FR2147308A1 - - Google Patents

Info

Publication number
FR2147308A1
FR2147308A1 FR7227378A FR7227378A FR2147308A1 FR 2147308 A1 FR2147308 A1 FR 2147308A1 FR 7227378 A FR7227378 A FR 7227378A FR 7227378 A FR7227378 A FR 7227378A FR 2147308 A1 FR2147308 A1 FR 2147308A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7227378A
Other languages
French (fr)
Other versions
FR2147308B1 (OSRAM
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2147308A1 publication Critical patent/FR2147308A1/fr
Application granted granted Critical
Publication of FR2147308B1 publication Critical patent/FR2147308B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/68Floating-gate IGFETs
    • H10D30/681Floating-gate IGFETs having only two programming levels
    • H10D30/684Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
    • H10D30/686Floating-gate IGFETs having only two programming levels programmed by hot carrier injection using hot carriers produced by avalanche breakdown of PN junctions, e.g. floating gate avalanche injection MOS [FAMOS]
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0433Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/84Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Read Only Memory (AREA)
FR7227378A 1971-07-28 1972-07-28 Expired FR2147308B1 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3540071A GB1392599A (en) 1971-07-28 1971-07-28 Semiconductor memory elements

Publications (2)

Publication Number Publication Date
FR2147308A1 true FR2147308A1 (OSRAM) 1973-03-09
FR2147308B1 FR2147308B1 (OSRAM) 1976-08-13

Family

ID=10377308

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7227378A Expired FR2147308B1 (OSRAM) 1971-07-28 1972-07-28

Country Status (9)

Country Link
US (1) US3952325A (OSRAM)
JP (1) JPS523279B1 (OSRAM)
AU (1) AU474357B2 (OSRAM)
CA (1) CA960365A (OSRAM)
DE (1) DE2235533C3 (OSRAM)
FR (1) FR2147308B1 (OSRAM)
GB (1) GB1392599A (OSRAM)
IT (1) IT964778B (OSRAM)
NL (1) NL173105C (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2183882A1 (OSRAM) * 1972-05-08 1973-12-21 Signetics Corp
FR2374739A1 (fr) * 1976-12-14 1978-07-13 Standard Microsyst Smc Modification des caracteristiques electriques de dispositifs mos, utilisant l'implantation d'ions

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CA1040321A (en) * 1974-07-23 1978-10-10 Alfred C. Ipri Polycrystalline silicon resistive device for integrated circuits and method for making same
DE2513207C2 (de) * 1974-09-20 1982-07-01 Siemens AG, 1000 Berlin und 8000 München n-Kanal-Speicher-FET
DE2812049C2 (de) * 1974-09-20 1982-05-27 Siemens AG, 1000 Berlin und 8000 München n-Kanal-Speicher-FET
DE2445079C3 (de) * 1974-09-20 1981-06-04 Siemens AG, 1000 Berlin und 8000 München Speicher-Feldeffekttransistor
US4087795A (en) * 1974-09-20 1978-05-02 Siemens Aktiengesellschaft Memory field effect storage device
DE2638730C2 (de) * 1974-09-20 1982-10-28 Siemens AG, 1000 Berlin und 8000 München n-Kanal-Speicher-FET, Verfahren zum Entladen des Speichergate des n-Kanal-Speicher-FET und Verwendung des n-Kanal-Speicher-FET
US3987474A (en) * 1975-01-23 1976-10-19 Massachusetts Institute Of Technology Non-volatile charge storage elements and an information storage apparatus employing such elements
DE2560220C2 (de) * 1975-03-25 1982-11-25 Siemens AG, 1000 Berlin und 8000 München n-Kanal-Speicher-FET
US4070667A (en) * 1975-11-03 1978-01-24 General Electric Company Charge transfer analog-to-digital converter
US4070652A (en) * 1975-11-14 1978-01-24 Westinghouse Electric Corporation Acousto-electric signal convolver, correlator and memory
US4161039A (en) * 1976-12-15 1979-07-10 Siemens Aktiengesellschaft N-Channel storage FET
US4302764A (en) * 1976-12-30 1981-11-24 International Business Machines Corporation Nondestructive read-out dynamic memory cell
DE2706155A1 (de) * 1977-02-14 1978-08-17 Siemens Ag In integrierter technik hergestellter elektronischer speicher
US4197144A (en) * 1978-09-21 1980-04-08 General Electric Company Method for improving writing of information in memory targets
US4262298A (en) * 1979-09-04 1981-04-14 Burroughs Corporation Ram having a stabilized substrate bias and low-threshold narrow-width transfer gates
JPS56150871A (en) * 1980-04-24 1981-11-21 Toshiba Corp Semiconductor device
US5243210A (en) * 1987-02-21 1993-09-07 Kabushiki Kaisha Toshiba Semiconductor memory device and manufacturing method thereof
US5359573A (en) * 1992-06-19 1994-10-25 Lattice Semiconductor Corporation Flash E2 PROM array with mingle polysilicon layer memory cell
DE69322643T2 (de) * 1992-06-19 1999-05-20 Lattice Semiconductor Corp., Hillsboro, Oreg. 97124-6421 Flash e?2 prom zelle mit nur einer polysiliziumschicht
US5418390A (en) * 1993-03-19 1995-05-23 Lattice Semiconductor Corporation Single polysilicon layer E2 PROM cell
US5539233A (en) * 1993-07-22 1996-07-23 Texas Instruments Incorporated Controlled low collector breakdown voltage vertical transistor for ESD protection circuits
JP3878681B2 (ja) 1995-06-15 2007-02-07 株式会社ルネサステクノロジ 不揮発性半導体記憶装置
US5777361A (en) * 1996-06-03 1998-07-07 Motorola, Inc. Single gate nonvolatile memory cell and method for accessing the same
US6768165B1 (en) * 1997-08-01 2004-07-27 Saifun Semiconductors Ltd. Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping
US6137723A (en) * 1998-04-01 2000-10-24 National Semiconductor Corporation Memory device having erasable Frohmann-Bentchkowsky EPROM cells that use a well-to-floating gate coupled voltage during erasure
US6137721A (en) * 1998-04-01 2000-10-24 National Semiconductor Corporation Memory device having erasable frohmann-bentchkowsky EPROM cells that use a plate-to-floating gate coupled voltage during erasure
US6081451A (en) * 1998-04-01 2000-06-27 National Semiconductor Corporation Memory device that utilizes single-poly EPROM cells with CMOS compatible programming voltages
US6055185A (en) 1998-04-01 2000-04-25 National Semiconductor Corporation Single-poly EPROM cell with CMOS compatible programming voltages
US6141246A (en) * 1998-04-01 2000-10-31 National Semiconductor Corporation Memory device with sense amplifier that sets the voltage drop across the cells of the device
US6130840A (en) * 1998-04-01 2000-10-10 National Semiconductor Corporation Memory cell having an erasable Frohmann-Bentchkowsky memory transistor
US6137722A (en) * 1998-04-01 2000-10-24 National Semiconductor Corporation Memory array having Frohmann-Bentchkowsky EPROM cells with a reduced number of access transistors
US6118691A (en) * 1998-04-01 2000-09-12 National Semiconductor Corporation Memory cell with a Frohmann-Bentchkowsky EPROM memory transistor that reduces the voltage across an unprogrammed memory transistor during a read
US6157574A (en) * 1998-04-01 2000-12-05 National Semiconductor Corporation Erasable frohmann-bentchkowsky memory transistor that stores multiple bits of data
US6348711B1 (en) * 1998-05-20 2002-02-19 Saifun Semiconductors Ltd. NROM cell with self-aligned programming and erasure areas
JP2000223590A (ja) * 1999-02-04 2000-08-11 Sony Corp ゲート電荷蓄積形メモリセル
US6614692B2 (en) * 2001-01-18 2003-09-02 Saifun Semiconductors Ltd. EEPROM array and method for operation thereof
US6584017B2 (en) 2001-04-05 2003-06-24 Saifun Semiconductors Ltd. Method for programming a reference cell
US6700818B2 (en) 2002-01-31 2004-03-02 Saifun Semiconductors Ltd. Method for operating a memory device
US6917544B2 (en) 2002-07-10 2005-07-12 Saifun Semiconductors Ltd. Multiple use memory chip
US7136304B2 (en) 2002-10-29 2006-11-14 Saifun Semiconductor Ltd Method, system and circuit for programming a non-volatile memory array
US7178004B2 (en) 2003-01-31 2007-02-13 Yan Polansky Memory array programming circuit and a method for using the circuit
US7142464B2 (en) 2003-04-29 2006-11-28 Saifun Semiconductors Ltd. Apparatus and methods for multi-level sensing in a memory array
US7123532B2 (en) 2003-09-16 2006-10-17 Saifun Semiconductors Ltd. Operating array cells with matched reference cells
US7484329B2 (en) 2003-11-20 2009-02-03 Seaweed Bio-Technology Inc. Technology for cultivation of Porphyra and other seaweeds in land-based sea water ponds
US7102191B2 (en) * 2004-03-24 2006-09-05 Micron Technologies, Inc. Memory device with high dielectric constant gate dielectrics and metal floating gates
US7317633B2 (en) 2004-07-06 2008-01-08 Saifun Semiconductors Ltd Protection of NROM devices from charge damage
US7095655B2 (en) 2004-08-12 2006-08-22 Saifun Semiconductors Ltd. Dynamic matching of signal path and reference path for sensing
US7638850B2 (en) 2004-10-14 2009-12-29 Saifun Semiconductors Ltd. Non-volatile memory structure and method of fabrication
US7535765B2 (en) 2004-12-09 2009-05-19 Saifun Semiconductors Ltd. Non-volatile memory device and method for reading cells
EP1686592A3 (en) 2005-01-19 2007-04-25 Saifun Semiconductors Ltd. Partial erase verify
US8053812B2 (en) 2005-03-17 2011-11-08 Spansion Israel Ltd Contact in planar NROM technology
US7804126B2 (en) 2005-07-18 2010-09-28 Saifun Semiconductors Ltd. Dense non-volatile memory array and method of fabrication
US7668017B2 (en) 2005-08-17 2010-02-23 Saifun Semiconductors Ltd. Method of erasing non-volatile memory cells
US7221138B2 (en) 2005-09-27 2007-05-22 Saifun Semiconductors Ltd Method and apparatus for measuring charge pump output current
US20070087503A1 (en) * 2005-10-17 2007-04-19 Saifun Semiconductors, Ltd. Improving NROM device characteristics using adjusted gate work function
US20070102789A1 (en) * 2005-11-09 2007-05-10 International Business Machines Corporation Bipolar transistor and back-gated transistor structure and method
US7352627B2 (en) 2006-01-03 2008-04-01 Saifon Semiconductors Ltd. Method, system, and circuit for operating a non-volatile memory array
US7808818B2 (en) 2006-01-12 2010-10-05 Saifun Semiconductors Ltd. Secondary injection for NROM
US8253452B2 (en) 2006-02-21 2012-08-28 Spansion Israel Ltd Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same
US7760554B2 (en) 2006-02-21 2010-07-20 Saifun Semiconductors Ltd. NROM non-volatile memory and mode of operation
US7692961B2 (en) 2006-02-21 2010-04-06 Saifun Semiconductors Ltd. Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection
US7638835B2 (en) 2006-02-28 2009-12-29 Saifun Semiconductors Ltd. Double density NROM with nitride strips (DDNS)
US7701779B2 (en) 2006-04-27 2010-04-20 Sajfun Semiconductors Ltd. Method for programming a reference cell
US7605579B2 (en) 2006-09-18 2009-10-20 Saifun Semiconductors Ltd. Measuring and controlling current consumption and output current of charge pumps
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
JP2013077780A (ja) * 2011-09-30 2013-04-25 Seiko Instruments Inc 半導体記憶装置及び半導体記憶素子
US9040929B2 (en) * 2012-07-30 2015-05-26 International Business Machines Corporation Charge sensors using inverted lateral bipolar junction transistors
CN111668126B (zh) * 2019-03-07 2023-04-25 西安电子科技大学 一种化合物misfet器件热空穴效应的测试结构及表征方法

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* Cited by examiner, † Cited by third party
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US3462657A (en) * 1968-03-07 1969-08-19 Gen Electric Protection means for surface semiconductor devices having thin oxide films therein
US3728695A (en) * 1971-10-06 1973-04-17 Intel Corp Random-access floating gate mos memory array

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2183882A1 (OSRAM) * 1972-05-08 1973-12-21 Signetics Corp
FR2374739A1 (fr) * 1976-12-14 1978-07-13 Standard Microsyst Smc Modification des caracteristiques electriques de dispositifs mos, utilisant l'implantation d'ions

Also Published As

Publication number Publication date
IT964778B (it) 1974-01-31
AU4483272A (en) 1974-01-24
DE2235533B2 (de) 1977-10-06
FR2147308B1 (OSRAM) 1976-08-13
NL173105C (nl) 1983-12-01
AU474357B2 (en) 1976-07-22
NL7210169A (OSRAM) 1973-01-30
JPS523279B1 (OSRAM) 1977-01-27
GB1392599A (en) 1975-04-30
US3952325A (en) 1976-04-20
CA960365A (en) 1974-12-31
DE2235533C3 (de) 1978-06-22
NL173105B (nl) 1983-07-01
DE2235533A1 (de) 1973-02-08

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Legal Events

Date Code Title Description
ST Notification of lapse