WO2001016876A3 - Chipkarte und verfahren zur herstellung einer chipkarte - Google Patents

Chipkarte und verfahren zur herstellung einer chipkarte Download PDF

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Publication number
WO2001016876A3
WO2001016876A3 PCT/DE2000/002903 DE0002903W WO0116876A3 WO 2001016876 A3 WO2001016876 A3 WO 2001016876A3 DE 0002903 W DE0002903 W DE 0002903W WO 0116876 A3 WO0116876 A3 WO 0116876A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip card
electronic component
producing
card
electrically connected
Prior art date
Application number
PCT/DE2000/002903
Other languages
English (en)
French (fr)
Other versions
WO2001016876A2 (de
Inventor
Thies Janczek
Ruediger Mentzer
Carsten Senge
Karl-Heinz Koenig
Original Assignee
Orga Kartensysteme Gmbh
Thies Janczek
Ruediger Mentzer
Carsten Senge
Koenig Karl Heinz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme Gmbh, Thies Janczek, Ruediger Mentzer, Carsten Senge, Koenig Karl Heinz filed Critical Orga Kartensysteme Gmbh
Priority to AU77703/00A priority Critical patent/AU7770300A/en
Priority to EP00967540A priority patent/EP1221134A2/de
Publication of WO2001016876A2 publication Critical patent/WO2001016876A2/de
Publication of WO2001016876A3 publication Critical patent/WO2001016876A3/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10719—Land grid array [LGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Die Erfindung betrifft eine Chipkarte mit einem Kartenkörper bestehend aus: mindestens einem eine Leiterbahnstruktur aufweisenden ersten elektronischen Bauelement und einem zweiten elektronischen Bauelement, wobei die Bauelemente an jeweiligen Kontaktanschlüssen derselben elektrisch miteinander verbunden sind, wobei zumindest die Kontaktflächen (3, 11) eines elektronischen Bauelements (1) aus einem ein thermoplastisches Basismaterial mit eingeschlossenen Metallpartikeln aufweisenden Leiterwerkstoff gebildet sind.
PCT/DE2000/002903 1999-09-01 2000-08-29 Chipkarte und verfahren zur herstellung einer chipkarte WO2001016876A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU77703/00A AU7770300A (en) 1999-09-01 2000-08-29 Chip card and a method for producing a chip card
EP00967540A EP1221134A2 (de) 1999-09-01 2000-08-29 Chipkarte und verfahren zur herstellung einer chipkarte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999141637 DE19941637A1 (de) 1999-09-01 1999-09-01 Chipkarte und Verfahren zur Herstellung einer Chipkarte
DE19941637.0 1999-09-01

Publications (2)

Publication Number Publication Date
WO2001016876A2 WO2001016876A2 (de) 2001-03-08
WO2001016876A3 true WO2001016876A3 (de) 2001-05-31

Family

ID=7920423

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2000/002903 WO2001016876A2 (de) 1999-09-01 2000-08-29 Chipkarte und verfahren zur herstellung einer chipkarte

Country Status (4)

Country Link
EP (1) EP1221134A2 (de)
AU (1) AU7770300A (de)
DE (1) DE19941637A1 (de)
WO (1) WO2001016876A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706406B1 (en) 1996-11-13 2004-03-16 Fern Investments Limited Composite steel structural plastic sandwich plate systems
DE10207001A1 (de) * 2002-02-19 2003-09-04 Orga Kartensysteme Gmbh Chipkarte
EP2034429A1 (de) * 2007-09-05 2009-03-11 Assa Abloy AB Herstellungsverfahren für eine Karte und mit diesem Verfahren hergestellte Karte
EP2618292A1 (de) 2012-01-17 2013-07-24 Assa Abloy Ab Doppelschnittstellenkarte mit Metalleinsatzverbindung
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740606A (en) * 1995-11-03 1998-04-21 Schlumberger Industries Method of manufacturing a set of electronic modules for electronic memory cards
FR2756955A1 (fr) * 1996-12-11 1998-06-12 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
EP0930651A1 (de) * 1998-01-13 1999-07-21 SCHLUMBERGER Systèmes Verfahren zum Verbinden von Leiterpodesten einer integrierten Schaltungskomponente mit Anschlussstellen eines Plastiksubstrats mittels eines Flip-Chip-Verfahrens
WO1999046728A1 (fr) * 1998-03-09 1999-09-16 Gemplus Procede de fabrication de cartes sans contact

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4416697A1 (de) * 1994-05-11 1995-11-16 Giesecke & Devrient Gmbh Datenträger mit integriertem Schaltkreis
DE4443980C2 (de) * 1994-12-11 1997-07-17 Angewandte Digital Elektronik Verfahren zur Herstellung von Chipkarten und Chipkarte hergestellt nach diesem Verfahren
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
DE19633938A1 (de) * 1996-08-22 1998-02-26 Pav Card Gmbh Chipkarte und Verfahren zum Herstellen einer Chipkarte
DE19632814A1 (de) * 1996-08-14 1998-02-19 Siemens Ag Kombikarte und Verfahren zu ihrer Herstellung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740606A (en) * 1995-11-03 1998-04-21 Schlumberger Industries Method of manufacturing a set of electronic modules for electronic memory cards
FR2756955A1 (fr) * 1996-12-11 1998-06-12 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
EP0930651A1 (de) * 1998-01-13 1999-07-21 SCHLUMBERGER Systèmes Verfahren zum Verbinden von Leiterpodesten einer integrierten Schaltungskomponente mit Anschlussstellen eines Plastiksubstrats mittels eines Flip-Chip-Verfahrens
WO1999046728A1 (fr) * 1998-03-09 1999-09-16 Gemplus Procede de fabrication de cartes sans contact

Also Published As

Publication number Publication date
DE19941637A1 (de) 2001-03-08
EP1221134A2 (de) 2002-07-10
AU7770300A (en) 2001-03-26
WO2001016876A2 (de) 2001-03-08

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