FI20031796A0 - Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille - Google Patents

Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille

Info

Publication number
FI20031796A0
FI20031796A0 FI20031796A FI20031796A FI20031796A0 FI 20031796 A0 FI20031796 A0 FI 20031796A0 FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A FI20031796 A FI 20031796A FI 20031796 A0 FI20031796 A0 FI 20031796A0
Authority
FI
Finland
Prior art keywords
constructing
embedded
component
circuit board
emi shield
Prior art date
Application number
FI20031796A
Other languages
English (en)
Swedish (sv)
Other versions
FI20031796A (fi
Inventor
Esa Muukkonen
Original Assignee
Asperation Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asperation Oy filed Critical Asperation Oy
Priority to FI20031796A priority Critical patent/FI20031796A/fi
Publication of FI20031796A0 publication Critical patent/FI20031796A0/fi
Priority to CN 200480036607 priority patent/CN1891023A/zh
Priority to JP2006543565A priority patent/JP2007514309A/ja
Priority to PCT/FI2004/000752 priority patent/WO2005057999A1/en
Priority to EP04805147A priority patent/EP1692926A1/en
Publication of FI20031796A publication Critical patent/FI20031796A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
FI20031796A 2003-12-09 2003-12-09 Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille FI20031796A (fi)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FI20031796A FI20031796A (fi) 2003-12-09 2003-12-09 Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille
CN 200480036607 CN1891023A (zh) 2003-12-09 2004-12-09 用于绕嵌在电路中的部件构造电磁干扰屏蔽的方法
JP2006543565A JP2007514309A (ja) 2003-12-09 2004-12-09 回路基板中に埋め込まれたコンポーネントの周囲にｅｍｉシールドを構築する方法
PCT/FI2004/000752 WO2005057999A1 (en) 2003-12-09 2004-12-09 Method for constructing emi shielding around a component embedded in a circuit board
EP04805147A EP1692926A1 (en) 2003-12-09 2004-12-09 Method for constructing emi shielding around a component embedded in a circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20031796A FI20031796A (fi) 2003-12-09 2003-12-09 Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille

Publications (2)

Publication Number Publication Date
FI20031796A0 true FI20031796A0 (fi) 2003-12-09
FI20031796A FI20031796A (fi) 2005-06-10

Family

ID=29763494

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20031796A FI20031796A (fi) 2003-12-09 2003-12-09 Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille

Country Status (5)

Country Link
EP (1) EP1692926A1 (fi)
JP (1) JP2007514309A (fi)
CN (1) CN1891023A (fi)
FI (1) FI20031796A (fi)
WO (1) WO2005057999A1 (fi)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101562951B (zh) * 2008-04-18 2011-05-11 欣兴电子股份有限公司 线路板及其制作方法
JP5139156B2 (ja) * 2008-05-30 2013-02-06 タツタ電線株式会社 電磁波シールド材及びプリント配線板
FI20095110A0 (fi) 2009-02-06 2009-02-06 Imbera Electronics Oy Elektroniikkamoduuli, jossa on EMI-suoja
FR2952428B1 (fr) * 2009-11-12 2011-12-16 Sagem Defense Securite Capteur inertiel
CN101795524B (zh) * 2009-12-31 2013-06-19 浙江阳光照明电器集团股份有限公司 一种紧凑型支架灯具
CN102378464A (zh) * 2010-08-12 2012-03-14 环鸿科技股份有限公司 电路板模块
CN102740608A (zh) * 2011-04-15 2012-10-17 常熟东南相互电子有限公司 组合式电路板及其制造方法
JP5931547B2 (ja) * 2012-03-30 2016-06-08 イビデン株式会社 配線板及びその製造方法
CN104066273A (zh) * 2013-03-20 2014-09-24 深南电路有限公司 一种封装基板及其制作方法和基板组件
CN104080280B (zh) * 2013-03-26 2017-08-08 深南电路有限公司 一种封装基板单元及其制作方法和基板组件
CN104080274B (zh) * 2013-03-29 2016-12-28 深南电路有限公司 一种封装基板及其制作方法和基板组件
DE102014219792A1 (de) * 2014-09-30 2016-03-31 Technische Universität Berlin Optoelektronisches Bauelement
US10321569B1 (en) 2015-04-29 2019-06-11 Vpt, Inc. Electronic module and method of making same
CN107613641B (zh) * 2016-06-28 2019-07-19 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN106535472B (zh) * 2017-01-12 2019-08-02 郑州云海信息技术有限公司 一种pcb及信号传输系统
KR102616814B1 (ko) * 2018-03-09 2023-12-21 삼성전자주식회사 반도체 패키지 및 반도체 모듈
CN110300492B (zh) * 2019-07-25 2021-03-30 生益电子股份有限公司 一种pcb的制作方法和pcb

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6131269A (en) * 1998-05-18 2000-10-17 Trw Inc. Circuit isolation technique for RF and millimeter-wave modules
US6916122B2 (en) * 2002-03-05 2005-07-12 Jds Uniphase Corporation Modular heat sinks
EP1510844A1 (en) * 2003-08-28 2005-03-02 Siemens Aktiengesellschaft An optical fibre connector with electromagnetic shielding

Also Published As

Publication number Publication date
FI20031796A (fi) 2005-06-10
WO2005057999A1 (en) 2005-06-23
EP1692926A1 (en) 2006-08-23
JP2007514309A (ja) 2007-05-31
CN1891023A (zh) 2007-01-03

Similar Documents

Publication Publication Date Title
FI20031796A0 (fi) Menetelmä EMI-suojan rakentamiseksi piirilevylle upotettavan komponentin ympärille
FI20050645A0 (fi) Menetelmä piirilevyrakenteen valmistamiseksi ja piirilevyrakenne
FI20050646A0 (fi) Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
FI20031341A (fi) Menetelmä elektroniikkamoduulin valmistamiseksi
GB0505436D0 (en) Printed circuit board and manufacturing method thereof
FI20041524A (fi) Menetelmä elektroniikkamoduulin valmistamiseksi
FI20050287A0 (fi) Elektroniikkaosan asennusvastake
EP1768474A4 (en) PCB AND MANUFACTURING METHOD THEREFOR
FI20075593A0 (fi) Menetelmä valmistaa komponenttiin upotettu piirilevy
FI20031201A0 (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
FI20040827A (fi) Menetelmä elektroniikkamoduulin valmistamiseksi
HK1108101A1 (en) Optical/electrical circuit interconnect board and evaluation method therefor
DE602004015021D1 (de) Elektronisches Bauelement-Modul
GB2440662B (en) Transient voltage protection circuit boards and manufacturing methods
FI20030293A (fi) Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
EP1745684A4 (en) METHOD FOR PRODUCING AN ELECTRONIC CONDUCTOR PLATE
EP1694105A4 (en) METHOD FOR PRODUCING A CONDUCTOR PLATE
FI20050976A (fi) Sähköinen liitäntäkomponentti
EP2217050A4 (en) ELECTRONIC CIRCUIT BOARD AND METHOD AND STRUCTURE FOR SHIELDING THE ELECTRONIC CIRCUIT BOARD
GB0328246D0 (en) Improvements relating to electronic circuit packages
AU154270S (en) An electronic computer
EP1862044A4 (en) METHOD FOR MOUNTING A PRINTED CIRCUIT BOARD
SG114648A1 (en) Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
FI20040253A0 (fi) Piirilevy ja menetelmä optisen komponentin upottamiseksi piirilevyyn
AU156864S (en) An electronic computer

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ASPOCOMP TECHNOLOGY OY

Free format text: ASPOCOMP TECHNOLOGY OY

MA Patent expired