FR2082217A5 - Substrate coating by cathodic sputtering andevaporation - Google Patents

Substrate coating by cathodic sputtering andevaporation

Info

Publication number
FR2082217A5
FR2082217A5 FR7008177A FR7008177A FR2082217A5 FR 2082217 A5 FR2082217 A5 FR 2082217A5 FR 7008177 A FR7008177 A FR 7008177A FR 7008177 A FR7008177 A FR 7008177A FR 2082217 A5 FR2082217 A5 FR 2082217A5
Authority
FR
France
Prior art keywords
anchoring layer
produced
substrate
cathodic sputtering
andevaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7008177A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel CIT SA
Alcatel Lucent SAS
Original Assignee
Alcatel CIT SA
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel CIT SA, Alcatel SA filed Critical Alcatel CIT SA
Priority to FR7008177A priority Critical patent/FR2082217A5/en
Priority to CH285471A priority patent/CH536882A/en
Priority to DE19712110668 priority patent/DE2110668A1/en
Application granted granted Critical
Publication of FR2082217A5 publication Critical patent/FR2082217A5/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/46—Sputtering by ion beam produced by an external ion source

Abstract

Coating of a substrate under reduced pressure consists of (a) producing a thin anchoring layer on the substrate by cathodic sputtering, (b) applying the desired material layer on top of the anchoring layer by an evaporation process. The anchoring layer is produced using a plasma generator consisting of a tube shaped electrode, the axis of which passes through the electron emitting wire from which it is separated by a diaphragm, and a magnetic coil equiaxed with the electrode. Pref., the two layers may be produced in a single chamber when there is a gradual changeover in compsn. or, alternatively, the anchoring layer may be produced in a first chamber after which the substrate is transferred to a second where the evaporation coating process is carried out.
FR7008177A 1970-03-06 1970-03-06 Substrate coating by cathodic sputtering andevaporation Expired FR2082217A5 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR7008177A FR2082217A5 (en) 1970-03-06 1970-03-06 Substrate coating by cathodic sputtering andevaporation
CH285471A CH536882A (en) 1970-03-06 1971-02-25 Apparatus for vacuum coating a substrate with a thick, strongly adherent layer
DE19712110668 DE2110668A1 (en) 1970-03-06 1971-03-05 Device for coating a substrate with a thick and strongly adhesive layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7008177A FR2082217A5 (en) 1970-03-06 1970-03-06 Substrate coating by cathodic sputtering andevaporation

Publications (1)

Publication Number Publication Date
FR2082217A5 true FR2082217A5 (en) 1971-12-10

Family

ID=9051857

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7008177A Expired FR2082217A5 (en) 1970-03-06 1970-03-06 Substrate coating by cathodic sputtering andevaporation

Country Status (3)

Country Link
CH (1) CH536882A (en)
DE (1) DE2110668A1 (en)
FR (1) FR2082217A5 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2194105A1 (en) * 1972-07-31 1974-02-22 Cit Alcatel Plasma generator for thin film deposition - in which anode and cathode bodies are fixed rigidly together and magnet is fixed to anode
FR2403645A2 (en) * 1977-09-14 1979-04-13 Vide & Traitement Sa Furnace for thermochemical metal treatment - ensures ion bombardment by anodes and cathodes without arc discharge
FR2698884A1 (en) * 1992-12-03 1994-06-10 Gec Marconi Avionics Holdings Deposit of different materials on a substrate.

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800852C2 (en) * 1978-01-10 1983-07-14 Jurij Akimovič Moskva Dmitriev Device for ion plasma coating
US4175029A (en) * 1978-03-16 1979-11-20 Dmitriev Jury A Apparatus for ion plasma coating of articles
US5962923A (en) 1995-08-07 1999-10-05 Applied Materials, Inc. Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches
US6238533B1 (en) 1995-08-07 2001-05-29 Applied Materials, Inc. Integrated PVD system for aluminum hole filling using ionized metal adhesion layer
US7253109B2 (en) 1997-11-26 2007-08-07 Applied Materials, Inc. Method of depositing a tantalum nitride/tantalum diffusion barrier layer system
WO1999027579A1 (en) 1997-11-26 1999-06-03 Applied Materials, Inc. Damage-free sculptured coating deposition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2194105A1 (en) * 1972-07-31 1974-02-22 Cit Alcatel Plasma generator for thin film deposition - in which anode and cathode bodies are fixed rigidly together and magnet is fixed to anode
FR2403645A2 (en) * 1977-09-14 1979-04-13 Vide & Traitement Sa Furnace for thermochemical metal treatment - ensures ion bombardment by anodes and cathodes without arc discharge
FR2698884A1 (en) * 1992-12-03 1994-06-10 Gec Marconi Avionics Holdings Deposit of different materials on a substrate.

Also Published As

Publication number Publication date
DE2110668A1 (en) 1971-09-23
CH536882A (en) 1973-05-15

Similar Documents

Publication Publication Date Title
US4082636A (en) Ion plating method
GB1396987A (en) Method of producing artificial diamonds
FR2082217A5 (en) Substrate coating by cathodic sputtering andevaporation
ES333127A1 (en) A procedure for depositing by cathodized spraying on a substrate a thin metal layer. (Machine-translation by Google Translate, not legally binding)
JPS5210869A (en) Thin film forming method
GB1117009A (en) Improvements in and relating to depositing thin layers by vapour deposition or cathode sputtering
JPS567231A (en) Vapor deposition film type magnetic recording material and its production
FR2232832A1 (en) Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply
US3813258A (en) Method for evaporating silver on titanium and its alloys
ES409995A1 (en) Process for bonding copper or iron to titanium or tantalum
US3716472A (en) Cathode atomization apparatus
JPS5534689A (en) Sputtering device
FR2261601A1 (en) Method of forming conductive layers - uses varying pressures of oxygen during ion bombardment of target
SU138791A1 (en) Method for producing multicomponent ferromagnetic films by cathode sputtering
FR2208708A1 (en) Vacuum deposition of catalyst - from atomic dispersion produced by bombarding target with accelerated ions
JPS6053113B2 (en) Film formation method
JPS5591971A (en) Thin film forming method
JPS6431958A (en) Method for allowing thin metallic film to adhere to plastic film
SU109057A1 (en) The method of obtaining thin films
FR2154293A1 (en) Sputtering thin films - to produce homogeneous coatings on cylindrical articles
JPS61238957A (en) Formation of thin optical film
JPS584920A (en) Manufacture of semiconductor
FR2221536A1 (en) Vacuum depositing thin layers - using appts. which improves homogeneity of deposited layers
JPS5253781A (en) Method of producing thin film by spattering
JPS5298474A (en) Vapor phase growth under reduced pressure

Legal Events

Date Code Title Description
ST Notification of lapse