FR1210987A - Perfectionnements aux dispositifs semi-conducteurs - Google Patents

Perfectionnements aux dispositifs semi-conducteurs

Info

Publication number
FR1210987A
FR1210987A FR1210987DA FR1210987A FR 1210987 A FR1210987 A FR 1210987A FR 1210987D A FR1210987D A FR 1210987DA FR 1210987 A FR1210987 A FR 1210987A
Authority
FR
France
Prior art keywords
semiconductor device
device enhancements
enhancements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Inventor
Frank Richard Noll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Application granted granted Critical
Publication of FR1210987A publication Critical patent/FR1210987A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/125—Avoiding or suppressing excessive transient voltages or currents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Bipolar Transistors (AREA)
FR1210987D 1957-09-27 1958-09-22 Perfectionnements aux dispositifs semi-conducteurs Expired FR1210987A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US686693A US2938130A (en) 1957-09-27 1957-09-27 Semi-conductor device for heat transfer utilization

Publications (1)

Publication Number Publication Date
FR1210987A true FR1210987A (fr) 1960-03-11

Family

ID=24757337

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1210987D Expired FR1210987A (fr) 1957-09-27 1958-09-22 Perfectionnements aux dispositifs semi-conducteurs

Country Status (6)

Country Link
US (1) US2938130A (fr)
BE (1) BE571550A (fr)
CH (1) CH361867A (fr)
DE (1) DE1080693B (fr)
FR (1) FR1210987A (fr)
GB (1) GB890841A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0687383A4 (fr) * 1993-03-04 1995-10-26 Chip Coolers Inc Tata Peter D Puits thermique pour dispositifs a semi-conducteurs

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042948A (en) * 1959-05-06 1977-08-16 Texas Instruments Incorporated Integrated circuit isolation with mesas and/or insulating substrate
US3300623A (en) * 1959-05-27 1967-01-24 Automatic Elect Lab Crystal oven heating and control system
US3330941A (en) * 1960-02-12 1967-07-11 Beckman Instruments Inc Oven temperature control
US3015726A (en) * 1960-12-01 1962-01-02 Automatic Radio Mfg Co Transistorized automobile radio
US3320407A (en) * 1961-03-27 1967-05-16 Julian C Holmes Solid state temperature control
US3333086A (en) * 1961-10-05 1967-07-25 Robertshaw Controls Co Temperature control apparatus and method
US3258606A (en) * 1962-10-16 1966-06-28 Integrated circuits using thermal effects
GB1053834A (fr) * 1963-02-01
GB1027737A (en) * 1963-05-14 1966-04-27 Nat Res Dev Semiconductor diode construction
US3358152A (en) * 1963-07-22 1967-12-12 Nicholas G Alexakis Temperature compensated transistor and means for controlling
US3307049A (en) * 1963-12-20 1967-02-28 Siemens Ag Turnoff-controllable thyristor and method of its operation
US3236698A (en) * 1964-04-08 1966-02-22 Clevite Corp Semiconductive device and method of making the same
DE1230132B (de) * 1964-05-08 1966-12-08 Telefunken Patent Halbleiteranordnung mit einem auf einer metallischen Grundplatte befestigten Halbleiterkoerper
US3308271A (en) * 1964-06-08 1967-03-07 Fairchild Camera Instr Co Constant temperature environment for semiconductor circuit elements
US3393328A (en) * 1964-09-04 1968-07-16 Texas Instruments Inc Thermal coupling elements
DE1289201B (de) * 1964-11-18 1969-02-13 Danfoss As Elektronisches Festkoerperbauelement zum Schalten
US3351063A (en) * 1964-12-08 1967-11-07 Stephen F Malaker Cryosurgical probe
US3395320A (en) * 1965-08-25 1968-07-30 Bell Telephone Labor Inc Isolation technique for integrated circuit structure
US3423652A (en) * 1966-02-15 1969-01-21 Int Rectifier Corp Unijunction transistor with improved efficiency and heat transfer characteristics
US3509446A (en) * 1968-05-31 1970-04-28 Gen Electric Full-wave rectifying monolithic integrated circuit
GB1257730A (fr) * 1969-07-14 1971-12-22
BE754677A (fr) * 1969-08-11 1971-01-18 Rca Corp Circuits integres fonctionnant sur courant
US4303935A (en) * 1977-12-13 1981-12-01 Robert Bosch Gmbh Semiconductor apparatus with electrically insulated heat sink
US4449528A (en) * 1980-03-20 1984-05-22 University Of Washington Fast pulse thermal cautery probe and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048359B (fr) * 1952-07-22
CH328594A (fr) * 1954-07-03 1958-03-15 Csf Dispositif électronique comportant un élément semi-conducteur
US2864006A (en) * 1956-07-06 1958-12-09 Gen Electric Cooling structure for semiconductor devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0687383A4 (fr) * 1993-03-04 1995-10-26 Chip Coolers Inc Tata Peter D Puits thermique pour dispositifs a semi-conducteurs
EP0687383A1 (fr) * 1993-03-04 1995-12-20 CHIP COOLERS, Inc. Puits thermique pour dispositifs a semi-conducteurs

Also Published As

Publication number Publication date
BE571550A (fr)
CH361867A (de) 1962-05-15
US2938130A (en) 1960-05-24
GB890841A (en) 1962-03-07
DE1080693B (de) 1960-04-28

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