FI950970A - Renkaan muotoisia piirikomponentteja, jotka on kytketty piirilevyn läpimenoreikään - Google Patents
Renkaan muotoisia piirikomponentteja, jotka on kytketty piirilevyn läpimenoreikään Download PDFInfo
- Publication number
- FI950970A FI950970A FI950970A FI950970A FI950970A FI 950970 A FI950970 A FI 950970A FI 950970 A FI950970 A FI 950970A FI 950970 A FI950970 A FI 950970A FI 950970 A FI950970 A FI 950970A
- Authority
- FI
- Finland
- Prior art keywords
- circuit component
- hole
- ring
- assembly
- components connected
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/044,301 US5347258A (en) | 1993-04-07 | 1993-04-07 | Annular resistor coupled with printed circuit board through-hole |
US08/220,540 US5603847A (en) | 1993-04-07 | 1994-04-05 | Annular circuit components coupled with printed circuit board through-hole |
PCT/US1994/003832 WO1994023554A1 (en) | 1993-04-07 | 1994-04-07 | Annular circuit components coupled with printed circuit board through-hole |
Publications (2)
Publication Number | Publication Date |
---|---|
FI950970A true FI950970A (fi) | 1995-03-02 |
FI950970A0 FI950970A0 (fi) | 1995-03-02 |
Family
ID=26721377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI950970A FI950970A0 (fi) | 1993-04-07 | 1995-03-02 | Renkaan muotoisia piirikomponentteja, jotka on kytketty piirilevyn läpimenoreikään |
Country Status (11)
Country | Link |
---|---|
US (2) | US5603847A (fi) |
EP (1) | EP0647389B1 (fi) |
CN (1) | CN1106790C (fi) |
AT (1) | ATE144675T1 (fi) |
AU (1) | AU6556394A (fi) |
DE (1) | DE69400795T2 (fi) |
DK (1) | DK0647389T3 (fi) |
ES (1) | ES2096466T3 (fi) |
FI (1) | FI950970A0 (fi) |
NO (1) | NO314240B1 (fi) |
WO (1) | WO1994023554A1 (fi) |
Families Citing this family (109)
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US6232564B1 (en) * | 1998-10-09 | 2001-05-15 | International Business Machines Corporation | Printed wiring board wireability enhancement |
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US6493861B1 (en) * | 1999-12-28 | 2002-12-10 | Intel Corporation | Interconnected series of plated through hole vias and method of fabrication therefor |
US6351391B1 (en) | 2000-05-15 | 2002-02-26 | International Business Machines Corporation | Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices |
US6278356B1 (en) * | 2000-05-17 | 2001-08-21 | Compeq Manufacturing Company Limited | Flat, built-in resistors and capacitors for a printed circuit board |
US6495053B1 (en) * | 2000-08-30 | 2002-12-17 | Visteon Global Tech, Inc. | Electrical circuit board and a method for making the same |
US6798666B1 (en) * | 2000-12-29 | 2004-09-28 | Ncr Corporation | Introducing loss in a power bus to reduce EMI and electrical noise |
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US8790520B2 (en) | 2011-08-31 | 2014-07-29 | Lexmark International, Inc. | Die press process for manufacturing a Z-directed component for a printed circuit board |
US8822840B2 (en) | 2012-03-29 | 2014-09-02 | Lexmark International, Inc. | Z-directed printed circuit board components having conductive channels for controlling transmission line impedance |
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US8912452B2 (en) | 2012-03-29 | 2014-12-16 | Lexmark International, Inc. | Z-directed printed circuit board components having different dielectric regions |
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US10014843B2 (en) * | 2013-08-08 | 2018-07-03 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Multilayer electronic structures with embedded filters |
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CN106299567A (zh) * | 2016-10-31 | 2017-01-04 | 成都八九九科技有限公司 | 一种复合式环行器 |
CN108575049B (zh) * | 2017-03-08 | 2021-03-23 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板及其制作方法 |
TWI632477B (zh) * | 2017-05-26 | 2018-08-11 | 瑞傳科技股份有限公司 | 電路板零件佈設判定方法 |
US10834828B2 (en) | 2018-01-26 | 2020-11-10 | International Business Machines Corporation | Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology |
US10785867B2 (en) * | 2018-09-25 | 2020-09-22 | International Business Machines Corporation | Automatic determination of power plane shape in printed circuit board |
US10834830B2 (en) | 2019-02-13 | 2020-11-10 | International Business Machines Corporation | Creating in-via routing with a light pipe |
TWI706705B (zh) * | 2019-06-21 | 2020-10-01 | 唐虞企業股份有限公司 | 電路板及其製造方法 |
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US4808967A (en) * | 1985-05-29 | 1989-02-28 | Ohmega Electronics | Circuit board material |
US4735676A (en) * | 1986-01-14 | 1988-04-05 | Asahi Chemical Research Laboratory Co., Ltd. | Method for forming electric circuits on a base board |
JPH0734519B2 (ja) * | 1986-10-06 | 1995-04-12 | 松下電器産業株式会社 | 電子回路基板の製造方法 |
US4892776A (en) * | 1987-09-02 | 1990-01-09 | Ohmega Electronics, Inc. | Circuit board material and electroplating bath for the production thereof |
US4916260A (en) * | 1988-10-11 | 1990-04-10 | International Business Machines Corporation | Circuit member for use in multilayered printed circuit board assembly and method of making same |
US4870746A (en) * | 1988-11-07 | 1989-10-03 | Litton Systems, Inc. | Method of making a multilayer printed circuit board having screened-on resistors |
JPH02150090A (ja) * | 1988-11-30 | 1990-06-08 | Cmk Corp | プリント配線板の製造方法 |
JP2676112B2 (ja) * | 1989-05-01 | 1997-11-12 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
US5039570A (en) * | 1990-04-12 | 1991-08-13 | Planar Circuit Technologies, Inc. | Resistive laminate for printed circuit boards, method and apparatus for forming the same |
NO175394C (no) * | 1991-07-01 | 1994-10-05 | Abb En As | Anordning ved måling av ström |
-
1994
- 1994-04-05 US US08/220,540 patent/US5603847A/en not_active Expired - Lifetime
- 1994-04-07 ES ES94913381T patent/ES2096466T3/es not_active Expired - Lifetime
- 1994-04-07 DE DE69400795T patent/DE69400795T2/de not_active Expired - Lifetime
- 1994-04-07 DK DK94913381.3T patent/DK0647389T3/da active
- 1994-04-07 AT AT94913381T patent/ATE144675T1/de not_active IP Right Cessation
- 1994-04-07 EP EP94913381A patent/EP0647389B1/en not_active Expired - Lifetime
- 1994-04-07 CN CN94190360.5A patent/CN1106790C/zh not_active Expired - Lifetime
- 1994-04-07 WO PCT/US1994/003832 patent/WO1994023554A1/en active IP Right Grant
- 1994-04-07 AU AU65563/94A patent/AU6556394A/en not_active Abandoned
-
1995
- 1995-03-02 FI FI950970A patent/FI950970A0/fi not_active Application Discontinuation
- 1995-03-10 NO NO19950933A patent/NO314240B1/no not_active IP Right Cessation
-
1996
- 1996-07-08 US US08/677,610 patent/US5708569A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DK0647389T3 (da) | 1997-04-01 |
EP0647389B1 (en) | 1996-10-23 |
EP0647389A1 (en) | 1995-04-12 |
DE69400795T2 (de) | 1997-04-10 |
DE69400795D1 (de) | 1996-11-28 |
ES2096466T3 (es) | 1997-03-01 |
US5708569A (en) | 1998-01-13 |
AU6556394A (en) | 1994-10-24 |
CN1106790C (zh) | 2003-04-23 |
WO1994023554A1 (en) | 1994-10-13 |
NO950933L (no) | 1995-03-10 |
NO950933D0 (no) | 1995-03-10 |
ATE144675T1 (de) | 1996-11-15 |
US5603847A (en) | 1997-02-18 |
NO314240B1 (no) | 2003-02-17 |
CN1110496A (zh) | 1995-10-18 |
FI950970A0 (fi) | 1995-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FA | Application withdrawn |