FI119729B - Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti - Google Patents
Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti Download PDFInfo
- Publication number
- FI119729B FI119729B FI20065484A FI20065484A FI119729B FI 119729 B FI119729 B FI 119729B FI 20065484 A FI20065484 A FI 20065484A FI 20065484 A FI20065484 A FI 20065484A FI 119729 B FI119729 B FI 119729B
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- FI
- Finland
- Prior art keywords
- microelectromechanical
- electronic circuit
- lid
- microelectromechanical component
- insulating layer
- Prior art date
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Classifications
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
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Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20065484A FI119729B (fi) | 2005-11-23 | 2006-07-07 | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
CN2006800440202A CN101312904B (zh) | 2005-11-23 | 2006-11-21 | 制造微机电元件的方法以及该微机电元件 |
EP06808048.0A EP1951611B1 (en) | 2005-11-23 | 2006-11-21 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
PCT/FI2006/050507 WO2007060289A1 (en) | 2005-11-23 | 2006-11-21 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
KR1020087013838A KR101388946B1 (ko) | 2005-11-23 | 2006-11-21 | 마이크로전기기계 컴포넌트의 제조방법 및마이크로전기기계 컴포넌트 |
JP2008541775A JP2009516597A (ja) | 2005-11-23 | 2006-11-21 | 微小電気機械素子を作製する方法及び微小電気機械素子 |
US11/603,070 US7932568B2 (en) | 2005-11-23 | 2006-11-22 | Microelectromechanical component |
MYPI20081535 MY153013A (en) | 2005-11-23 | 2008-05-09 | Method for manufacturing a microelectromechanical component, and a microelectromechanical component |
JP2014005037A JP5919310B2 (ja) | 2005-11-23 | 2014-01-15 | 微小電気機械素子を製造する方法、及び微小電気機械素子とその用途 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20055618A FI119728B (fi) | 2005-11-23 | 2005-11-23 | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
FI20055618 | 2005-11-23 | ||
FI20065484 | 2006-07-07 | ||
FI20065484A FI119729B (fi) | 2005-11-23 | 2006-07-07 | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
Publications (3)
Publication Number | Publication Date |
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FI20065484A0 FI20065484A0 (fi) | 2006-07-07 |
FI20065484A FI20065484A (fi) | 2007-09-06 |
FI119729B true FI119729B (fi) | 2009-02-27 |
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Application Number | Title | Priority Date | Filing Date |
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FI20065484A FI119729B (fi) | 2005-11-23 | 2006-07-07 | Menetelmä mikroelektromekaanisen komponentin valmistamiseksi ja mikroelektromekaaninen komponentti |
Country Status (8)
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US (1) | US7932568B2 (zh) |
EP (1) | EP1951611B1 (zh) |
JP (2) | JP2009516597A (zh) |
KR (1) | KR101388946B1 (zh) |
CN (1) | CN101312904B (zh) |
FI (1) | FI119729B (zh) |
MY (1) | MY153013A (zh) |
WO (1) | WO2007060289A1 (zh) |
Families Citing this family (21)
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EP2011762B1 (en) * | 2007-07-02 | 2015-09-30 | Denso Corporation | Semiconductor device with a sensor connected to an external element |
US9588081B2 (en) * | 2007-09-25 | 2017-03-07 | Ownstone Medical Limited | Interdigitated electrode configuration for ion filter |
US7782522B2 (en) * | 2008-07-17 | 2010-08-24 | Qualcomm Mems Technologies, Inc. | Encapsulation methods for interferometric modulator and MEMS devices |
DE102009002376A1 (de) * | 2009-04-15 | 2010-10-21 | Robert Bosch Gmbh | Multichip-Sensormodul und Verfahren dessen Herstellung |
US8315793B2 (en) * | 2009-06-03 | 2012-11-20 | Honeywell International Inc. | Integrated micro-electro-mechanical systems (MEMS) sensor device |
US8043891B2 (en) * | 2009-06-05 | 2011-10-25 | Shanghai Lexvu Opto Microelectronics Technology Co., Ltd. | Method of encapsulating a wafer level microdevice |
CN102092352B (zh) * | 2010-12-16 | 2013-03-27 | 芜湖伯特利电子控制系统有限公司 | 一种应用于机动车的惯量测量单元的控制方法 |
CN107720689A (zh) * | 2011-06-30 | 2018-02-23 | 村田电子有限公司 | 系统级封装器件的制造方法和系统级封装器件 |
FR3005648B1 (fr) | 2013-05-15 | 2016-02-12 | Commissariat Energie Atomique | Procede d'encapsulation d'un dispositif microelectronique comprenant une injection de gaz noble a travers un materiau permeable a ce gaz noble |
US10081535B2 (en) * | 2013-06-25 | 2018-09-25 | Analog Devices, Inc. | Apparatus and method for shielding and biasing in MEMS devices encapsulated by active circuitry |
CN104944359B (zh) * | 2014-03-25 | 2017-02-22 | 中芯国际集成电路制造(上海)有限公司 | Mems器件及其形成方法 |
CN105174203B (zh) * | 2014-05-28 | 2016-09-28 | 无锡华润上华半导体有限公司 | 基于mems的传感器的制作方法 |
US9611137B2 (en) * | 2014-08-26 | 2017-04-04 | Invensense, Inc. | MEMS sensor integrated with a flip chip |
JP6488639B2 (ja) * | 2014-10-28 | 2019-03-27 | セイコーエプソン株式会社 | 電子デバイス、電子機器および移動体 |
JP6488640B2 (ja) * | 2014-10-28 | 2019-03-27 | セイコーエプソン株式会社 | 電子デバイス、電子機器および移動体 |
US9604841B2 (en) | 2014-11-06 | 2017-03-28 | Analog Devices, Inc. | MEMS sensor cap with multiple isolated electrodes |
US10451646B2 (en) | 2015-01-28 | 2019-10-22 | Continental Teves Ag & Co. Ohg | Sensor with symmetrically embedded sensor elements |
EP3250892B1 (de) | 2015-01-28 | 2019-10-16 | Continental Teves AG & Co. OHG | Adapter mit eingebetteten filterbauelementen für sensoren |
US9969614B2 (en) * | 2015-05-29 | 2018-05-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | MEMS packages and methods of manufacture thereof |
US10649000B2 (en) * | 2015-12-17 | 2020-05-12 | Panasonic Intellectual Property Management Co., Ltd. | Connection assembly |
US11444048B2 (en) | 2017-10-05 | 2022-09-13 | Texas Instruments Incorporated | Shaped interconnect bumps in semiconductor devices |
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US5448014A (en) * | 1993-01-27 | 1995-09-05 | Trw Inc. | Mass simultaneous sealing and electrical connection of electronic devices |
US6140707A (en) * | 1998-05-07 | 2000-10-31 | 3M Innovative Properties Co. | Laminated integrated circuit package |
US6159385A (en) | 1998-05-08 | 2000-12-12 | Rockwell Technologies, Llc | Process for manufacture of micro electromechanical devices having high electrical isolation |
CN1242602A (zh) * | 1998-07-16 | 2000-01-26 | 日东电工株式会社 | 晶片规模封装结构及其内使用的电路板 |
KR20030023613A (ko) * | 2000-02-02 | 2003-03-19 | 레이던 컴퍼니 | 집적회로 컴포넌트를 구비하는 마이크로전기기계 시스템의진공 패키징 방법 및 진공 패키지 |
DE10017976A1 (de) * | 2000-04-11 | 2001-10-18 | Bosch Gmbh Robert | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
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US6512300B2 (en) * | 2001-01-10 | 2003-01-28 | Raytheon Company | Water level interconnection |
DE10123039A1 (de) * | 2001-05-11 | 2002-11-21 | Bosch Gmbh Robert | Sensoranordnung, insbesondere mikromechanische Sensoranordnung |
WO2002096166A1 (en) * | 2001-05-18 | 2002-11-28 | Corporation For National Research Initiatives | Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates |
JP4173652B2 (ja) * | 2001-07-02 | 2008-10-29 | 富士通株式会社 | 金融取引装置 |
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TW517361B (en) * | 2001-12-31 | 2003-01-11 | Megic Corp | Chip package structure and its manufacture process |
JP3575478B2 (ja) | 2002-07-03 | 2004-10-13 | ソニー株式会社 | モジュール基板装置の製造方法、高周波モジュール及びその製造方法 |
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WO2004037711A2 (en) * | 2002-10-23 | 2004-05-06 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
JP4489411B2 (ja) * | 2003-01-23 | 2010-06-23 | 新光電気工業株式会社 | 電子部品実装構造の製造方法 |
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JP4269806B2 (ja) * | 2003-06-30 | 2009-05-27 | カシオ計算機株式会社 | 半導体装置およびその製造方法 |
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JP4539155B2 (ja) * | 2003-10-03 | 2010-09-08 | パナソニック電工株式会社 | センサシステムの製造方法 |
JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
US7642611B2 (en) * | 2004-04-22 | 2010-01-05 | Panasonic Electric Works Co., Ltd. | Sensor device, sensor system and methods for manufacturing them |
KR100733242B1 (ko) | 2004-05-19 | 2007-06-27 | 삼성전기주식회사 | 측면 밀봉부재가 형성된 mems 패키지 및 그 제조 방법 |
-
2006
- 2006-07-07 FI FI20065484A patent/FI119729B/fi not_active IP Right Cessation
- 2006-11-21 EP EP06808048.0A patent/EP1951611B1/en active Active
- 2006-11-21 WO PCT/FI2006/050507 patent/WO2007060289A1/en active Application Filing
- 2006-11-21 CN CN2006800440202A patent/CN101312904B/zh active Active
- 2006-11-21 JP JP2008541775A patent/JP2009516597A/ja active Pending
- 2006-11-21 KR KR1020087013838A patent/KR101388946B1/ko active IP Right Grant
- 2006-11-22 US US11/603,070 patent/US7932568B2/en active Active
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2008
- 2008-05-09 MY MYPI20081535 patent/MY153013A/en unknown
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2014
- 2014-01-15 JP JP2014005037A patent/JP5919310B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
KR101388946B1 (ko) | 2014-05-27 |
CN101312904A (zh) | 2008-11-26 |
FI20065484A0 (fi) | 2006-07-07 |
CN101312904B (zh) | 2012-09-05 |
FI20065484A (fi) | 2007-09-06 |
JP2009516597A (ja) | 2009-04-23 |
WO2007060289A1 (en) | 2007-05-31 |
EP1951611A4 (en) | 2014-01-22 |
JP2014111308A (ja) | 2014-06-19 |
US20070132047A1 (en) | 2007-06-14 |
EP1951611B1 (en) | 2016-08-17 |
MY153013A (en) | 2014-12-31 |
JP5919310B2 (ja) | 2016-05-18 |
KR20080078823A (ko) | 2008-08-28 |
EP1951611A1 (en) | 2008-08-06 |
US7932568B2 (en) | 2011-04-26 |
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