchlorate. The time taken to mfr. a circuit is reduced and the precision of the obtd. circuits is improved. The process cost is reduced since the use of photoresists is not reqd.
FR7335697A 1973-10-05 1973-10-05 Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists Granted FR2247051A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7335697A FR2247051A1 (en) 1973-10-05 1973-10-05 Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7335697A FR2247051A1 (en) 1973-10-05 1973-10-05 Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists

Publications (2)

Publication Number Publication Date
FR2247051A1 true FR2247051A1 (en) 1975-05-02
FR2247051B1 FR2247051B1 (en) 1978-08-11

Family

ID=9125993

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7335697A Granted FR2247051A1 (en) 1973-10-05 1973-10-05 Glycerophthalic lacquer for screen printing circuit boards - eliminates need to use photoresists

Country Status (1)

Country Link
FR (1) FR2247051A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480553A1 (en) * 1980-04-09 1981-10-16 Ruf Kg Wilhelm PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
WO2007042068A1 (en) * 2005-10-11 2007-04-19 Fci Method to manufacture a printed circuit partially protected by an insulating layer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480553A1 (en) * 1980-04-09 1981-10-16 Ruf Kg Wilhelm PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
WO2007042068A1 (en) * 2005-10-11 2007-04-19 Fci Method to manufacture a printed circuit partially protected by an insulating layer

Also Published As

Publication number Publication date
FR2247051B1 (en) 1978-08-11

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Legal Events

Date Code Title Description
ST Notification of lapse