FR1088007A - Perfectionnements aux dispositifs semi-conducteurs - Google Patents

Perfectionnements aux dispositifs semi-conducteurs

Info

Publication number
FR1088007A
FR1088007A FR1088007DA FR1088007A FR 1088007 A FR1088007 A FR 1088007A FR 1088007D A FR1088007D A FR 1088007DA FR 1088007 A FR1088007 A FR 1088007A
Authority
FR
France
Prior art keywords
semiconductor device
device enhancements
enhancements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Radio Corporation of America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp, Radio Corporation of America filed Critical RCA Corp
Application granted granted Critical
Publication of FR1088007A publication Critical patent/FR1088007A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cell Electrode Carriers And Collectors (AREA)
FR1088007D 1952-10-22 1953-09-19 Perfectionnements aux dispositifs semi-conducteurs Expired FR1088007A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US316171A US2759133A (en) 1952-10-22 1952-10-22 Semiconductor devices

Publications (1)

Publication Number Publication Date
FR1088007A true FR1088007A (fr) 1955-03-02

Family

ID=23227816

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1088007D Expired FR1088007A (fr) 1952-10-22 1953-09-19 Perfectionnements aux dispositifs semi-conducteurs

Country Status (5)

Country Link
US (2) US2759133A (fr)
BE (1) BE523682A (fr)
FR (1) FR1088007A (fr)
GB (1) GB749392A (fr)
NL (1) NL182212B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1090769B (de) * 1957-01-09 1960-10-13 Philips Nv Verfahren zur Herstellung von Leitfaehigkeits- oder pn-UEbergaengen in Halbleiterkoerpern nach dem Aufschmelzverfahren
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882464A (en) * 1952-12-04 1959-04-14 Raytheon Mfg Co Transistor assemblies
NL104654C (fr) * 1952-12-31 1900-01-01
US2823148A (en) * 1953-03-02 1958-02-11 Rca Corp Method for removing portions of semiconductor device electrodes
US2809332A (en) * 1953-07-29 1957-10-08 Rca Corp Power semiconductor devices
US2847335A (en) * 1953-09-15 1958-08-12 Siemens Ag Semiconductor devices and method of manufacturing them
US2850687A (en) * 1953-10-13 1958-09-02 Rca Corp Semiconductor devices
NL87784C (fr) * 1953-10-23 1958-04-15
GB805292A (en) * 1953-12-02 1958-12-03 Philco Corp Semiconductor devices
BE535032A (fr) * 1954-01-21
US2980594A (en) * 1954-06-01 1961-04-18 Rca Corp Methods of making semi-conductor devices
US3299331A (en) * 1955-05-10 1967-01-17 Texas Instruments Inc Transistor structure with heatconductive housing for cooling
US2941131A (en) * 1955-05-13 1960-06-14 Philco Corp Semiconductive apparatus
US3193737A (en) * 1955-05-18 1965-07-06 Ibm Bistable junction transistor
US2909715A (en) * 1955-05-23 1959-10-20 Texas Instruments Inc Base contacts for transistors
US2897587A (en) * 1955-05-23 1959-08-04 Philco Corp Method of fabricating semiconductor devices
US2927222A (en) * 1955-05-27 1960-03-01 Philco Corp Polarizing semiconductive apparatus
US2906932A (en) * 1955-06-13 1959-09-29 Sprague Electric Co Silicon junction diode
US2842841A (en) * 1955-06-13 1958-07-15 Philco Corp Method of soldering leads to semiconductor devices
NL101253C (fr) * 1955-09-12
US2830238A (en) * 1955-09-30 1958-04-08 Hughes Aircraft Co Heat dissipating semiconductor device
NL121810C (fr) * 1955-11-04
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device
BE562490A (fr) * 1956-03-05 1900-01-01
BE556231A (fr) * 1956-03-30
US3020635A (en) * 1956-05-31 1962-02-13 Raytheon Co Soldering methods
US2994017A (en) * 1956-09-07 1961-07-25 Int Rectifier Corp Air-cooled rectifier assembly
US2905873A (en) * 1956-09-17 1959-09-22 Rca Corp Semiconductor power devices and method of manufacture
US2984774A (en) * 1956-10-01 1961-05-16 Motorola Inc Transistor heat sink assembly
US2955242A (en) * 1956-11-27 1960-10-04 Raytheon Co Hermetically sealed power transistors
US2996800A (en) * 1956-11-28 1961-08-22 Texas Instruments Inc Method of making ohmic connections to silicon semiconductors
US2953693A (en) * 1957-02-27 1960-09-20 Westinghouse Electric Corp Semiconductor diode
US2981873A (en) * 1957-05-02 1961-04-25 Sarkes Tarzian Semiconductor device
US2915685A (en) * 1957-05-27 1959-12-01 Int Rectifier Corp Dry rectifier assembly and housing therefor
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US2963631A (en) * 1958-07-10 1960-12-06 Texas Instruments Inc Arrangement for increasing heat dissipation in semi-conductor-device
US3058041A (en) * 1958-09-12 1962-10-09 Raytheon Co Electrical cooling devices
US3130272A (en) * 1958-10-17 1964-04-21 Talk A Phone Co Intercommunication system
US3066248A (en) * 1958-12-16 1962-11-27 Sarkes Tarzian Semiconductor device
FR1209312A (fr) * 1958-12-17 1960-03-01 Hughes Aircraft Co Perfectionnements aux dispositifs semi-conducteurs du type à jonction
US3257588A (en) * 1959-04-27 1966-06-21 Rca Corp Semiconductor device enclosures
US2964431A (en) * 1959-07-28 1960-12-13 Rca Corp Jig alloying of semiconductor devices
US3110089A (en) * 1959-12-16 1963-11-12 Engelhard Ind Inc Method of bonding amalgam inserts in cavities and structure thereby produced
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
GB910063A (en) * 1960-03-09 1962-11-07 Westinghouse Electric Corp Semi-conductor devices
US3141238A (en) * 1960-11-22 1964-07-21 Jr George G Harman Method of low temperature bonding for subsequent high temperature use
US3187423A (en) * 1962-01-04 1965-06-08 Lloyd C Lantz Method of releasing solid solder from a joint
US3255394A (en) * 1962-06-15 1966-06-07 Gen Motors Corp Transistor electrode connection
US3248615A (en) * 1963-05-13 1966-04-26 Bbc Brown Boveri & Cie Semiconductor device with liquidized solder layer for compensation of expansion stresses
US3355635A (en) * 1964-05-28 1967-11-28 Rca Corp Semiconductor device assemblage having two convex tabs
US3536960A (en) * 1968-06-26 1970-10-27 Electric Regulator Corp Heat sink module
FR2052245A5 (fr) * 1969-07-31 1971-04-09 Cit Alcatel
US3839780A (en) * 1971-04-14 1974-10-08 Raytheon Co Method of intermetallic bonding
FR2150214A1 (fr) * 1971-08-20 1973-04-06 Thomson Csf
US3820153A (en) * 1972-08-28 1974-06-25 Zyrotron Ind Inc Plurality of semiconductor elements mounted on common base
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
US4788471A (en) * 1986-11-21 1988-11-29 Zenith Electronics Corporation Sealing for CRT components
JPH0547812A (ja) * 1991-08-19 1993-02-26 Mitsubishi Electric Corp 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563503A (en) * 1951-08-07 Transistor
US2563504A (en) * 1951-08-07 Semiconductor translating device
US924827A (en) * 1907-09-16 1909-06-15 Greenleaf Whittier Pickard Oscillation-receiver.
GB476375A (en) * 1936-07-16 1937-12-07 British Thomson Houston Co Ltd Improvements in and relating to methods of uniting metals
US2162487A (en) * 1936-09-28 1939-06-13 Westinghouse Electric & Mfg Co Selenium rectifier
GB492088A (en) * 1937-04-27 1938-09-14 British Thomson Houston Co Ltd Improvements in and relating to methods of joining metals
US2220961A (en) * 1937-11-06 1940-11-12 Bell Telephone Labor Inc Soldering alloy
US2646536A (en) * 1946-11-14 1953-07-21 Purdue Research Foundation Rectifier
US2629672A (en) * 1949-07-07 1953-02-24 Bell Telephone Labor Inc Method of making semiconductive translating devices
BE509110A (fr) * 1951-05-05
US2684457A (en) * 1951-09-04 1954-07-20 Gen Electric Asymmetrically conductive unit
US2639380A (en) * 1952-05-01 1953-05-19 Hollmann Hans Erich Electrical device and method of preparation
US2697052A (en) * 1953-07-24 1954-12-14 Bell Telephone Labor Inc Fabricating of semiconductor translating devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156173B (de) * 1956-07-11 1963-10-24 Bosch Gmbh Robert Leistungstransistor
DE1090769B (de) * 1957-01-09 1960-10-13 Philips Nv Verfahren zur Herstellung von Leitfaehigkeits- oder pn-UEbergaengen in Halbleiterkoerpern nach dem Aufschmelzverfahren
DE1230912B (de) * 1960-06-09 1966-12-22 Siemens Ag Verfahren zum Herstellen einer Halbleiteranordnung

Also Published As

Publication number Publication date
GB749392A (en) 1956-05-23
US2759133A (en) 1956-08-14
NL182212B (nl)
US2735050A (en) 1956-02-14
BE523682A (fr)

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