FR1487050A - Procédé et appareil de liaison d'éléments minuscules - Google Patents
Procédé et appareil de liaison d'éléments minusculesInfo
- Publication number
- FR1487050A FR1487050A FR69985A FR69985A FR1487050A FR 1487050 A FR1487050 A FR 1487050A FR 69985 A FR69985 A FR 69985A FR 69985 A FR69985 A FR 69985A FR 1487050 A FR1487050 A FR 1487050A
- Authority
- FR
- France
- Prior art keywords
- bonding
- pulse
- signal
- microseconds
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47299965 US3458921A (en) | 1965-07-19 | 1965-07-19 | Short pulse vibratory bonding |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1487050A true FR1487050A (fr) | 1967-06-30 |
Family
ID=23877760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR69985A Expired FR1487050A (fr) | 1965-07-19 | 1966-07-19 | Procédé et appareil de liaison d'éléments minuscules |
Country Status (7)
Country | Link |
---|---|
US (1) | US3458921A (fr) |
BE (1) | BE684350A (fr) |
DE (1) | DE1577011A1 (fr) |
FR (1) | FR1487050A (fr) |
GB (1) | GB1153002A (fr) |
NL (1) | NL6610145A (fr) |
SE (1) | SE333413B (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL162580B (nl) * | 1970-12-17 | 1980-01-15 | Philips Nv | Werkwijze voor het ultrasoonlassen van draden op het metalen oppervlak van een drager. |
US3791028A (en) * | 1971-09-17 | 1974-02-12 | Ibm | Ultrasonic bonding of cubic crystal-structure metals |
US4047657A (en) * | 1976-11-01 | 1977-09-13 | Branson Ultrasonics Corporation | Method and apparatus for joining metal workpieces using high frequency vibratory energy |
US4373653A (en) * | 1981-09-10 | 1983-02-15 | Raytheon Company | Method and apparatus for ultrasonic bonding |
KR20030066344A (ko) * | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더로 접합시에 최적의 접합 파라미터들을결정하기 위한 방법 |
EP1332826A1 (fr) * | 2002-02-01 | 2003-08-06 | Esec Trading S.A. | Méthode d'optimisation des paramètres d'un dispositif de microcâblage par ultrasons |
TWI229397B (en) * | 2002-10-16 | 2005-03-11 | Esec Trading Sa | Method for determining optimum bond parameters when bonding with a wire bonder |
DE10347984A1 (de) * | 2003-10-15 | 2005-05-19 | Branson Ultraschall Niederlassung Der Emerson Technologies Gmbh & Co | Verfahren zum Vibrationsschweißen mit verkürtzter Ausschwingzeit |
US7044356B2 (en) * | 2003-12-11 | 2006-05-16 | Texas Instruments Incorporated | Roller wire brake for wire bonding machine |
DE102007054626A1 (de) * | 2007-11-12 | 2009-05-14 | Hesse & Knipps Gmbh | Verfahren und Vorrichtung zum Ultraschallbonden |
DE102009059307A1 (de) * | 2009-12-23 | 2011-06-30 | Schunk Sonosystems GmbH, 35435 | Verfahren zum elektrisch leitenden Verbinden von Drähten |
US20120074206A1 (en) * | 2010-09-27 | 2012-03-29 | Kulicke And Soffa Industries, Inc. | Methods of forming wire bonds for wire loops and conductive bumps |
CN114705357B (zh) * | 2022-04-19 | 2024-03-26 | 上海工业自动化仪表研究院有限公司 | 用于磁弹性传感器的相敏解调修正方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3056192A (en) * | 1957-12-30 | 1962-10-02 | Sonobond Corp | Vibratory welding process and apparatus |
US3017792A (en) * | 1958-07-08 | 1962-01-23 | Aeroprojects Inc | Vibratory device |
BE621898A (fr) * | 1961-08-30 | 1900-01-01 | ||
US3158928A (en) * | 1962-03-30 | 1964-12-01 | Aeroprojects Inc | Method and means for operating a generating means coupled through a transducer to a vibratory energy work performing device |
US3153850A (en) * | 1962-07-18 | 1964-10-27 | Daniel C Worlton | Method and device for controlling ultrasonic welding apparatus |
US3341935A (en) * | 1964-04-23 | 1967-09-19 | Cavitron Ultrasonics Inc | Energy storage in high frequency vibratory devices |
-
1965
- 1965-07-19 US US47299965 patent/US3458921A/en not_active Expired - Lifetime
-
1966
- 1966-06-16 GB GB2695166A patent/GB1153002A/en not_active Expired
- 1966-07-18 SE SE981666A patent/SE333413B/xx unknown
- 1966-07-18 DE DE19661577011 patent/DE1577011A1/de active Pending
- 1966-07-19 NL NL6610145A patent/NL6610145A/xx unknown
- 1966-07-19 BE BE684350D patent/BE684350A/xx unknown
- 1966-07-19 FR FR69985A patent/FR1487050A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
SE333413B (fr) | 1971-03-15 |
NL6610145A (fr) | 1967-01-20 |
DE1577011A1 (de) | 1969-07-10 |
BE684350A (fr) | 1967-01-03 |
US3458921A (en) | 1969-08-05 |
GB1153002A (en) | 1969-05-21 |
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