FI925207A - En med ett illuminerande membran foersedd brytare med reducerad storlekoch foerbaettrade illumineringsegenskaper - Google Patents

En med ett illuminerande membran foersedd brytare med reducerad storlekoch foerbaettrade illumineringsegenskaper Download PDF

Info

Publication number
FI925207A
FI925207A FI925207A FI925207A FI925207A FI 925207 A FI925207 A FI 925207A FI 925207 A FI925207 A FI 925207A FI 925207 A FI925207 A FI 925207A FI 925207 A FI925207 A FI 925207A
Authority
FI
Finland
Prior art keywords
med
storlekoch
reducerad
illumineringsegenskaper
illuminerande
Prior art date
Application number
FI925207A
Other languages
English (en)
Other versions
FI108683B (fi
FI925207A0 (fi
Inventor
Masahiro Kaizu
Atsuhiro Horii
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of FI925207A0 publication Critical patent/FI925207A0/fi
Publication of FI925207A publication Critical patent/FI925207A/fi
Application granted granted Critical
Publication of FI108683B publication Critical patent/FI108683B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2213/00—Venting
    • H01H2213/01—Venting with internal pressure of other switch sites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/002—Legends replaceable; adaptable
    • H01H2219/014—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/036—Light emitting elements
    • H01H2219/04—Attachments; Connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H01H2219/056—Diffuser; Uneven surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H01H2219/06—Reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2219/00—Legends
    • H01H2219/054—Optical elements
    • H01H2219/062—Light conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2223/00—Casings
    • H01H2223/002—Casings sealed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2231/00—Applications
    • H01H2231/05—Card, e.g. credit card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Push-Button Switches (AREA)
FI925207A 1992-01-22 1992-11-17 Valoilluminaatiokalvokytkin FI108683B (fi)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP950892 1992-01-22
JP950892 1992-01-22
JP1135392 1992-01-24
JP1135392 1992-01-24
JP2415092 1992-02-10
JP2415092 1992-02-10
JP4152492A JPH05290669A (ja) 1992-01-22 1992-06-11 照光スイッチ
JP15249292 1992-06-11

Publications (3)

Publication Number Publication Date
FI925207A0 FI925207A0 (fi) 1992-11-17
FI925207A true FI925207A (fi) 1993-07-23
FI108683B FI108683B (fi) 2002-02-28

Family

ID=27455195

Family Applications (1)

Application Number Title Priority Date Filing Date
FI925207A FI108683B (fi) 1992-01-22 1992-11-17 Valoilluminaatiokalvokytkin

Country Status (5)

Country Link
US (2) US5471023A (fi)
EP (1) EP0552497B1 (fi)
JP (1) JPH05290669A (fi)
DE (1) DE69222623T2 (fi)
FI (1) FI108683B (fi)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2723454B1 (fr) * 1994-08-03 1997-01-03 Sagem Clavier plat de saisie de donnees.
US5579900A (en) * 1995-06-26 1996-12-03 Chrysler Corporation Instrument cluster assembly and switch actuator assembly therefor
JPH09115376A (ja) * 1995-10-23 1997-05-02 Tokai Rika Co Ltd 車両用空調機の操作装置
US5747756A (en) * 1996-09-10 1998-05-05 Gm Nameplate, Inc. Electroluminescent backlit keypad
US5977901A (en) * 1996-12-09 1999-11-02 Sony Corporation Remote control unit with backlit function indicator
US5826708A (en) * 1997-01-29 1998-10-27 Invotronics Manufacturing Backlighted dome switch assembly
US6062595A (en) * 1998-04-24 2000-05-16 General Motors Corporation Air bag module cover having backlighted redundant control switches
JP2000066115A (ja) * 1998-08-21 2000-03-03 Fuji Photo Optical Co Ltd 内視鏡用光源装置
JP3717675B2 (ja) * 1998-08-21 2005-11-16 フジノン株式会社 内視鏡用光源装置
US5941372A (en) * 1998-11-12 1999-08-24 Dresser Industries, Inc. Push button switching system and method
US6046417A (en) * 1999-01-08 2000-04-04 M.P. Menze Research & Development, Inc. Membrane supported and actuated switching mechanism
EP1059678A2 (en) * 1999-06-09 2000-12-13 Sanyo Electric Co., Ltd. Hybrid integrated circuit device
JP4190095B2 (ja) * 1999-07-29 2008-12-03 三洋電機株式会社 混成集積回路装置
US6429853B1 (en) * 2000-03-20 2002-08-06 Shin Jiuh Corp. Illumination structure for keyboards
KR20010100868A (ko) * 2000-04-06 2001-11-14 이주하라 요죠우 광기록 헤드와 그 조립 방법
US6491456B2 (en) * 2000-06-23 2002-12-10 Darfon Electronics Corp. Keyboard thin film circuit board with trenches to release air from hollow rubber domes
US7184024B2 (en) * 2000-06-30 2007-02-27 Nokia Corporation Method and apparatus for mapping an input location with a displayed functional representation
JP3906653B2 (ja) 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP4461616B2 (ja) 2000-12-14 2010-05-12 ソニー株式会社 素子の転写方法、素子保持基板の形成方法、及び素子保持基板
JP4649745B2 (ja) 2001-02-01 2011-03-16 ソニー株式会社 発光素子の転写方法
US6872635B2 (en) 2001-04-11 2005-03-29 Sony Corporation Device transferring method, and device arraying method and image display unit fabricating method using the same
JP2003045901A (ja) 2001-08-01 2003-02-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
US6633030B2 (en) * 2001-08-31 2003-10-14 Fiarchild Semiconductor Surface mountable optocoupler package
JP2003077940A (ja) 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
DE10155906B4 (de) * 2001-11-14 2018-05-24 Marquardt Gmbh Beleuchtbares Betätigungsorgan
US7361860B2 (en) * 2001-11-20 2008-04-22 Touchsensor Technologies, Llc Integrated touch sensor and light apparatus
US6765158B1 (en) * 2003-05-08 2004-07-20 Lear Corporation Low profile switch with flat wire harness
JP4058764B2 (ja) * 2003-06-26 2008-03-12 住友電気工業株式会社 通信モジュール
US7071433B2 (en) * 2003-11-14 2006-07-04 Ark-Les Corporation Illuminated membrane switch
US7128438B2 (en) * 2004-02-05 2006-10-31 Agilight, Inc. Light display structures
DE102004009284A1 (de) * 2004-02-26 2005-09-15 Osram Opto Semiconductors Gmbh Leuchtdioden-Anordnung für eine Hochleistungs-Leuchtdiode und Verfahren zur Herstellung einer Leuchtdioden-Anordnung
US20050247865A1 (en) * 2004-05-06 2005-11-10 Takach Eugene J Status indicator for a controller
JP4047320B2 (ja) * 2004-09-29 2008-02-13 キヤノン株式会社 電子機器
US20080013021A1 (en) * 2004-12-10 2008-01-17 Gugliotta Eleni E Cellular telephone and personal viewing mirror combination
ES2308358T3 (es) 2005-05-19 2008-12-01 Samsung Electronics Co., Ltd. Teclado y conjunto de teclado.
US7394030B2 (en) 2005-06-02 2008-07-01 Palm, Inc. Small form-factor keyboard using keys with offset peaks and pitch variations
US7275836B2 (en) 2005-08-13 2007-10-02 Palm, Inc. Lighting and usability features for key structures and keypads on computing devices
JP4816910B2 (ja) * 2006-01-27 2011-11-16 パナソニック電工株式会社 スイッチ装置
KR100649482B1 (ko) * 2006-05-15 2006-11-28 (주)아토콘 발광 키패드
JP4898323B2 (ja) * 2006-06-30 2012-03-14 ポリマテック株式会社 キーシートおよび押釦スイッチ
KR100810243B1 (ko) * 2006-08-08 2008-03-06 삼성전자주식회사 휴대 단말기의 키패드 제조방법 및 그 키패드
US8989822B2 (en) 2006-09-08 2015-03-24 Qualcomm Incorporated Keypad assembly for use on a contoured surface of a mobile computing device
EP2093783A1 (en) * 2006-11-22 2009-08-26 Alps Electric Co., Ltd. Illuminating device
CN200993332Y (zh) * 2006-12-31 2007-12-19 比亚迪精密制造有限公司 一种导光板和双色导光按键板
JP2008227176A (ja) * 2007-03-13 2008-09-25 Sharp Corp 発光装置およびその製造方法
JP5023814B2 (ja) * 2007-05-31 2012-09-12 日本精機株式会社 表示装置
US20090045986A1 (en) * 2007-08-14 2009-02-19 Sony Ericsson Mobile Communications Ab Illuminated keyboard and light guide for graphic symbols and method
EP2048781B1 (en) * 2007-10-08 2018-06-13 Whirlpool Corporation Touch switch for electrical appliances and electrical appliance provided with such switch
EP2048779B1 (en) * 2007-10-08 2012-02-29 Whirlpool Corporation Capacitive touch switch and domestic appliance provided with such switch
CN101577185B (zh) * 2008-05-09 2013-02-20 深圳富泰宏精密工业有限公司 按键面板结构
JP5473535B2 (ja) * 2009-10-28 2014-04-16 三菱電機株式会社 光源装置
US8315058B2 (en) * 2010-09-14 2012-11-20 Rosemount Inc. Capacitive touch interface assembly
EP2565591B1 (de) * 2011-08-29 2014-06-18 Thomas Brehmer brehmermechatronics Grundkörper für kapazitiven Schalter
US9908182B2 (en) 2012-01-30 2018-03-06 Black & Decker Inc. Remote programming of a power tool
WO2014110396A1 (en) * 2013-01-10 2014-07-17 Molex Incorporated Led assembly
US10011006B2 (en) 2013-08-08 2018-07-03 Black & Decker Inc. Fastener setting algorithm for drill driver
DE102013018989A1 (de) 2013-11-13 2015-05-13 Valeo Schalter Und Sensoren Gmbh Berührungssensitiver Schalter für ein Kraftfahrzeug und Kraftfahrzeug
US10216285B2 (en) * 2015-02-02 2019-02-26 Microsoft Technology Licensing, Llc Backlit illumination of electronics
JP2017157593A (ja) * 2016-02-29 2017-09-07 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード、発光ダイオードの製造方法、発光ダイオード表示装置及び発光ダイオード表示装置の製造方法
US10795452B2 (en) 2018-02-07 2020-10-06 Microsoft Technology Licensing, Llc Multi-stage cure bare die light emitting diode

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2607873A (en) * 1950-02-27 1952-08-19 Tappan Stove Co Indicator for electric cooking ranges
CH607854A5 (en) * 1977-02-04 1978-11-30 Europ Handelsges Anst Keyboard for inputting data into an electric device
CH619333A5 (en) * 1977-11-01 1980-09-15 Faselec Ag Process for covering a flat component with a polymer
JPS5686723U (fi) * 1979-12-07 1981-07-11
FR2504721A1 (fr) * 1981-04-22 1982-10-29 Telecomm El Aeronaut Maritime Dispositif formant panneau pour clavier et/ou touches individuelles ou boutons-poussoirs associes
GB2116777B (en) * 1982-03-03 1985-07-17 Casio Computer Co Ltd Sheet-like compact electronic equipment
AT374961B (de) * 1982-05-12 1984-06-25 Hans Gnad Ges M B H Elektrisches schalt- und frontplattenelement
US4531034A (en) * 1983-03-24 1985-07-23 Nitsuko Limited Key switch devices with indicator lamp means
US4460810A (en) * 1983-06-20 1984-07-17 Amp Incorporated Keyboard switch having integral bezel
JPS6089228A (ja) * 1983-10-19 1985-05-20 Matsushita Electric Ind Co Ltd キ−ボ−ド
FR2562713B1 (fr) * 1984-04-06 1988-03-04 Ciapem Ensemble de commande a clavier souple a lumieres de rappel, et appareil comportant un tel ensemble
JPS611066A (ja) * 1984-06-13 1986-01-07 Stanley Electric Co Ltd プリント基板に装着されたｌｅｄチツプのモ−ルド方法
US4636593A (en) * 1985-03-13 1987-01-13 Motorola Inc. Light conducting, elastomeric membrane keypad
FR2592221B1 (fr) * 1985-12-20 1988-02-12 Radiotechnique Compelec Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique
US4638131A (en) * 1986-01-15 1987-01-20 General Motors Corporation Steering wheel pad keyboard switch assembly
US4774434A (en) * 1986-08-13 1988-09-27 Innovative Products, Inc. Lighted display including led's mounted on a flexible circuit board
DE3737861A1 (de) * 1987-11-07 1989-05-18 Mueller Werner Dipl Wirtsch In Elektronisches leuchtelement mit optimierter lichtausbeute, verfahren zu seiner herstellung
JPH0828148B2 (ja) * 1987-11-19 1996-03-21 富士通株式会社 キーボードの構造
JPH01174820U (fi) * 1988-05-30 1989-12-12
DE3831314A1 (de) * 1988-09-15 1990-03-29 Hagenuk Telecom Gmbh Abdeckmatte fuer schaltungstraeger
DE8911792U1 (de) * 1989-10-04 1989-11-30 Peiker, Andreas, Dipl.-Ing., 61381 Friedrichsdorf Folientaster
JPH0428269A (ja) * 1990-05-23 1992-01-30 Fujikura Ltd Ｌｅｄベアチップの実装構造
US5294762A (en) * 1991-09-10 1994-03-15 Fujikura Ltd. Click-action membrane switch unit

Also Published As

Publication number Publication date
FI108683B (fi) 2002-02-28
DE69222623T2 (de) 1998-02-05
EP0552497B1 (en) 1997-10-08
FI925207A0 (fi) 1992-11-17
JPH05290669A (ja) 1993-11-05
EP0552497A2 (en) 1993-07-28
DE69222623D1 (de) 1997-11-13
EP0552497A3 (en) 1994-06-01
US5471023A (en) 1995-11-28
US5607048A (en) 1997-03-04

Similar Documents

Publication Publication Date Title
FI925207A0 (fi) En med ett illuminerande membran foersedd brytare med reducerad storlekoch foerbaettrade illumineringsegenskaper
FI934206A0 (fi) Arkitektur foer ett traodloest telekommunikationssystem
FI930749A0 (fi) Flyttbar testanordning foer ett mobilkommunikationssystem
FI925381A0 (fi) Signaleringsanordningar i ett centralsystem foer cellulaer mobiltelefoni
FI933549A0 (fi) Lyssnande kontrollkanal i ett cellulaert mobilradiotelefonsystem
FI935645A (fi) Drivsystem foer ett fartyg
FI934643A (fi) Faestningsanordning foer hopsaettning av ett hoelje
FI98U1 (fi) Foer ett siloliknande utrymme avsedd fraon ovansidan arbetande torvavlastare
FI933310A0 (fi) Frekvensinstaellninssystem foer ett ota-c-par
FI924956A0 (fi) Multiplexerat elektrohydrauliskt kontrollsystem foer anvaendning i ett submarint produktionssystem
FI933419A (fi) Anordning foer kontinuerlig omformning av ett metallroer
FI932248A (fi) Hepatit b-vaccinkomposition innehaollande ett gallsyrasalt
FI921361A (fi) Lagerhus foer ett flerradigt rullager
FI89570B (fi) Axelkonstruktion foer ett nyttofordon
FI935632A0 (fi) Foerfarande foer framstaellning av ett organopolysiloxanharts
FI934190A0 (fi) Elkopplingsfodral med foerbaettrad insaettning av ett kopplingsstycke
FI924361A (fi) Identifikationsbaermedel foer ett tillslutningssystem
FI923322A (fi) Foerfarande foer att omroera avfallsvatten i ett avloppspumpverk
FI922501A (fi) Vattenhaltig vaetskeformig tvaettmedelskomposition innehaollande ett polymert foertjockningsmedel
FI925290A0 (fi) Kommunikationssystem av ett modulaert datasystem
FI521U1 (fi) Skyddskonstruktion foer ett elektronikkort
FI568U1 (fi) Lysgranatsanordning foer ett gevaer
FI920385A (fi) Faestanordning foer ett handtag
FI924409A (fi) Bottenkonstruktion foer ett musikinstrument
FI258U1 (fi) Naetanslutningsbart eluppvaermningssystem foer innerutrymmet i ett fordon