CH536882A - Apparatus for vacuum coating a substrate with a thick, strongly adherent layer - Google Patents
Apparatus for vacuum coating a substrate with a thick, strongly adherent layerInfo
- Publication number
- CH536882A CH536882A CH285471A CH285471A CH536882A CH 536882 A CH536882 A CH 536882A CH 285471 A CH285471 A CH 285471A CH 285471 A CH285471 A CH 285471A CH 536882 A CH536882 A CH 536882A
- Authority
- CH
- Switzerland
- Prior art keywords
- thick
- substrate
- vacuum coating
- adherent layer
- strongly adherent
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7008177A FR2082217A5 (en) | 1970-03-06 | 1970-03-06 | Substrate coating by cathodic sputtering andevaporation |
Publications (1)
Publication Number | Publication Date |
---|---|
CH536882A true CH536882A (en) | 1973-05-15 |
Family
ID=9051857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH285471A CH536882A (en) | 1970-03-06 | 1971-02-25 | Apparatus for vacuum coating a substrate with a thick, strongly adherent layer |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH536882A (en) |
DE (1) | DE2110668A1 (en) |
FR (1) | FR2082217A5 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2194105A1 (en) * | 1972-07-31 | 1974-02-22 | Cit Alcatel | Plasma generator for thin film deposition - in which anode and cathode bodies are fixed rigidly together and magnet is fixed to anode |
FR2403645A2 (en) * | 1977-09-14 | 1979-04-13 | Vide & Traitement Sa | Furnace for thermochemical metal treatment - ensures ion bombardment by anodes and cathodes without arc discharge |
DE2800852C2 (en) * | 1978-01-10 | 1983-07-14 | Jurij Akimovič Moskva Dmitriev | Device for ion plasma coating |
US4175029A (en) * | 1978-03-16 | 1979-11-20 | Dmitriev Jury A | Apparatus for ion plasma coating of articles |
GB9225270D0 (en) * | 1992-12-03 | 1993-01-27 | Gec Ferranti Defence Syst | Depositing different materials on a substrate |
US6238533B1 (en) * | 1995-08-07 | 2001-05-29 | Applied Materials, Inc. | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |
US5962923A (en) | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
EP1034566A1 (en) | 1997-11-26 | 2000-09-13 | Applied Materials, Inc. | Damage-free sculptured coating deposition |
US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
-
1970
- 1970-03-06 FR FR7008177A patent/FR2082217A5/en not_active Expired
-
1971
- 1971-02-25 CH CH285471A patent/CH536882A/en not_active IP Right Cessation
- 1971-03-05 DE DE19712110668 patent/DE2110668A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2110668A1 (en) | 1971-09-23 |
FR2082217A5 (en) | 1971-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |