FI20060868A - Tehomuuttajan tehokomponenttien jäähdytys - Google Patents

Tehomuuttajan tehokomponenttien jäähdytys Download PDF

Info

Publication number
FI20060868A
FI20060868A FI20060868A FI20060868A FI20060868A FI 20060868 A FI20060868 A FI 20060868A FI 20060868 A FI20060868 A FI 20060868A FI 20060868 A FI20060868 A FI 20060868A FI 20060868 A FI20060868 A FI 20060868A
Authority
FI
Finland
Prior art keywords
power
cooling
components
transformer
power transformer
Prior art date
Application number
FI20060868A
Other languages
English (en)
Swedish (sv)
Other versions
FI20060868A0 (fi
FI122741B (fi
Inventor
Osmo Miettinen
Juha Norrena
Original Assignee
Vacon Oyj
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vacon Oyj filed Critical Vacon Oyj
Priority to FI20060868A priority Critical patent/FI122741B/fi
Publication of FI20060868A0 publication Critical patent/FI20060868A0/fi
Priority to EP07075813A priority patent/EP1906447A3/en
Priority to US11/905,096 priority patent/US20080078529A1/en
Publication of FI20060868A publication Critical patent/FI20060868A/fi
Application granted granted Critical
Publication of FI122741B publication Critical patent/FI122741B/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Transformer Cooling (AREA)
FI20060868A 2006-09-29 2006-09-29 Tehomuuttajan tehokomponenttien jäähdytys FI122741B (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI20060868A FI122741B (fi) 2006-09-29 2006-09-29 Tehomuuttajan tehokomponenttien jäähdytys
EP07075813A EP1906447A3 (en) 2006-09-29 2007-09-18 Cooling of the power components of a frequency converter
US11/905,096 US20080078529A1 (en) 2006-09-29 2007-09-27 Cooling of the power components of a frequency converter

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20060868A FI122741B (fi) 2006-09-29 2006-09-29 Tehomuuttajan tehokomponenttien jäähdytys
FI20060868 2006-09-29

Publications (3)

Publication Number Publication Date
FI20060868A0 FI20060868A0 (fi) 2006-09-29
FI20060868A true FI20060868A (fi) 2008-03-30
FI122741B FI122741B (fi) 2012-06-15

Family

ID=37067190

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20060868A FI122741B (fi) 2006-09-29 2006-09-29 Tehomuuttajan tehokomponenttien jäähdytys

Country Status (3)

Country Link
US (1) US20080078529A1 (fi)
EP (1) EP1906447A3 (fi)
FI (1) FI122741B (fi)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20126218A (fi) * 2012-11-20 2014-05-21 Vacon Oyj Tehoelektroniikkalaite
DE102013203114A1 (de) * 2013-02-26 2014-09-11 Siemens Aktiengesellschaft Umrichterkühlung mit Phasenwechselspeicher
FR3010274B1 (fr) * 2013-08-27 2016-10-21 Valeo Equip Electr Moteur Bloc convertisseur de puissance de vehicule electrique ou hybride
CN107949234A (zh) * 2016-10-10 2018-04-20 南京南瑞集团公司 一种用于柔性直流输电换流阀的冷却系统
JP6595531B2 (ja) * 2017-05-30 2019-10-23 ファナック株式会社 ヒートシンクアッセンブリ
CN111552327A (zh) * 2020-05-15 2020-08-18 上海蔚星科技有限公司 基于相变材料及金属微膨胀的航天器用双驱空间热开关
CN114554051B (zh) * 2022-02-11 2024-03-08 杭州海康威视数字技术股份有限公司 摄像模组及其控制方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512740B2 (fi) * 1974-03-15 1980-04-03
JPS54116178A (en) * 1978-03-01 1979-09-10 Sony Corp Protective unit for semiconductor element
US4706355A (en) * 1984-12-11 1987-11-17 Q-Dot Corporation Method of making an internally grooved and expanded tubular heat exchanger apparatus
DE69031883T2 (de) * 1989-06-08 1998-08-27 Furukawa Electric Co Ltd Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3663689B2 (ja) 1995-10-12 2005-06-22 株式会社デンソー 沸騰冷却装置
JP3810119B2 (ja) * 1996-03-07 2006-08-16 株式会社デンソー 沸騰冷却装置
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
EP1330866B1 (en) * 2000-11-03 2015-12-30 SMC Electrical Products, Inc. Inverter for use in an AC drive
US6437981B1 (en) * 2000-11-30 2002-08-20 Harris Corporation Thermally enhanced microcircuit package and method of forming same
FI118781B (fi) * 2003-06-04 2008-03-14 Vacon Oyj Kondensaattorin kiinnitys- ja suojajärjestely
FI117838B (fi) * 2003-06-04 2007-03-15 Vacon Oyj Nestejäähdytyselementti ja nestejäähdytyselementin liittämisjärjestely
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
JP2005195226A (ja) * 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
JP2005229102A (ja) 2004-01-13 2005-08-25 Fuji Electric Systems Co Ltd ヒートシンク
JP4305406B2 (ja) * 2005-03-18 2009-07-29 三菱電機株式会社 冷却構造体

Also Published As

Publication number Publication date
FI20060868A0 (fi) 2006-09-29
EP1906447A3 (en) 2010-04-14
US20080078529A1 (en) 2008-04-03
EP1906447A2 (en) 2008-04-02
FI122741B (fi) 2012-06-15

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