FI20001344A0 - Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana - Google Patents

Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana

Info

Publication number
FI20001344A0
FI20001344A0 FI20001344A FI20001344A FI20001344A0 FI 20001344 A0 FI20001344 A0 FI 20001344A0 FI 20001344 A FI20001344 A FI 20001344A FI 20001344 A FI20001344 A FI 20001344A FI 20001344 A0 FI20001344 A0 FI 20001344A0
Authority
FI
Finland
Prior art keywords
web
producing
smart label
entry path
intelligent label
Prior art date
Application number
FI20001344A
Other languages
English (en)
Finnish (fi)
Other versions
FI20001344A (sv
Inventor
Samuli Stroemberg
Marko Hanhikorpi
Ilkka Nuorela
Mikko Tirkkonen
Timo Lindstroem
Lari Kytoelae
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Priority to FI20001344A priority Critical patent/FI20001344A/sv
Publication of FI20001344A0 publication Critical patent/FI20001344A0/sv
Priority to PCT/FI2001/000520 priority patent/WO2001095241A1/en
Priority to KR1020027016593A priority patent/KR100858979B1/ko
Priority to AU2001263978A priority patent/AU2001263978A1/en
Priority to EP01938282A priority patent/EP1292455B1/en
Priority to JP2002502706A priority patent/JP2003536149A/ja
Publication of FI20001344A publication Critical patent/FI20001344A/sv
Priority to US10/310,709 priority patent/US20030121986A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/0781Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Making Paper Articles (AREA)
  • Credit Cards Or The Like (AREA)
FI20001344A 2000-06-06 2000-06-06 Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana FI20001344A (sv)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20001344A FI20001344A (sv) 2000-06-06 2000-06-06 Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana
PCT/FI2001/000520 WO2001095241A1 (en) 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web
KR1020027016593A KR100858979B1 (ko) 2000-06-06 2001-05-31 스마트 라벨 인렛 웹 제조를 위한 방법 및 장치
AU2001263978A AU2001263978A1 (en) 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web
EP01938282A EP1292455B1 (en) 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web
JP2002502706A JP2003536149A (ja) 2000-06-06 2001-05-31 スマートラベル挿入ウェブの製造方法および製造装置
US10/310,709 US20030121986A1 (en) 2000-06-06 2002-12-05 Method and an apparatus for manufacturing a smart label inlet web

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20001344A FI20001344A (sv) 2000-06-06 2000-06-06 Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana

Publications (2)

Publication Number Publication Date
FI20001344A0 true FI20001344A0 (sv) 2000-06-06
FI20001344A FI20001344A (sv) 2001-12-07

Family

ID=8558503

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20001344A FI20001344A (sv) 2000-06-06 2000-06-06 Förfarande och anordning för tillverkning av en intelligentetikettinmatningsbana

Country Status (7)

Country Link
US (1) US20030121986A1 (sv)
EP (1) EP1292455B1 (sv)
JP (1) JP2003536149A (sv)
KR (1) KR100858979B1 (sv)
AU (1) AU2001263978A1 (sv)
FI (1) FI20001344A (sv)
WO (1) WO2001095241A1 (sv)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US6915551B2 (en) 2002-08-02 2005-07-12 Matrics, Inc. Multi-barrel die transfer apparatus and method for transferring dies therewith
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US20040250417A1 (en) 2003-06-12 2004-12-16 Arneson Michael R. Method, system, and apparatus for transfer of dies using a die plate
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
US7479614B2 (en) 2004-01-12 2009-01-20 Symbol Technologies Radio frequency identification tag inlay sortation and assembly
JP2005306470A (ja) * 2004-03-25 2005-11-04 Tatsuo Sasazaki シート状成形材
CA2576772A1 (en) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
US7500307B2 (en) * 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
JP4091096B2 (ja) 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
CN101156508B (zh) 2005-04-06 2010-08-18 哈里斯股份有限公司 电子部件的制造装置
US7623034B2 (en) * 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
GB2430783B (en) * 2005-10-03 2010-12-22 Fracture Code Corp Aps Two-part code
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070163704A1 (en) * 2006-01-18 2007-07-19 Upm Rafsec Oy Method for manufacturing a label comprising a transponder
US8763898B2 (en) * 2010-03-02 2014-07-01 First Data Corporation Advanced card merge machine
CN114013112A (zh) * 2021-10-21 2022-02-08 上海晶路电子科技有限公司 一种卷对卷电子吊牌的生产工艺

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE792488A (fr) * 1971-12-08 1973-03-30 Dainippon Printing Co Ltd Cartes d'identification et procede de fabrication de ces cartes
DE3130032A1 (de) * 1981-07-30 1983-02-17 Agfa-Gevaert Ag, 5090 Leverkusen Faelschungssicheres dokument
NL8601404A (nl) 1986-05-30 1987-12-16 Papier Plastic Coating Groning Gegevensdragende kaart, werkwijze voor het vervaardigen van een dergelijke kaart en inrichting voor het uitvoeren van deze werkwijze.
JPS6359592A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US4954814A (en) * 1986-09-29 1990-09-04 Monarch Marking Systems, Inc. Tag and method of making same
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
KR0147813B1 (ko) * 1989-05-16 1998-08-01 월터 클리웨인, 한스-피터 위트린 적층 구조물 및 그의 제조방법
JPH03239595A (ja) 1990-02-16 1991-10-25 Dainippon Printing Co Ltd カード製造方法
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
JPH07242081A (ja) * 1994-03-08 1995-09-19 Dainippon Printing Co Ltd カード付き連続帳票
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
WO1997048562A1 (fr) * 1996-06-17 1997-12-24 Mitsubishi Denki Kabushiki Kaisha Procede de production de carte de circuits imprimes fines, et construction de ces dernieres
DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US5910959A (en) * 1997-01-06 1999-06-08 Conexant Systems, Inc. Control channel for modems
US5867102C1 (en) * 1997-02-27 2002-09-10 Wallace Comp Srvices Inc Electronic article surveillance label assembly and method of manufacture
SE9701612D0 (sv) * 1997-04-29 1997-04-29 Johan Asplund Smartcard and method for its manufacture
US6077382A (en) * 1997-05-09 2000-06-20 Citizen Watch Co., Ltd Mounting method of semiconductor chip
JPH1159036A (ja) * 1997-08-21 1999-03-02 Hitachi Maxell Ltd 非接触icカード及びその製造方法
CA2301640C (en) * 1997-09-11 2005-05-03 Precision Dynamics Corporation Laminated radio frequency identification device
US5982284A (en) * 1997-09-19 1999-11-09 Avery Dennison Corporation Tag or label with laminated thin, flat, flexible device
JPH1191275A (ja) * 1997-09-25 1999-04-06 Dainippon Printing Co Ltd 非接触型icカードの製造方法および非接触型icカード
KR20010024592A (ko) * 1997-11-12 2001-03-26 야콥 하산 개인화된 카드 및 파우치를 자동 생산하는 장치 및 방법
JP3400329B2 (ja) * 1998-01-07 2003-04-28 日本電信電話株式会社 半導体装置
EP1051885A1 (en) * 1998-02-06 2000-11-15 FLEXcon Company, Inc. Thin film transferable electric components
JPH11330148A (ja) * 1998-03-13 1999-11-30 Toshiba Corp 半導体装置
US6315856B1 (en) * 1998-03-19 2001-11-13 Kabushiki Kaisha Toshiba Method of mounting electronic component
US6040630A (en) * 1998-04-13 2000-03-21 Harris Corporation Integrated circuit package for flip chip with alignment preform feature and method of forming same
JP2000001069A (ja) * 1998-06-18 2000-01-07 Konica Corp Idカードの製造方法及びidカードの製造装置
ATE398814T1 (de) * 1998-09-11 2008-07-15 Motorola Inc Rfid-etikettenvorrichtung und verfahren
JP2000132655A (ja) * 1998-10-28 2000-05-12 Sony Corp 非接触型icカードの製造方法および非接触型icカード

Also Published As

Publication number Publication date
KR20030028750A (ko) 2003-04-10
WO2001095241A8 (en) 2002-04-04
EP1292455A1 (en) 2003-03-19
WO2001095241A1 (en) 2001-12-13
JP2003536149A (ja) 2003-12-02
FI20001344A (sv) 2001-12-07
EP1292455B1 (en) 2012-04-11
US20030121986A1 (en) 2003-07-03
AU2001263978A1 (en) 2001-12-17
KR100858979B1 (ko) 2008-09-17

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