FR1487050A - Procédé et appareil de liaison d'éléments minuscules - Google Patents

Procédé et appareil de liaison d'éléments minuscules

Info

Publication number
FR1487050A
FR1487050A FR69985A FR69985A FR1487050A FR 1487050 A FR1487050 A FR 1487050A FR 69985 A FR69985 A FR 69985A FR 69985 A FR69985 A FR 69985A FR 1487050 A FR1487050 A FR 1487050A
Authority
FR
France
Prior art keywords
bonding
pulse
signal
microseconds
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR69985A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of FR1487050A publication Critical patent/FR1487050A/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P72/0444
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H10W72/0711
    • H10W72/536
    • H10W72/5522
    • H10W72/5524

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
FR69985A 1965-07-19 1966-07-19 Procédé et appareil de liaison d'éléments minuscules Expired FR1487050A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47299965 US3458921A (en) 1965-07-19 1965-07-19 Short pulse vibratory bonding

Publications (1)

Publication Number Publication Date
FR1487050A true FR1487050A (fr) 1967-06-30

Family

ID=23877760

Family Applications (1)

Application Number Title Priority Date Filing Date
FR69985A Expired FR1487050A (fr) 1965-07-19 1966-07-19 Procédé et appareil de liaison d'éléments minuscules

Country Status (7)

Country Link
US (1) US3458921A (enExample)
BE (1) BE684350A (enExample)
DE (1) DE1577011A1 (enExample)
FR (1) FR1487050A (enExample)
GB (1) GB1153002A (enExample)
NL (1) NL6610145A (enExample)
SE (1) SE333413B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162580B (nl) * 1970-12-17 1980-01-15 Philips Nv Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager.
US3791028A (en) * 1971-09-17 1974-02-12 Ibm Ultrasonic bonding of cubic crystal-structure metals
US4047657A (en) * 1976-11-01 1977-09-13 Branson Ultrasonics Corporation Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4352972A (en) 1980-07-09 1982-10-05 Lebedev Vladimir K Method of resistance flash butt welding
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
EP1332826A1 (de) * 2002-02-01 2003-08-06 Esec Trading S.A. Verfahren für die Bestimmung optimaler Bondparameter beim Bonden mit einem Wire Bonder
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
DE10347984A1 (de) * 2003-10-15 2005-05-19 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren zum Vibrationsschweißen mit verkürtzter Ausschwingzeit
US7044356B2 (en) * 2003-12-11 2006-05-16 Texas Instruments Incorporated Roller wire brake for wire bonding machine
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
DE102009059307A1 (de) * 2009-12-23 2011-06-30 Schunk Sonosystems GmbH, 35435 Verfahren zum elektrisch leitenden Verbinden von Drähten
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps
CN114705357B (zh) * 2022-04-19 2024-03-26 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056192A (en) * 1957-12-30 1962-10-02 Sonobond Corp Vibratory welding process and apparatus
US3017792A (en) * 1958-07-08 1962-01-23 Aeroprojects Inc Vibratory device
BE621898A (enExample) * 1961-08-30 1900-01-01
US3158928A (en) * 1962-03-30 1964-12-01 Aeroprojects Inc Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US3153850A (en) * 1962-07-18 1964-10-27 Daniel C Worlton Method and device for controlling ultrasonic welding apparatus
US3341935A (en) * 1964-04-23 1967-09-19 Cavitron Ultrasonics Inc Energy storage in high frequency vibratory devices

Also Published As

Publication number Publication date
US3458921A (en) 1969-08-05
SE333413B (enExample) 1971-03-15
BE684350A (enExample) 1967-01-03
NL6610145A (enExample) 1967-01-20
DE1577011A1 (de) 1969-07-10
GB1153002A (en) 1969-05-21

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