DE1577011A1 - Verfahren zur gegenseitigen Bindung kleiner Teile aneinander sowie Bindungsgeraet zur Durchfuehrung dieses Verfahrens - Google Patents

Verfahren zur gegenseitigen Bindung kleiner Teile aneinander sowie Bindungsgeraet zur Durchfuehrung dieses Verfahrens

Info

Publication number
DE1577011A1
DE1577011A1 DE19661577011 DE1577011A DE1577011A1 DE 1577011 A1 DE1577011 A1 DE 1577011A1 DE 19661577011 DE19661577011 DE 19661577011 DE 1577011 A DE1577011 A DE 1577011A DE 1577011 A1 DE1577011 A1 DE 1577011A1
Authority
DE
Germany
Prior art keywords
binding
bond
pulse duration
pulse
binding device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19661577011
Other languages
German (de)
English (en)
Inventor
Bernalillo Albuquerque
Frank Christensen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE1577011A1 publication Critical patent/DE1577011A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
DE19661577011 1965-07-19 1966-07-18 Verfahren zur gegenseitigen Bindung kleiner Teile aneinander sowie Bindungsgeraet zur Durchfuehrung dieses Verfahrens Pending DE1577011A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47299965 US3458921A (en) 1965-07-19 1965-07-19 Short pulse vibratory bonding

Publications (1)

Publication Number Publication Date
DE1577011A1 true DE1577011A1 (de) 1969-07-10

Family

ID=23877760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19661577011 Pending DE1577011A1 (de) 1965-07-19 1966-07-18 Verfahren zur gegenseitigen Bindung kleiner Teile aneinander sowie Bindungsgeraet zur Durchfuehrung dieses Verfahrens

Country Status (7)

Country Link
US (1) US3458921A (enExample)
BE (1) BE684350A (enExample)
DE (1) DE1577011A1 (enExample)
FR (1) FR1487050A (enExample)
GB (1) GB1153002A (enExample)
NL (1) NL6610145A (enExample)
SE (1) SE333413B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114705357A (zh) * 2022-04-19 2022-07-05 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL162580B (nl) * 1970-12-17 1980-01-15 Philips Nv Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager.
US3791028A (en) * 1971-09-17 1974-02-12 Ibm Ultrasonic bonding of cubic crystal-structure metals
US4047657A (en) * 1976-11-01 1977-09-13 Branson Ultrasonics Corporation Method and apparatus for joining metal workpieces using high frequency vibratory energy
US4352972A (en) 1980-07-09 1982-10-05 Lebedev Vladimir K Method of resistance flash butt welding
US4373653A (en) * 1981-09-10 1983-02-15 Raytheon Company Method and apparatus for ultrasonic bonding
KR20030066344A (ko) * 2002-02-01 2003-08-09 에섹 트레이딩 에스에이 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법
EP1332826A1 (de) * 2002-02-01 2003-08-06 Esec Trading S.A. Verfahren für die Bestimmung optimaler Bondparameter beim Bonden mit einem Wire Bonder
TWI229397B (en) * 2002-10-16 2005-03-11 Esec Trading Sa Method for determining optimum bond parameters when bonding with a wire bonder
DE10347984A1 (de) * 2003-10-15 2005-05-19 Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co Verfahren zum Vibrationsschweißen mit verkürtzter Ausschwingzeit
US7044356B2 (en) * 2003-12-11 2006-05-16 Texas Instruments Incorporated Roller wire brake for wire bonding machine
DE102007054626A1 (de) * 2007-11-12 2009-05-14 Hesse & Knipps Gmbh Verfahren und Vorrichtung zum Ultraschallbonden
DE102009059307A1 (de) * 2009-12-23 2011-06-30 Schunk Sonosystems GmbH, 35435 Verfahren zum elektrisch leitenden Verbinden von Drähten
US20120074206A1 (en) * 2010-09-27 2012-03-29 Kulicke And Soffa Industries, Inc. Methods of forming wire bonds for wire loops and conductive bumps

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056192A (en) * 1957-12-30 1962-10-02 Sonobond Corp Vibratory welding process and apparatus
US3017792A (en) * 1958-07-08 1962-01-23 Aeroprojects Inc Vibratory device
NL282318A (enExample) * 1961-08-30 1900-01-01
US3158928A (en) * 1962-03-30 1964-12-01 Aeroprojects Inc Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device
US3153850A (en) * 1962-07-18 1964-10-27 Daniel C Worlton Method and device for controlling ultrasonic welding apparatus
US3341935A (en) * 1964-04-23 1967-09-19 Cavitron Ultrasonics Inc Energy storage in high frequency vibratory devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114705357A (zh) * 2022-04-19 2022-07-05 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法
CN114705357B (zh) * 2022-04-19 2024-03-26 上海工业自动化仪表研究院有限公司 用于磁弹性传感器的相敏解调修正方法

Also Published As

Publication number Publication date
NL6610145A (enExample) 1967-01-20
GB1153002A (en) 1969-05-21
FR1487050A (fr) 1967-06-30
US3458921A (en) 1969-08-05
SE333413B (enExample) 1971-03-15
BE684350A (enExample) 1967-01-03

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