FR1562707A - - Google Patents

Info

Publication number
FR1562707A
FR1562707A FR1562707DA FR1562707A FR 1562707 A FR1562707 A FR 1562707A FR 1562707D A FR1562707D A FR 1562707DA FR 1562707 A FR1562707 A FR 1562707A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1562707A publication Critical patent/FR1562707A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR1562707D 1967-05-16 1968-05-15 Expired FR1562707A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63890367A 1967-05-16 1967-05-16
US63891067A 1967-05-16 1967-05-16

Publications (1)

Publication Number Publication Date
FR1562707A true FR1562707A (fr) 1969-04-04

Family

ID=27093206

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1562707D Expired FR1562707A (fr) 1967-05-16 1968-05-15

Country Status (6)

Country Link
US (2) US3562057A (fr)
DE (1) DE1752331B2 (fr)
ES (1) ES353893A1 (fr)
FR (1) FR1562707A (fr)
GB (1) GB1211638A (fr)
NL (1) NL6806922A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2014142A1 (fr) * 1968-05-29 1970-04-17 Rca Corp

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US3988196A (en) * 1967-10-09 1976-10-26 Western Electric Company, Inc. Apparatus for transferring an oriented array of articles
US3850721A (en) * 1970-04-03 1974-11-26 Texas Instruments Inc Method of cleaning and transferring semiconductors
US3766638A (en) * 1970-08-31 1973-10-23 Hugle Ind Inc Wafer spreader
US3864819A (en) * 1970-12-07 1975-02-11 Hughes Aircraft Co Method for fabricating semiconductor devices
US3743148A (en) * 1971-03-08 1973-07-03 H Carlson Wafer breaker
US3818568A (en) * 1973-03-29 1974-06-25 Teledyne Mid America Corp Apparatus for forming heat exchangers
US3870196A (en) * 1973-09-28 1975-03-11 Laurier Associates Inc High yield method of breaking wafer into dice
US3918150A (en) * 1974-02-08 1975-11-11 Gen Electric System for separating a semiconductor wafer into discrete pellets
US3918581A (en) * 1974-08-02 1975-11-11 Sprague Electric Co Shipping package for semiconductor chips
US4044937A (en) * 1975-10-21 1977-08-30 International Business Machines Corporation Multiple ball element wafer breaking apparatus
US4085038A (en) * 1976-12-15 1978-04-18 Western Electric Co., Inc. Methods of and apparatus for sorting parts of a separated article
US4104099A (en) * 1977-01-27 1978-08-01 International Telephone And Telegraph Corporation Method and apparatus for lapping or polishing materials
US4165584A (en) * 1977-01-27 1979-08-28 International Telephone And Telegraph Corporation Apparatus for lapping or polishing materials
US4203127A (en) * 1977-07-18 1980-05-13 Motorola, Inc. Package and method of packaging semiconductor wafers
NL7907115A (nl) * 1979-09-25 1981-03-27 Philips Nv Werkwijze voor het vervaardigen van een permanente magneet ter plaatsing in een luchtspleet van een transformatorkern.
JPS5821428B1 (fr) * 1980-08-27 1983-04-30 Nippon Electric Co
US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4702365A (en) * 1984-09-10 1987-10-27 Pak Chong Il Apparatus for removing individual wafer segments from a framed carrier
US4607744A (en) * 1984-09-10 1986-08-26 Pak Chong Il Method and apparatus for removing integrated circuit chips from a flexible carrier
US4798645A (en) * 1984-09-10 1989-01-17 Pak Chong Il Wafer segment separator and method
US4653680A (en) * 1985-04-25 1987-03-31 Regan Barrie F Apparatus for breaking semiconductor wafers and the like
US4711014A (en) * 1985-08-29 1987-12-08 Vichem Corporation Method for handling semiconductor die and the like
US4667944A (en) * 1985-08-29 1987-05-26 Vichem Corporation Means for handling semiconductor die and the like
US4744550A (en) * 1986-04-24 1988-05-17 Asm America, Inc. Vacuum wafer expander apparatus
KR920004514B1 (ko) * 1987-05-01 1992-06-08 스미도모덴기고오교오 가부시기가이샤 반도체소자 제조장치
EP0363548B1 (fr) * 1988-10-10 1994-03-23 International Business Machines Corporation Procédé pour briser une pièce de travail sous forme de plaque, en particulier d'une plaquette semi-conductrice, et dispositif pour briser ladite pièce de travail disposée entre deux feuilles sous forme de sandwich
US5029418A (en) * 1990-03-05 1991-07-09 Eastman Kodak Company Sawing method for substrate cutting operations
US5239806A (en) * 1990-11-02 1993-08-31 Ak Technology, Inc. Thermoplastic semiconductor package and method of producing it
US5133491A (en) * 1990-12-20 1992-07-28 Die Tech, Inc. Substrate breaker
US5389182A (en) * 1993-08-02 1995-02-14 Texas Instruments Incorporated Use of a saw frame with tape as a substrate carrier for wafer level backend processing
US6541852B2 (en) 1994-07-07 2003-04-01 Tessera, Inc. Framed sheets
US6228685B1 (en) 1994-07-07 2001-05-08 Tessera, Inc. Framed sheet processing
US5710065A (en) * 1995-01-03 1998-01-20 Texas Instruments Incorporated Method and apparatus for breaking and separating dies from a wafer
JPH09219383A (ja) * 1996-02-13 1997-08-19 Fujitsu Ltd 半導体装置の製造方法及び製造装置
US6685073B1 (en) 1996-11-26 2004-02-03 Texas Instruments Incorporated Method and apparatus for stretching and processing saw film tape after breaking a partially sawn wafer
US6184063B1 (en) 1996-11-26 2001-02-06 Texas Instruments Incorporated Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
US6182546B1 (en) 1997-03-04 2001-02-06 Tessera, Inc. Apparatus and methods for separating microelectronic packages from a common substrate
US6217972B1 (en) * 1997-10-17 2001-04-17 Tessera, Inc. Enhancements in framed sheet processing
US6164454A (en) * 1997-11-14 2000-12-26 Lucent Technologies Inc. Apparatus and method for storing semiconductor objects
US5994230A (en) * 1997-12-16 1999-11-30 Opto Power Corp Method for cold cleaving of laser wafers into bars
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
US6088212A (en) * 1998-08-17 2000-07-11 Lucent Technologies Inc. Apparatus and method for minimizing electrostatic discharge damage to semiconductor objects
US20020084300A1 (en) * 2000-12-29 2002-07-04 Charles Elkins Apparatus and method for separating circuit boards
US6686225B2 (en) 2001-07-27 2004-02-03 Texas Instruments Incorporated Method of separating semiconductor dies from a wafer
US6541352B2 (en) 2001-07-27 2003-04-01 Texas Instruments Incorporated Semiconductor die with contoured bottom surface and method for making same
DE602004009040T2 (de) * 2003-02-21 2008-06-19 Cryovac, Inc. Verfahren und vorrichtung zur herstellung von leicht zu öffnenden packungen
JP4515790B2 (ja) * 2004-03-08 2010-08-04 株式会社東芝 半導体装置の製造方法及びその製造装置
JP2008544516A (ja) * 2005-06-16 2008-12-04 エヌエックスピー ビー ヴィ ホイルキャリアのホイルを延伸させる手段、ウエハからダイ片を剥離させる機構及びダイ片剥離方法
JP5215556B2 (ja) * 2006-12-20 2013-06-19 Ｔｏｗａ株式会社 電子部品製造用の個片化装置
US20090061597A1 (en) * 2007-08-30 2009-03-05 Kavlico Corporation Singulator method and apparatus
ES2530800T3 (es) * 2008-05-20 2015-03-05 Cryovac Inc Método para envasar al vacío con película un producto dispuesto en una bandeja
JP6043150B2 (ja) * 2012-10-29 2016-12-14 三星ダイヤモンド工業株式会社 積層脆性材料基板のブレイク装置および積層脆性材料基板のブレイク方法
JP2016104683A (ja) * 2014-11-19 2016-06-09 坂東機工株式会社 ガラス板の折割方法及びその折割装置
CN104485297B (zh) * 2014-12-18 2017-04-05 中国空间技术研究院 Pill封装光敏器件测试转换夹具
NZ745809A (en) * 2016-03-04 2022-07-29 Cryovac Llc Apparatus and process for vacuum skin packaging of a product and a vacuum skin package
US20180323105A1 (en) * 2017-05-02 2018-11-08 Psemi Corporation Simultaneous Break and Expansion System for Integrated Circuit Wafers
KR20210026270A (ko) * 2019-08-29 2021-03-10 주식회사 원익아이피에스 얼라인모듈 및 그를 포함하는 기판처리시스템
CN114030091A (zh) * 2021-11-25 2022-02-11 上海提牛机电设备有限公司 抓夹装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2014142A1 (fr) * 1968-05-29 1970-04-17 Rca Corp

Also Published As

Publication number Publication date
NL6806922A (fr) 1968-11-18
US3562058A (en) 1971-02-09
ES353893A1 (es) 1969-10-16
DE1752331B2 (de) 1977-02-10
GB1211638A (en) 1970-11-11
DE1752331A1 (de) 1971-05-19
US3562057A (en) 1971-02-09

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Legal Events

Date Code Title Description
ST Notification of lapse