FI20060447L - Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi - Google Patents

Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi Download PDF

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Publication number
FI20060447L
FI20060447L FI20060447A FI20060447A FI20060447L FI 20060447 L FI20060447 L FI 20060447L FI 20060447 A FI20060447 A FI 20060447A FI 20060447 A FI20060447 A FI 20060447A FI 20060447 L FI20060447 L FI 20060447L
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FI
Finland
Prior art keywords
producing
circuit board
printed circuit
electronic components
board embedded
Prior art date
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FI20060447A
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English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20060447A0 (fi
Inventor
Doo Hwan Lee
Chang-Sup Ryu
Han Seo Cho
Byoung Youl Min
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Samsung Electro Mech
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Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of FI20060447A0 publication Critical patent/FI20060447A0/fi
Publication of FI20060447L publication Critical patent/FI20060447L/fi

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L2224/73201—Location after the connecting process on the same surface
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
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    • H05K2201/0335—Layered conductors or foils
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
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    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FI20060447A 2005-05-10 2006-05-09 Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi FI20060447L (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050038949A KR100716826B1 (ko) 2005-05-10 2005-05-10 전자부품이 내장된 기판의 제조방법

Publications (2)

Publication Number Publication Date
FI20060447A0 FI20060447A0 (fi) 2006-05-09
FI20060447L true FI20060447L (fi) 2006-11-11

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Family Applications (1)

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FI20060447A FI20060447L (fi) 2005-05-10 2006-05-09 Menetelmä elektronisilla komponenteilla upotetun piirilevyn valmistamiseksi

Country Status (6)

Country Link
US (1) US20060258053A1 (de)
JP (1) JP2006319339A (de)
KR (1) KR100716826B1 (de)
CN (1) CN1863438A (de)
DE (1) DE102006021765A1 (de)
FI (1) FI20060447L (de)

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* Cited by examiner, † Cited by third party
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CN1971897B (zh) * 2005-11-24 2010-05-26 鸿富锦精密工业（深圳）有限公司 球格阵列布线架构
KR100751995B1 (ko) * 2006-06-30 2007-08-28 삼성전기주식회사 인쇄회로기판 및 그 제조방법
TWI327361B (en) * 2006-07-28 2010-07-11 Unimicron Technology Corp Circuit board structure having passive component and stack structure thereof
DE102006055576A1 (de) * 2006-11-21 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger
KR100858032B1 (ko) * 2007-02-27 2008-09-10 대덕전자 주식회사 능동 소자 내장형 인쇄회로기판 및 제조 방법
KR100816324B1 (ko) * 2007-05-23 2008-03-24 전자부품연구원 칩 내장형 인쇄회로기판 및 그 제조방법
SG150404A1 (en) * 2007-08-28 2009-03-30 Micron Technology Inc Semiconductor assemblies and methods of manufacturing such assemblies
DE102007044754A1 (de) * 2007-09-19 2009-04-09 Robert Bosch Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe sowie elektronische Baugruppe
KR100867954B1 (ko) 2007-10-31 2008-11-11 삼성전기주식회사 전자소자 내장 인쇄회로기판 및 그 제조방법
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FI20060447A0 (fi) 2006-05-09
KR100716826B1 (ko) 2007-05-09
US20060258053A1 (en) 2006-11-16

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