FR2218402A1 - - Google Patents
Info
- Publication number
- FR2218402A1 FR2218402A1 FR7344510A FR7344510A FR2218402A1 FR 2218402 A1 FR2218402 A1 FR 2218402A1 FR 7344510 A FR7344510 A FR 7344510A FR 7344510 A FR7344510 A FR 7344510A FR 2218402 A1 FR2218402 A1 FR 2218402A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2307649A DE2307649B2 (de) | 1973-02-16 | 1973-02-16 | Anordnung zum Aufstäuben verschiedener Materialien auf einem Substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2218402A1 true FR2218402A1 (fr) | 1974-09-13 |
FR2218402B1 FR2218402B1 (fr) | 1976-10-08 |
Family
ID=5872099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7344510A Expired FR2218402B1 (fr) | 1973-02-16 | 1973-12-13 |
Country Status (8)
Country | Link |
---|---|
US (1) | US3985635A (fr) |
JP (1) | JPS49114585A (fr) |
CH (1) | CH564096A5 (fr) |
DD (1) | DD109670A5 (fr) |
DE (1) | DE2307649B2 (fr) |
FR (1) | FR2218402B1 (fr) |
GB (1) | GB1465745A (fr) |
IT (1) | IT1007287B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0516436A2 (fr) * | 1991-05-31 | 1992-12-02 | Deposition Sciences, Inc. | Dispositif de pulvérisation |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4060471A (en) * | 1975-05-19 | 1977-11-29 | Rca Corporation | Composite sputtering method |
ATE2909T1 (de) * | 1978-07-08 | 1983-04-15 | Wolfgang Kieferle | Verfahren zum auflagern einer metall- oder legierungsschicht auf ein elektrisch leitendes werkstueck und vorrichtung zur durchfuehrung desselben. |
US4239611A (en) * | 1979-06-11 | 1980-12-16 | Vac-Tec Systems, Inc. | Magnetron sputtering devices |
GB2106545B (en) * | 1981-02-23 | 1985-06-26 | Rimma Ivanovna Stupak | Consumable cathode for electric-arc evaporator of metal |
FR2504116A1 (fr) * | 1981-04-15 | 1982-10-22 | Commissariat Energie Atomique | Procede d'obtention de couches de verres luminescents, application a la realisation de dispositifs munis de ces couches et a la realisation de photoscintillateurs. |
US4362611A (en) * | 1981-07-27 | 1982-12-07 | International Business Machines Corporation | Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield |
DE3248121A1 (de) * | 1982-12-24 | 1984-06-28 | Leybold-Heraeus GmbH, 5000 Köln | Hochleistungs-katodenanordnung fuer die erzeugung von mehrfachschichten |
US4420385A (en) * | 1983-04-15 | 1983-12-13 | Gryphon Products | Apparatus and process for sputter deposition of reacted thin films |
US4626336A (en) * | 1985-05-02 | 1986-12-02 | Hewlett Packard Company | Target for sputter depositing thin films |
DE3530074A1 (de) * | 1985-08-22 | 1987-02-26 | Siemens Ag | Vorrichtung zum herstellen mehrerer aufeinanderfolgender schichten durch hochleistungs-kathodenzerstaeubung |
JPS6260865A (ja) * | 1985-09-11 | 1987-03-17 | Sony Corp | 積層構造薄膜の作製装置 |
JPS6383261A (ja) * | 1986-09-26 | 1988-04-13 | Tokyo Electron Ltd | スパツタリング装置 |
DE3710497A1 (de) * | 1987-03-30 | 1988-10-20 | Tzn Forschung & Entwicklung | Verfahren und vorrichtung zur herstellung von duennen, aus mehreren elementaren komponenten bestehenden filmen |
US4814056A (en) * | 1987-06-23 | 1989-03-21 | Vac-Tec Systems, Inc. | Apparatus for producing graded-composition coatings |
JPH0194454U (fr) * | 1987-12-10 | 1989-06-21 | ||
US4865710A (en) * | 1988-03-31 | 1989-09-12 | Wisconsin Alumni Research Foundation | Magnetron with flux switching cathode and method of operation |
GB9225270D0 (en) * | 1992-12-03 | 1993-01-27 | Gec Ferranti Defence Syst | Depositing different materials on a substrate |
GB2273110B (en) * | 1992-12-03 | 1996-01-24 | Gec Marconi Avionics Holdings | Depositing different materials on a substrate |
DE69403386T2 (de) * | 1993-05-19 | 1997-09-18 | Applied Materials Inc | Vorrichtung und Verfahren zur Erhöhung der Zerstäubungsrate in einem Zerstäubungsgerät |
US5772858A (en) * | 1995-07-24 | 1998-06-30 | Applied Materials, Inc. | Method and apparatus for cleaning a target in a sputtering source |
AU1978497A (en) * | 1996-03-22 | 1997-10-10 | Materials Research Corporation | Method and apparatus for rf diode sputtering |
JP3249408B2 (ja) * | 1996-10-25 | 2002-01-21 | 昭和シェル石油株式会社 | 薄膜太陽電池の薄膜光吸収層の製造方法及び製造装置 |
DE59702419D1 (de) * | 1997-07-15 | 2000-11-09 | Unaxis Trading Ag Truebbach | Verfahren und Vorrichtung zur Sputterbeschichtung |
US6168690B1 (en) * | 1997-09-29 | 2001-01-02 | Lam Research Corporation | Methods and apparatus for physical vapor deposition |
US6086735A (en) * | 1998-06-01 | 2000-07-11 | Praxair S.T. Technology, Inc. | Contoured sputtering target |
US6309516B1 (en) | 1999-05-07 | 2001-10-30 | Seagate Technology Llc | Method and apparatus for metal allot sputtering |
US6503380B1 (en) | 2000-10-13 | 2003-01-07 | Honeywell International Inc. | Physical vapor target constructions |
JP2002363745A (ja) * | 2001-06-08 | 2002-12-18 | Canon Inc | スパッタによる膜の形成方法、光学部材、およびスパッタ装置 |
US6994775B2 (en) * | 2002-07-31 | 2006-02-07 | The Regents Of The University Of California | Multilayer composites and manufacture of same |
US7172681B2 (en) * | 2003-02-05 | 2007-02-06 | Bridgestone Corporation | Process for producing rubber-based composite material |
EP1641723B1 (fr) * | 2003-06-24 | 2008-01-02 | Cardinal CG Company | Revetements a concentration modulee |
US8084400B2 (en) * | 2005-10-11 | 2011-12-27 | Intermolecular, Inc. | Methods for discretized processing and process sequence integration of regions of a substrate |
JP2008525645A (ja) * | 2004-12-27 | 2008-07-17 | 日本板硝子株式会社 | 円筒形揺動シールドターゲットアセンブリおよびその使用方法 |
US7902063B2 (en) * | 2005-10-11 | 2011-03-08 | Intermolecular, Inc. | Methods for discretized formation of masking and capping layers on a substrate |
US8776717B2 (en) * | 2005-10-11 | 2014-07-15 | Intermolecular, Inc. | Systems for discretized processing of regions of a substrate |
US20070158181A1 (en) * | 2006-01-12 | 2007-07-12 | Seagate Technology Llc | Method & apparatus for cathode sputtering with uniform process gas distribution |
US8772772B2 (en) * | 2006-05-18 | 2014-07-08 | Intermolecular, Inc. | System and method for increasing productivity of combinatorial screening |
US20070202614A1 (en) * | 2006-02-10 | 2007-08-30 | Chiang Tony P | Method and apparatus for combinatorially varying materials, unit process and process sequence |
US7815782B2 (en) * | 2006-06-23 | 2010-10-19 | Applied Materials, Inc. | PVD target |
US7867904B2 (en) * | 2006-07-19 | 2011-01-11 | Intermolecular, Inc. | Method and system for isolated and discretized process sequence integration |
US8011317B2 (en) * | 2006-12-29 | 2011-09-06 | Intermolecular, Inc. | Advanced mixing system for integrated tool having site-isolated reactors |
US9567666B2 (en) * | 2009-01-12 | 2017-02-14 | Guardian Industries Corp | Apparatus and method for making sputtered films with reduced stress asymmetry |
CN103635604B (zh) | 2011-06-30 | 2015-09-30 | 佳能安内华股份有限公司 | 镀膜装置 |
WO2013035225A1 (fr) | 2011-09-09 | 2013-03-14 | キヤノンアネルバ株式会社 | Appareil de formation de film |
KR20230005882A (ko) * | 2020-04-30 | 2023-01-10 | 도쿄엘렉트론가부시키가이샤 | Pvd 장치 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1588300A (fr) * | 1967-10-11 | 1970-04-10 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3324019A (en) * | 1962-12-11 | 1967-06-06 | Schjeldahl Co G T | Method of sputtering sequentially from a plurality of cathodes |
US3361659A (en) * | 1967-08-14 | 1968-01-02 | Ibm | Process of depositing thin films by cathode sputtering using a controlled grid |
US3652444A (en) * | 1969-10-24 | 1972-03-28 | Ibm | Continuous vacuum process apparatus |
-
1973
- 1973-02-16 DE DE2307649A patent/DE2307649B2/de not_active Ceased
- 1973-12-13 FR FR7344510A patent/FR2218402B1/fr not_active Expired
-
1974
- 1974-01-11 CH CH33974A patent/CH564096A5/xx not_active IP Right Cessation
- 1974-02-01 US US05/438,792 patent/US3985635A/en not_active Expired - Lifetime
- 1974-02-08 IT IT20292/74A patent/IT1007287B/it active
- 1974-02-14 DD DD176548A patent/DD109670A5/xx unknown
- 1974-02-15 GB GB692774A patent/GB1465745A/en not_active Expired
- 1974-02-15 JP JP49018410A patent/JPS49114585A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1588300A (fr) * | 1967-10-11 | 1970-04-10 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0516436A2 (fr) * | 1991-05-31 | 1992-12-02 | Deposition Sciences, Inc. | Dispositif de pulvérisation |
EP0516436A3 (en) * | 1991-05-31 | 1993-03-31 | Deposition Sciences, Inc. | Sputtering device |
Also Published As
Publication number | Publication date |
---|---|
DE2307649A1 (de) | 1974-08-29 |
JPS49114585A (fr) | 1974-11-01 |
IT1007287B (it) | 1976-10-30 |
DE2307649B2 (de) | 1980-07-31 |
FR2218402B1 (fr) | 1976-10-08 |
CH564096A5 (fr) | 1975-07-15 |
US3985635A (en) | 1976-10-12 |
DD109670A5 (fr) | 1974-11-12 |
GB1465745A (en) | 1977-03-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |