FI124372B - Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet - Google Patents

Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet Download PDF

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Publication number
FI124372B
FI124372B FI20096179A FI20096179A FI124372B FI 124372 B FI124372 B FI 124372B FI 20096179 A FI20096179 A FI 20096179A FI 20096179 A FI20096179 A FI 20096179A FI 124372 B FI124372 B FI 124372B
Authority
FI
Finland
Prior art keywords
substrate
particles
sintering
ink
layer
Prior art date
Application number
FI20096179A
Other languages
English (en)
Finnish (fi)
Swedish (sv)
Other versions
FI20096179A (fi
FI20096179A0 (fi
Inventor
Tomi Mattila
Mark Allen
Jaakko Leppäniemi
Original Assignee
Teknologian Tutkimuskeskus Vtt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt filed Critical Teknologian Tutkimuskeskus Vtt
Priority to FI20096179A priority Critical patent/FI124372B/fi
Publication of FI20096179A0 publication Critical patent/FI20096179A0/fi
Priority to KR1020127015262A priority patent/KR20120096506A/ko
Priority to CN2010800613975A priority patent/CN102686509A/zh
Priority to JP2012538373A priority patent/JP2013511143A/ja
Priority to US13/508,994 priority patent/US9603260B2/en
Priority to EP10829579.1A priority patent/EP2499087A4/en
Priority to PCT/FI2010/050917 priority patent/WO2011058230A1/en
Publication of FI20096179A publication Critical patent/FI20096179A/fi
Application granted granted Critical
Publication of FI124372B publication Critical patent/FI124372B/fi

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Textile Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
FI20096179A 2009-11-13 2009-11-13 Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet FI124372B (fi)

Priority Applications (7)

Application Number Priority Date Filing Date Title
FI20096179A FI124372B (fi) 2009-11-13 2009-11-13 Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet
KR1020127015262A KR20120096506A (ko) 2009-11-13 2010-11-15 증착된 입자들에 관련된 방법 및 제품들
CN2010800613975A CN102686509A (zh) 2009-11-13 2010-11-15 与所沉积粒子有关的方法和产品
JP2012538373A JP2013511143A (ja) 2009-11-13 2010-11-15 堆積粒子に関する方法および生成物
US13/508,994 US9603260B2 (en) 2009-11-13 2010-11-15 Method and products related to deposited particles
EP10829579.1A EP2499087A4 (en) 2009-11-13 2010-11-15 METHOD AND PRODUCTS ASSOCIATED WITH DEPOSITED PARTICLES
PCT/FI2010/050917 WO2011058230A1 (en) 2009-11-13 2010-11-15 Method and products related to deposited particles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20096179A FI124372B (fi) 2009-11-13 2009-11-13 Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet
FI20096179 2009-11-13

Publications (3)

Publication Number Publication Date
FI20096179A0 FI20096179A0 (fi) 2009-11-13
FI20096179A FI20096179A (fi) 2011-05-14
FI124372B true FI124372B (fi) 2014-07-31

Family

ID=41395227

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20096179A FI124372B (fi) 2009-11-13 2009-11-13 Kerrostettuihin partikkeleihin liittyvä menetelmä ja tuotteet

Country Status (7)

Country Link
US (1) US9603260B2 (ko)
EP (1) EP2499087A4 (ko)
JP (1) JP2013511143A (ko)
KR (1) KR20120096506A (ko)
CN (1) CN102686509A (ko)
FI (1) FI124372B (ko)
WO (1) WO2011058230A1 (ko)

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US9072185B2 (en) * 2009-07-30 2015-06-30 Lockheed Martin Corporation Copper nanoparticle application processes for low temperature printable, flexible/conformal electronics and antennas
KR101113658B1 (ko) * 2010-03-18 2012-02-14 현대자동차주식회사 표면안정제로 개질된 이산화티탄 나노 입자, 이를 포함하는 이산화티탄 나노 잉크, 이를 사용하여 제조되는 태양전지, 및 그의 제조방법
US20130043067A1 (en) * 2011-08-17 2013-02-21 Kyocera Corporation Wire Substrate Structure
WO2014172252A1 (en) * 2013-04-15 2014-10-23 Kent State University Patterned liquid crystal alignment using ink-jet printed nanoparticles and use thereof to produce patterned, electro-optically addressable devices; ink-jet printable compositions
US9167684B2 (en) * 2013-05-24 2015-10-20 Nokia Technologies Oy Apparatus and method for forming printed circuit board using fluid reservoirs and connected fluid channels
US20160242283A1 (en) * 2013-10-29 2016-08-18 Kyocera Corporation Wiring board, and mounting structure and laminated sheet using the same
KR102358139B1 (ko) * 2015-06-30 2022-02-03 엘지디스플레이 주식회사 표시 패널
US20170238425A1 (en) * 2016-02-12 2017-08-17 Tyco Electronics Corporation Method of Fabricating Highly Conductive Features with Silver Nanoparticle Ink at Low Temperature
US20170294397A1 (en) * 2016-04-08 2017-10-12 Hamilton Sundstrand Corporation Die and substrate assembly with graded density bonding layer
EP3733792A1 (en) * 2019-04-30 2020-11-04 Agfa-Gevaert Nv A method of manufacturing a conductive pattern

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Also Published As

Publication number Publication date
EP2499087A4 (en) 2015-08-19
KR20120096506A (ko) 2012-08-30
EP2499087A1 (en) 2012-09-19
US9603260B2 (en) 2017-03-21
US20120275119A1 (en) 2012-11-01
FI20096179A (fi) 2011-05-14
WO2011058230A1 (en) 2011-05-19
CN102686509A (zh) 2012-09-19
FI20096179A0 (fi) 2009-11-13
JP2013511143A (ja) 2013-03-28

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