FR2003163A1 - Dispositif a semi-conducteur et son procede de fabrication - Google Patents

Dispositif a semi-conducteur et son procede de fabrication

Info

Publication number
FR2003163A1
FR2003163A1 FR6905711A FR6905711A FR2003163A1 FR 2003163 A1 FR2003163 A1 FR 2003163A1 FR 6905711 A FR6905711 A FR 6905711A FR 6905711 A FR6905711 A FR 6905711A FR 2003163 A1 FR2003163 A1 FR 2003163A1
Authority
FR
France
Prior art keywords
semiconductor device
manufacturing process
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR6905711A
Other languages
English (en)
French (fr)
Other versions
FR2003163B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1362768A external-priority patent/JPS5510976B1/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of FR2003163A1 publication Critical patent/FR2003163A1/fr
Application granted granted Critical
Publication of FR2003163B1 publication Critical patent/FR2003163B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/147—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being multilayered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
FR6905711A 1968-03-04 1969-03-03 Dispositif a semi-conducteur et son procede de fabrication Granted FR2003163A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1362768A JPS5510976B1 (https=) 1968-03-04 1968-03-04
JP2518168 1968-04-17

Publications (2)

Publication Number Publication Date
FR2003163A1 true FR2003163A1 (fr) 1969-11-07
FR2003163B1 FR2003163B1 (https=) 1974-06-14

Family

ID=26349441

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6905711A Granted FR2003163A1 (fr) 1968-03-04 1969-03-03 Dispositif a semi-conducteur et son procede de fabrication

Country Status (4)

Country Link
DE (1) DE1910746A1 (https=)
FR (1) FR2003163A1 (https=)
GB (1) GB1255995A (https=)
NL (1) NL6903255A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2494499A1 (fr) * 1980-11-17 1982-05-21 Int Rectifier Corp Structure plane pour dispositifs semi-conducteurs a haute tension

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4002511A (en) * 1975-04-16 1977-01-11 Ibm Corporation Method for forming masks comprising silicon nitride and novel mask structures produced thereby
JPS5627935A (en) * 1979-08-15 1981-03-18 Toshiba Corp Semiconductor device
DE4109533C2 (de) * 1990-09-13 1994-06-23 Eupec Gmbh & Co Kg Passiviertes Halbleiterbauelement und Verfahren zu seiner Herstellung
US5639325A (en) * 1995-02-01 1997-06-17 The Whitaker Corporation Process for producing a glass-coated article
US6749918B2 (en) 1997-11-18 2004-06-15 Johan Staal Hygiene mats
DE102013218494B4 (de) * 2013-09-16 2021-06-02 Infineon Technologies Ag Halbleiterbauelement mit einer Passivierungsschicht und Herstellungsverfahren
CN114171563B (zh) * 2021-11-30 2023-07-04 武汉华星光电半导体显示技术有限公司 显示面板和显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1390639A (fr) * 1963-04-02 1965-02-26 Rca Corp Procédé de fabrication de dispositifs à semi-conducteurs
FR1548847A (https=) * 1967-01-13 1968-12-06
FR1557549A (https=) * 1967-03-29 1969-02-14

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1390639A (fr) * 1963-04-02 1965-02-26 Rca Corp Procédé de fabrication de dispositifs à semi-conducteurs
FR1548847A (https=) * 1967-01-13 1968-12-06
FR1557549A (https=) * 1967-03-29 1969-02-14

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
*REVUE AMERICAINE "I.B.M. TECHNICAL DISCLOSURE BULLETIN" VOL. 9 AVRIL 1967 "PHOSPHOSILICATE GLASS ON SEMI-CONDUCTEUR DEVICES P.D. DAVIDSE, PAGE 1645. *
*REVUE AMERICAINE I.B.M. TECHNICAL DISCLOSURE BULLETIN, VOL. 8 AVRIL 1966 PB - SIO2 COMPOSITE LAYER AND MEFRADE OF FORMING R.P. ESCH ET AL. PAGE 1641. *
REVUE AMERICAINE" I.B.M. TECHNICAL DISCLOSURE BULLETIN" VOL. 10 JUILLET 1967 "PASSIVATION OF SILICON-DIOXIDE WITH THIN ALUMINIUM OXIDE LAYER "P.J. BURKHARDT, PAGE 160. *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2494499A1 (fr) * 1980-11-17 1982-05-21 Int Rectifier Corp Structure plane pour dispositifs semi-conducteurs a haute tension

Also Published As

Publication number Publication date
GB1255995A (en) 1971-12-08
NL6903255A (https=) 1969-09-08
FR2003163B1 (https=) 1974-06-14
DE1910746B2 (https=) 1970-11-19
DE1910746A1 (de) 1970-03-12

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Legal Events

Date Code Title Description
ST Notification of lapse
AR Application made for restoration
BR Restoration of rights
ST Notification of lapse