FI20135618A - Parannettu paineanturi - Google Patents
Parannettu paineanturi Download PDFInfo
- Publication number
- FI20135618A FI20135618A FI20135618A FI20135618A FI20135618A FI 20135618 A FI20135618 A FI 20135618A FI 20135618 A FI20135618 A FI 20135618A FI 20135618 A FI20135618 A FI 20135618A FI 20135618 A FI20135618 A FI 20135618A
- Authority
- FI
- Finland
- Prior art keywords
- pressure sensor
- improved pressure
- improved
- sensor
- pressure
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
- G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
- G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
- G01L7/082—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type construction or mounting of diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0672—Leakage or rupture protection or detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/12—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance, i.e. electric circuits therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0027—Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
- G01L13/02—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements
- G01L13/025—Devices or apparatus for measuring differences of two or more fluid pressure values using elastically-deformable members or pistons as sensing elements using diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0654—Protection against aggressive medium in general against moisture or humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20135618A FI125447B (fi) | 2013-06-04 | 2013-06-04 | Parannettu paineanturi |
US14/293,317 US9541464B2 (en) | 2013-06-04 | 2014-06-02 | Pressure sensor structure |
PCT/IB2014/061939 WO2014195878A1 (en) | 2013-06-04 | 2014-06-04 | An improved pressure sensor structure |
CN201710873107.0A CN107655619B (zh) | 2013-06-04 | 2014-06-04 | 微机电压力传感器结构以及压力传感器 |
EP14731387.8A EP3004830B1 (en) | 2013-06-04 | 2014-06-04 | An improved pressure sensor structure |
TW103119339A TWI600887B (zh) | 2013-06-04 | 2014-06-04 | 一種改良的壓力感測器結構 |
EP18151612.1A EP3346248B1 (en) | 2013-06-04 | 2014-06-04 | An improved pressure sensor structure |
CN201480031498.6A CN105283745B (zh) | 2013-06-04 | 2014-06-04 | 一种改进的压力传感器结构 |
JP2016517718A JP6065159B2 (ja) | 2013-06-04 | 2014-06-04 | 改良された圧力センサー構造 |
KR1020187002819A KR101946234B1 (ko) | 2013-06-04 | 2014-06-04 | 개선된 압력 센서 구조 |
KR1020157034469A KR101825903B1 (ko) | 2013-06-04 | 2014-06-04 | 개선된 압력 센서 구조 |
JP2016247759A JP6195011B2 (ja) | 2013-06-04 | 2016-12-21 | 改良された圧力センサー構造 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20135618 | 2013-06-04 | ||
FI20135618A FI125447B (fi) | 2013-06-04 | 2013-06-04 | Parannettu paineanturi |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20135618A true FI20135618A (fi) | 2015-01-23 |
FI125447B FI125447B (fi) | 2015-10-15 |
Family
ID=50977016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20135618A FI125447B (fi) | 2013-06-04 | 2013-06-04 | Parannettu paineanturi |
Country Status (8)
Country | Link |
---|---|
US (1) | US9541464B2 (fi) |
EP (2) | EP3004830B1 (fi) |
JP (2) | JP6065159B2 (fi) |
KR (2) | KR101946234B1 (fi) |
CN (2) | CN105283745B (fi) |
FI (1) | FI125447B (fi) |
TW (1) | TWI600887B (fi) |
WO (1) | WO2014195878A1 (fi) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI125958B (fi) * | 2013-05-10 | 2016-04-29 | Murata Manufacturing Co | Parannettu paineanturi |
FI125960B (fi) * | 2013-05-28 | 2016-04-29 | Murata Manufacturing Co | Parannettu paineanturi |
FI125447B (fi) * | 2013-06-04 | 2015-10-15 | Murata Manufacturing Co | Parannettu paineanturi |
US9671421B2 (en) * | 2015-04-24 | 2017-06-06 | Horiba Stec, Co., Ltd. | Micro-position gap sensor assembly |
WO2018235415A1 (ja) * | 2017-06-21 | 2018-12-27 | パナソニックIpマネジメント株式会社 | 物理量センサ |
JP6696552B2 (ja) | 2017-11-13 | 2020-05-20 | 株式会社村田製作所 | 配線容量キャンセル方法および配線容量キャンセル装置 |
IT201800001092A1 (it) | 2018-01-16 | 2019-07-16 | St Microelectronics Srl | Sensore di pressione piezoresistivo microelettromeccanico con capacita' di auto-diagnosi e relativo procedimento di fabbricazione |
JP7122686B2 (ja) * | 2018-03-30 | 2022-08-22 | パナソニックIpマネジメント株式会社 | 静電容量検出装置 |
CN111771109B (zh) * | 2018-03-30 | 2022-03-25 | 松下知识产权经营株式会社 | 静电电容检测装置 |
CN113557419A (zh) * | 2019-03-13 | 2021-10-26 | 株式会社村田制作所 | 压力传感器 |
KR102288972B1 (ko) * | 2020-03-19 | 2021-08-13 | 성균관대학교산학협력단 | 정전용량형 힘센서 |
CA194626S (en) * | 2020-04-15 | 2022-08-04 | 5121175 Manitoba Ltd Dcc Hail | Drive-through vehicle-scanning archway |
US11940336B2 (en) * | 2021-03-26 | 2024-03-26 | Sporian Microsystems, Inc. | Driven-shield capacitive pressure sensor |
USD1017076S1 (en) * | 2021-07-21 | 2024-03-05 | Lg Display Co., Ltd. | Gate with displays |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0750789B2 (ja) * | 1986-07-18 | 1995-05-31 | 日産自動車株式会社 | 半導体圧力変換装置の製造方法 |
SE459887B (sv) * | 1987-02-12 | 1989-08-14 | Hydrolab Ab | Tryckgivare |
JP2813721B2 (ja) * | 1990-02-16 | 1998-10-22 | 豊田工機株式会社 | 容量型圧力センサ |
JP2724419B2 (ja) * | 1990-08-28 | 1998-03-09 | 日本特殊陶業株式会社 | 圧力センサ |
JP3189987B2 (ja) * | 1992-05-29 | 2001-07-16 | 豊田工機株式会社 | 容量型センサ |
JP3114816B2 (ja) * | 1991-06-22 | 2000-12-04 | 豊田工機株式会社 | デジタル出力を有する容量形センサ |
JP2838049B2 (ja) * | 1993-12-07 | 1998-12-16 | 松下電器産業株式会社 | 静電容量型センサ及びその製造方法 |
DE69412769T2 (de) | 1993-12-07 | 1999-01-14 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Kapazitiver Sensor und Verfahren zur Herstellung |
DE69922727T2 (de) * | 1998-03-31 | 2005-12-15 | Hitachi, Ltd. | Kapazitiver Druckwandler |
AU5489799A (en) * | 1998-08-19 | 2000-03-14 | Wisconsin Alumni Research Foundation | Sealed capacitive pressure sensors |
JP3567089B2 (ja) | 1998-10-12 | 2004-09-15 | 株式会社日立製作所 | 静電容量式圧力センサ |
US6295875B1 (en) * | 1999-05-14 | 2001-10-02 | Rosemount Inc. | Process pressure measurement devices with improved error compensation |
JP4342122B2 (ja) * | 2001-06-01 | 2009-10-14 | 株式会社豊田中央研究所 | 静電容量型物理量センサと検出装置 |
US6732590B1 (en) * | 2002-11-20 | 2004-05-11 | Infineon Technologies Ag | Pressure sensor and process for producing the pressure sensor |
CN1751232A (zh) | 2003-03-10 | 2006-03-22 | 丹佛斯公司 | 在所测量的压力和参考室之间的压力均衡减少的硅压力传感器 |
US7114397B2 (en) * | 2004-03-12 | 2006-10-03 | General Electric Company | Microelectromechanical system pressure sensor and method for making and using |
JP2005283355A (ja) * | 2004-03-30 | 2005-10-13 | Alps Electric Co Ltd | 静電容量型圧力センサおよびその製造方法 |
US7313965B2 (en) | 2004-12-27 | 2008-01-01 | General Electric Company | High-temperature pressure sensor |
US7527742B2 (en) * | 2005-06-27 | 2009-05-05 | Momentive Performance Materials Inc. | Etchant, method of etching, laminate formed thereby, and device |
US20090116675A1 (en) * | 2005-12-14 | 2009-05-07 | Yuichi Miyoshi | Mems diaphragm structure and method for forming the same |
WO2011084229A2 (en) * | 2009-12-17 | 2011-07-14 | Arizona Board Of Regents, For And On Behalf Of Arizona State University | Embedded mems sensors and related methods |
JP2010187303A (ja) | 2009-02-13 | 2010-08-26 | Yamaha Corp | 圧力センサ |
US8216882B2 (en) | 2010-08-23 | 2012-07-10 | Freescale Semiconductor, Inc. | Method of producing a microelectromechanical (MEMS) sensor device |
EP2492240A1 (en) | 2011-02-23 | 2012-08-29 | Nxp B.V. | IC with pressure sensor and manufacturing method thereof |
WO2012164975A1 (ja) * | 2011-06-03 | 2012-12-06 | アルプス電気株式会社 | 静電容量型圧力センサ及びその製造方法 |
KR101646999B1 (ko) | 2011-06-29 | 2016-08-09 | 인벤센스, 인크. | 수직으로 집적된 전자장치를 갖는 환경에 노출된 부분을 구비한 기밀하게 밀봉된 mems 디바이스 |
US20130152694A1 (en) | 2011-11-01 | 2013-06-20 | Ilkka Urvas | Sensor with vacuum cavity and method of fabrication |
JP5737148B2 (ja) * | 2011-11-14 | 2015-06-17 | オムロン株式会社 | 静電容量型圧力センサとその製造方法及び入力装置 |
TWM449262U (zh) * | 2012-11-23 | 2013-03-21 | Yao-Song Hou | 壓力計 |
JP6002016B2 (ja) * | 2012-11-30 | 2016-10-05 | アズビル株式会社 | 静電容量型圧力センサ |
FI125958B (fi) * | 2013-05-10 | 2016-04-29 | Murata Manufacturing Co | Parannettu paineanturi |
FI125447B (fi) * | 2013-06-04 | 2015-10-15 | Murata Manufacturing Co | Parannettu paineanturi |
DE102013213717A1 (de) * | 2013-07-12 | 2015-01-15 | Robert Bosch Gmbh | MEMS-Bauelement mit einer Mikrofonstruktur und Verfahren zu dessen Herstellung |
FI126999B (fi) * | 2014-01-17 | 2017-09-15 | Murata Manufacturing Co | Parannettu paineanturi |
-
2013
- 2013-06-04 FI FI20135618A patent/FI125447B/fi active IP Right Grant
-
2014
- 2014-06-02 US US14/293,317 patent/US9541464B2/en active Active
- 2014-06-04 EP EP14731387.8A patent/EP3004830B1/en active Active
- 2014-06-04 JP JP2016517718A patent/JP6065159B2/ja active Active
- 2014-06-04 CN CN201480031498.6A patent/CN105283745B/zh active Active
- 2014-06-04 EP EP18151612.1A patent/EP3346248B1/en active Active
- 2014-06-04 KR KR1020187002819A patent/KR101946234B1/ko active IP Right Grant
- 2014-06-04 CN CN201710873107.0A patent/CN107655619B/zh active Active
- 2014-06-04 WO PCT/IB2014/061939 patent/WO2014195878A1/en active Application Filing
- 2014-06-04 KR KR1020157034469A patent/KR101825903B1/ko active IP Right Grant
- 2014-06-04 TW TW103119339A patent/TWI600887B/zh active
-
2016
- 2016-12-21 JP JP2016247759A patent/JP6195011B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
FI125447B (fi) | 2015-10-15 |
US20140352446A1 (en) | 2014-12-04 |
KR20160003861A (ko) | 2016-01-11 |
KR101825903B1 (ko) | 2018-03-22 |
EP3346248B1 (en) | 2020-08-19 |
JP2016526170A (ja) | 2016-09-01 |
CN107655619B (zh) | 2020-10-27 |
US9541464B2 (en) | 2017-01-10 |
EP3346248A1 (en) | 2018-07-11 |
EP3004830A1 (en) | 2016-04-13 |
JP2017122722A (ja) | 2017-07-13 |
TW201504608A (zh) | 2015-02-01 |
WO2014195878A1 (en) | 2014-12-11 |
CN107655619A (zh) | 2018-02-02 |
CN105283745A (zh) | 2016-01-27 |
JP6065159B2 (ja) | 2017-01-25 |
TWI600887B (zh) | 2017-10-01 |
CN105283745B (zh) | 2017-10-27 |
EP3004830B1 (en) | 2018-02-28 |
KR20180014853A (ko) | 2018-02-09 |
KR101946234B1 (ko) | 2019-05-21 |
JP6195011B2 (ja) | 2017-09-13 |
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Legal Events
Date | Code | Title | Description |
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PC | Transfer of assignment of patent |
Owner name: MURATA MANUFACTURING CO., LTD. |
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FG | Patent granted |
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