FR2223837A1 - - Google Patents

Info

Publication number
FR2223837A1
FR2223837A1 FR7409675A FR7409675A FR2223837A1 FR 2223837 A1 FR2223837 A1 FR 2223837A1 FR 7409675 A FR7409675 A FR 7409675A FR 7409675 A FR7409675 A FR 7409675A FR 2223837 A1 FR2223837 A1 FR 2223837A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7409675A
Other languages
French (fr)
Other versions
FR2223837B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of FR2223837A1 publication Critical patent/FR2223837A1/fr
Application granted granted Critical
Publication of FR2223837B1 publication Critical patent/FR2223837B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/14Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase
    • H10P32/1408Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers
    • H10P32/141Diffusion of dopants within, into or out of semiconductor bodies or layers within a single semiconductor body or layer in a solid phase; between different semiconductor bodies or layers, both in a solid phase from or through or into an external applied layer, e.g. photoresist or nitride layers the applied layer comprising oxides only
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H10P32/10Diffusion of dopants within, into or out of semiconductor bodies or layers
    • H10P32/17Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material
    • H10P32/171Diffusion of dopants within, into or out of semiconductor bodies or layers characterised by the semiconductor material being group IV material
FR7409675A 1973-03-30 1974-03-21 Expired FR2223837B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2316096A DE2316096B2 (de) 1973-03-30 1973-03-30 Verfahren zur Herstellung von integrierten Schaltungen mit Feldeffekttransistoren unterschiedlichen Leltungszustandes

Publications (2)

Publication Number Publication Date
FR2223837A1 true FR2223837A1 (enExample) 1974-10-25
FR2223837B1 FR2223837B1 (enExample) 1977-09-30

Family

ID=5876572

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7409675A Expired FR2223837B1 (enExample) 1973-03-30 1974-03-21

Country Status (13)

Country Link
US (1) US3919766A (enExample)
JP (1) JPS49131084A (enExample)
AT (1) AT339376B (enExample)
BE (1) BE813050A (enExample)
CA (1) CA1011004A (enExample)
CH (1) CH570043A5 (enExample)
DE (1) DE2316096B2 (enExample)
FR (1) FR2223837B1 (enExample)
GB (1) GB1443479A (enExample)
IT (1) IT1011153B (enExample)
LU (1) LU69730A1 (enExample)
NL (1) NL7404085A (enExample)
SE (1) SE386543B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53144275A (en) * 1977-05-20 1978-12-15 Matsushita Electric Ind Co Ltd Insulating gate type semiconductor device and its manufacture
JPS6127671A (ja) * 1985-05-15 1986-02-07 Nec Corp 半導体装置
DE102016101670B4 (de) * 2016-01-29 2022-11-03 Infineon Technologies Ag Ein Halbleiterbauelement und ein Verfahren zum Bilden eines Halbleiterbauelements

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162250C (nl) * 1967-11-21 1980-04-15 Philips Nv Halfgeleiderinrichting met een halfgeleiderlichaam, waarvan aan een hoofdoppervlak het halfgeleideroppervlak plaatselijk met een oxydelaag is bedekt, en werkwijze voor het vervaardigen van planaire halfgeleider- inrichtingen.
US3673679A (en) * 1970-12-01 1972-07-04 Texas Instruments Inc Complementary insulated gate field effect devices
US3783052A (en) * 1972-11-10 1974-01-01 Motorola Inc Process for manufacturing integrated circuits on an alumina substrate

Also Published As

Publication number Publication date
LU69730A1 (enExample) 1974-07-17
DE2316096B2 (de) 1975-02-27
AT339376B (de) 1977-10-10
NL7404085A (enExample) 1974-10-02
ATA213774A (de) 1977-02-15
FR2223837B1 (enExample) 1977-09-30
JPS49131084A (enExample) 1974-12-16
CH570043A5 (enExample) 1975-11-28
CA1011004A (en) 1977-05-24
BE813050A (fr) 1974-07-15
IT1011153B (it) 1977-01-20
GB1443479A (en) 1976-07-21
DE2316096A1 (de) 1974-10-03
SE386543B (sv) 1976-08-09
US3919766A (en) 1975-11-18

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Legal Events

Date Code Title Description
ST Notification of lapse