FR2188307A1 - - Google Patents

Info

Publication number
FR2188307A1
FR2188307A1 FR7321533A FR7321533A FR2188307A1 FR 2188307 A1 FR2188307 A1 FR 2188307A1 FR 7321533 A FR7321533 A FR 7321533A FR 7321533 A FR7321533 A FR 7321533A FR 2188307 A1 FR2188307 A1 FR 2188307A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7321533A
Other languages
French (fr)
Other versions
FR2188307B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of FR2188307A1 publication Critical patent/FR2188307A1/fr
Application granted granted Critical
Publication of FR2188307B1 publication Critical patent/FR2188307B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H10W72/30—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H10W72/01361—
    • H10W72/07227—
    • H10W72/07327—
    • H10W72/07334—
    • H10W72/325—
    • H10W72/352—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7321533A 1972-06-13 1973-06-13 Expired FR2188307B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2228703A DE2228703A1 (de) 1972-06-13 1972-06-13 Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2188307A1 true FR2188307A1 (enExample) 1974-01-18
FR2188307B1 FR2188307B1 (enExample) 1978-02-10

Family

ID=5847611

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7321533A Expired FR2188307B1 (enExample) 1972-06-13 1973-06-13

Country Status (7)

Country Link
US (1) US3900153A (enExample)
JP (1) JPS4951872A (enExample)
BE (1) BE800673A (enExample)
DE (1) DE2228703A1 (enExample)
FR (1) FR2188307B1 (enExample)
GB (1) GB1440196A (enExample)
IT (1) IT989087B (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164906A1 (en) * 1984-05-14 1985-12-18 RAYCHEM CORPORATION (a Delaware corporation) Solder composition
EP0331500A1 (en) * 1988-03-04 1989-09-06 Kabushiki Kaisha Toshiba Brazing paste for bonding metal and ceramic
EP0608905A1 (en) * 1993-01-29 1994-08-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
FR2706139A1 (fr) * 1993-06-08 1994-12-16 Thomson Csf Matériau pour brasure.

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318959U (enExample) * 1976-07-28 1978-02-17
JPS575879Y2 (enExample) * 1977-03-14 1982-02-03
NL7704770A (nl) 1977-05-02 1978-11-06 Philips Nv Werkwijze voor het aanbrengen van afstandstukjes op een isolerend substraat.
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
US4487638A (en) * 1982-11-24 1984-12-11 Burroughs Corporation Semiconductor die-attach technique and composition therefor
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
DE3442537A1 (de) * 1984-11-22 1986-05-22 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Verfahren zum blasenfreien verbinden eines grossflaechigen halbleiter-bauelements mit einem als substrat dienenden bauteil mittels loeten
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPH025541A (ja) * 1988-06-24 1990-01-10 Asahi Daiyamondo Kogyo Kk ボンディングツールの製造方法
US5093545A (en) * 1988-09-09 1992-03-03 Metcal, Inc. Method, system and composition for soldering by induction heating
JPH0741159Y2 (ja) * 1988-10-07 1995-09-20 日本特殊陶業株式会社 気密封止型セラミックパッケージ
AU4517589A (en) * 1988-10-24 1990-05-14 Handy & Harman Automotive Group Inc. Brazing paste for joining materials with dissimilar thermal expansion rates
JPH02207539A (ja) * 1989-02-07 1990-08-17 Sanken Electric Co Ltd 半導体装置
US5076485A (en) * 1990-04-24 1991-12-31 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads with particles
US4995551A (en) * 1990-04-24 1991-02-26 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads on electrical components
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
JP3223678B2 (ja) * 1993-12-24 2001-10-29 三菱電機株式会社 はんだ付け用フラックスおよびクリームはんだ
US5540379A (en) * 1994-05-02 1996-07-30 Motorola, Inc. Soldering process
JPH0997791A (ja) * 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> バンプ構造、バンプの形成方法、実装接続体
EP0751562B1 (de) * 1995-06-27 2001-07-18 Braun GmbH Wärmeleite-Befestigung eines elektronischen Leistungsbauelementes auf einer Leiterplatte mit Kühlblech
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
DE19611396A1 (de) * 1996-03-22 1997-09-25 Emitec Emissionstechnologie Gelöteter metallischer Wabenkörper mit Abstandshaltern in den Lötspalten und Verfahren und Lot zu seiner Herstellung
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
US20010048888A1 (en) * 2000-03-24 2001-12-06 Rong-Fong Huang Anti-scavenging solders for silver metallization and method
GB2372473B (en) * 2001-02-24 2003-04-16 Marconi Caswell Ltd A method of soldering
US20060027899A1 (en) * 2004-06-25 2006-02-09 Tessera, Inc. Structure with spherical contact pins
US7179558B2 (en) * 2004-07-15 2007-02-20 Delphi Technologies, Inc. Braze alloy containing particulate material
CN101053079A (zh) * 2004-11-03 2007-10-10 德塞拉股份有限公司 堆叠式封装的改进
US8168347B2 (en) * 2004-12-30 2012-05-01 Delphi Technologies Inc. SOFC assembly joint spacing
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
KR101075241B1 (ko) 2010-11-15 2011-11-01 테세라, 인코포레이티드 유전체 부재에 단자를 구비하는 마이크로전자 패키지
US20120146206A1 (en) 2010-12-13 2012-06-14 Tessera Research Llc Pin attachment
US8618659B2 (en) 2011-05-03 2013-12-31 Tessera, Inc. Package-on-package assembly with wire bonds to encapsulation surface
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8872318B2 (en) 2011-08-24 2014-10-28 Tessera, Inc. Through interposer wire bond using low CTE interposer with coarse slot apertures
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US9349706B2 (en) 2012-02-24 2016-05-24 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8975738B2 (en) 2012-11-12 2015-03-10 Invensas Corporation Structure for microelectronic packaging with terminals on dielectric mass
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
US8883563B1 (en) 2013-07-15 2014-11-11 Invensas Corporation Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation
US9034696B2 (en) 2013-07-15 2015-05-19 Invensas Corporation Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation
US9023691B2 (en) 2013-07-15 2015-05-05 Invensas Corporation Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
DE102013110812B3 (de) * 2013-09-30 2014-10-09 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung eines weitergebildeten Metallformkörpers und Verfahren zur Herstellung einer Leistungshalbleitereinrichtung mit einer Lotverbindung diesen weitergebildeten Metallformkörper verwendend.
US9087815B2 (en) 2013-11-12 2015-07-21 Invensas Corporation Off substrate kinking of bond wire
US9082753B2 (en) 2013-11-12 2015-07-14 Invensas Corporation Severing bond wire by kinking and twisting
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US9214454B2 (en) 2014-03-31 2015-12-15 Invensas Corporation Batch process fabrication of package-on-package microelectronic assemblies
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9646917B2 (en) 2014-05-29 2017-05-09 Invensas Corporation Low CTE component with wire bond interconnects
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
JP6551432B2 (ja) 2017-02-08 2019-07-31 トヨタ自動車株式会社 半導体装置とその製造方法
DE102020000913A1 (de) * 2020-02-12 2021-08-12 Pfarr - Stanztechnik Gesellschaft mit beschränkter Haftung Bleifreie Lötfolie

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH400373A (de) * 1963-01-22 1965-10-15 Bbc Brown Boveri & Cie Lötverbindung für Halbleiterelemente
DE1226715B (de) * 1961-02-15 1966-10-13 Philips Patentverwaltung Halbleiterbauelement mit einem flaechenhaft an Stromzufuehrungen angeloeteten Halbleiterelement und Verfahren zu seiner Herstellung

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US2530552A (en) * 1946-01-08 1950-11-21 Champion Paper & Fibre Co Soldering method for positioning strip material
US3193920A (en) * 1959-08-17 1965-07-13 Eitel Mccullough Inc Pressure sealing of plated envelope sections
US3209449A (en) * 1960-06-28 1965-10-05 Fairchild Hiller Corp Brazing process and assembly employing spacing elements and capillary-sized passages
US3292240A (en) * 1963-08-08 1966-12-20 Ibm Method of fabricating microminiature functional components

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1226715B (de) * 1961-02-15 1966-10-13 Philips Patentverwaltung Halbleiterbauelement mit einem flaechenhaft an Stromzufuehrungen angeloeteten Halbleiterelement und Verfahren zu seiner Herstellung
CH400373A (de) * 1963-01-22 1965-10-15 Bbc Brown Boveri & Cie Lötverbindung für Halbleiterelemente

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
REVUE US "IBM TECHNICAL DISCLOSURE BULLETIN", VOLUME 2, NO 6, AVRIL 1960, "DIODE HEAT SINK", W.E. DUNKEL, PAGE 69 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0164906A1 (en) * 1984-05-14 1985-12-18 RAYCHEM CORPORATION (a Delaware corporation) Solder composition
EP0331500A1 (en) * 1988-03-04 1989-09-06 Kabushiki Kaisha Toshiba Brazing paste for bonding metal and ceramic
US4924033A (en) * 1988-03-04 1990-05-08 Kabushiki Kaisha Toshiba Brazing paste for bonding metal and ceramic
EP0608905A1 (en) * 1993-01-29 1994-08-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
US5377899A (en) * 1993-01-29 1995-01-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
FR2706139A1 (fr) * 1993-06-08 1994-12-16 Thomson Csf Matériau pour brasure.

Also Published As

Publication number Publication date
DE2228703B2 (enExample) 1974-11-28
US3900153A (en) 1975-08-19
BE800673A (fr) 1973-10-01
JPS4951872A (enExample) 1974-05-20
DE2228703A1 (de) 1974-01-10
GB1440196A (en) 1976-06-23
IT989087B (it) 1975-05-20
FR2188307B1 (enExample) 1978-02-10

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