FR2079305A1 - Removable embedding compsn for electronic components - Google Patents
Removable embedding compsn for electronic componentsInfo
- Publication number
- FR2079305A1 FR2079305A1 FR7104031A FR7104031A FR2079305A1 FR 2079305 A1 FR2079305 A1 FR 2079305A1 FR 7104031 A FR7104031 A FR 7104031A FR 7104031 A FR7104031 A FR 7104031A FR 2079305 A1 FR2079305 A1 FR 2079305A1
- Authority
- FR
- France
- Prior art keywords
- compsn
- electronic components
- embedding
- binder
- esp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Insulating Of Coils (AREA)
- Organic Insulating Materials (AREA)
Abstract
An embedding or filling compsn. contains (a) 60-90 wt.% of solid particles, including sand, and (b) 40-10 weight % of a softener and a binder. The binder is esp. a polyurethane containing a hardener. Pref. the particles comprise 25 wt.% sand, 25 wt.% Al2O3 and 25 wt.% SiO2 of micron size range. The compsn. is used esp. for embedding electronic components. The compsn. can be poured in the unhardened state. It hardens to a mass which is sufficiently rigid to hold the electronic components in place end to protect them from vibration and shock. However, the hardened mass can be removed by breaking it manually into pieces, thus facilitating inspection and repair of the components. The composition is cheap, has a high dielectric constant and excellent heat transfer properties.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US939670A | 1970-02-06 | 1970-02-06 | |
| US9948970A | 1970-12-23 | 1970-12-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2079305A1 true FR2079305A1 (en) | 1971-11-12 |
Family
ID=26679422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7104031A Withdrawn FR2079305A1 (en) | 1970-02-06 | 1971-02-05 | Removable embedding compsn for electronic components |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE2105497A1 (en) |
| FR (1) | FR2079305A1 (en) |
| NL (1) | NL7101588A (en) |
-
1971
- 1971-02-05 FR FR7104031A patent/FR2079305A1/en not_active Withdrawn
- 1971-02-05 NL NL7101588A patent/NL7101588A/xx unknown
- 1971-02-05 DE DE19712105497 patent/DE2105497A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2105497A1 (en) | 1971-10-14 |
| NL7101588A (en) | 1971-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |