FI960247A0 - Puolijohdelaite, johon kuuluu schottky-liitos - Google Patents

Puolijohdelaite, johon kuuluu schottky-liitos

Info

Publication number
FI960247A0
FI960247A0 FI960247A FI960247A FI960247A0 FI 960247 A0 FI960247 A0 FI 960247A0 FI 960247 A FI960247 A FI 960247A FI 960247 A FI960247 A FI 960247A FI 960247 A0 FI960247 A0 FI 960247A0
Authority
FI
Finland
Prior art keywords
semiconductor device
schottky connection
schottky
connection
semiconductor
Prior art date
Application number
FI960247A
Other languages
English (en)
Swedish (sv)
Other versions
FI960247A (fi
Inventor
Takashi Murukawa
Original Assignee
Murata Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of FI960247A0 publication Critical patent/FI960247A0/fi
Publication of FI960247A publication Critical patent/FI960247A/fi

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/66196Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices with an active layer made of a group 13/15 material
    • H01L29/66204Diodes
    • H01L29/66212Schottky diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H01L21/28581Deposition of Schottky electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/47Schottky barrier electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66848Unipolar field-effect transistors with a Schottky gate, i.e. MESFET
    • H01L29/66856Unipolar field-effect transistors with a Schottky gate, i.e. MESFET with an active layer made of a group 13/15 material
    • H01L29/66863Lateral single gate transistors
    • H01L29/66871Processes wherein the final gate is made after the formation of the source and drain regions in the active layer, e.g. dummy-gate processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861Diodes
    • H01L29/872Schottky diodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)
FI960247A 1995-01-18 1996-01-18 Puolijohdelaite, johon kuuluu schottky-liitos FI960247A (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7005869A JP3058040B2 (ja) 1995-01-18 1995-01-18 半導体装置

Publications (2)

Publication Number Publication Date
FI960247A0 true FI960247A0 (fi) 1996-01-18
FI960247A FI960247A (fi) 1996-07-19

Family

ID=11622952

Family Applications (1)

Application Number Title Priority Date Filing Date
FI960247A FI960247A (fi) 1995-01-18 1996-01-18 Puolijohdelaite, johon kuuluu schottky-liitos

Country Status (4)

Country Link
EP (1) EP0723300A3 (fi)
JP (1) JP3058040B2 (fi)
KR (1) KR100198309B1 (fi)
FI (1) FI960247A (fi)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0964381A (ja) * 1995-08-25 1997-03-07 Murata Mfg Co Ltd ショットキーバリアダイオード
JP4751498B2 (ja) * 2000-03-30 2011-08-17 富士通株式会社 半導体三端子装置
JP4606552B2 (ja) * 2000-06-27 2011-01-05 富士通株式会社 半導体装置
KR100402784B1 (ko) * 2000-12-22 2003-10-22 한국전자통신연구원 저온 측정용 갈륨비소 반도체 소자 및 그 제조방법
JP3951743B2 (ja) 2002-02-28 2007-08-01 松下電器産業株式会社 半導体装置およびその製造方法
US8193602B2 (en) * 2010-04-20 2012-06-05 Texas Instruments Incorporated Schottky diode with control gate for optimization of the on state resistance, the reverse leakage, and the reverse breakdown
JP6032427B2 (ja) * 2013-02-27 2016-11-30 セイコーエプソン株式会社 光伝導アンテナ、カメラ、イメージング装置、および計測装置
DE102015101966B4 (de) * 2015-02-11 2021-07-08 Infineon Technologies Austria Ag Verfahren zum Herstellen eines Halbleiterbauelements mit Schottkykontakt und Halbleiterbauelement

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636170A (en) * 1979-08-31 1981-04-09 Fujitsu Ltd Manufacture of field-effect semiconductor device
EP0642175B1 (en) * 1993-09-07 2004-04-28 Murata Manufacturing Co., Ltd. Semiconductor element with Schottky electrode and process for producing the same

Also Published As

Publication number Publication date
EP0723300A3 (en) 1996-11-20
KR100198309B1 (ko) 1999-06-15
FI960247A (fi) 1996-07-19
EP0723300A2 (en) 1996-07-24
JPH08195403A (ja) 1996-07-30
JP3058040B2 (ja) 2000-07-04
KR960030447A (ko) 1996-08-17

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