ES8800785A1 - Un metodo para formar un contacto ohmico - Google Patents

Un metodo para formar un contacto ohmico

Info

Publication number
ES8800785A1
ES8800785A1 ES550464A ES550464A ES8800785A1 ES 8800785 A1 ES8800785 A1 ES 8800785A1 ES 550464 A ES550464 A ES 550464A ES 550464 A ES550464 A ES 550464A ES 8800785 A1 ES8800785 A1 ES 8800785A1
Authority
ES
Spain
Prior art keywords
type semiconductor
ohmic contact
layer
making same
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES550464A
Other languages
English (en)
Other versions
ES550464A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BP Technology Ventures Ltd
Sohio Commercial Development Co
SOHIO COMMERCIAL DEV Co
Original Assignee
BP Technology Ventures Ltd
Sohio Commercial Development Co
SOHIO COMMERCIAL DEV Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BP Technology Ventures Ltd, Sohio Commercial Development Co, SOHIO COMMERCIAL DEV Co filed Critical BP Technology Ventures Ltd
Publication of ES550464A0 publication Critical patent/ES550464A0/es
Publication of ES8800785A1 publication Critical patent/ES8800785A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/441—Deposition of conductive or insulating materials for electrodes
    • H01L21/443—Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/441—Deposition of conductive or insulating materials for electrodes
    • H01L21/445—Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/543—Solar cells from Group II-VI materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Led Devices (AREA)
  • Photovoltaic Devices (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

METODO PARA LA FORMACION DE UN CONTACTO OHMICO, CON UNA PELICULA DELGADA DE UN COMPUESTO SEMICONDUCTOR DE TIPO P. COMPRENDE LAS OPERACIONES DE ATACAR QUIMICAMENTE LA SUPERFICIE DE DICHA PELICULA CON UNA SOLUCION ACIDA PARA FORMAR UNA SUPERFICIE RICA EN ELEMENTOS NO METALICOS; DE TRATAR LA SUPERFICIE DE LA PELICULA ATACADA CON ACIDO CON UNA SOLUCION BASICA FUERTE; DE DEPOSITAR SOBRE DICHA SUPERFICIE ATACADA Y TRATADA UNA CAPA METALICA DE COBRE QUE TIENEN UN ESPESOR DE CAPA DE APROXIMADAMENTE 5 D 10C1 NANOMETROS A APROXIMADAMENTE 5 NANOMETROS; Y DE DEPOSITAR SOBRE DICHA CAPA DE COBRE UNA SEGUNDA CAPA DE AL MENOS UN SEGUNDO METAL CONDUCTOR. DE APLICACION EN DISPOSITIVOS FOTOVOLTAICOS DE PELICULA DELGADA.
ES550464A 1984-12-28 1985-12-27 Un metodo para formar un contacto ohmico Expired ES8800785A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/687,092 US4680611A (en) 1984-12-28 1984-12-28 Multilayer ohmic contact for p-type semiconductor and method of making same

Publications (2)

Publication Number Publication Date
ES550464A0 ES550464A0 (es) 1987-11-16
ES8800785A1 true ES8800785A1 (es) 1987-11-16

Family

ID=24759001

Family Applications (1)

Application Number Title Priority Date Filing Date
ES550464A Expired ES8800785A1 (es) 1984-12-28 1985-12-27 Un metodo para formar un contacto ohmico

Country Status (9)

Country Link
US (1) US4680611A (es)
EP (1) EP0186350B1 (es)
JP (1) JPS61222180A (es)
AT (1) ATE56105T1 (es)
AU (2) AU581946B2 (es)
CA (1) CA1236224A (es)
DE (1) DE3579429D1 (es)
ES (1) ES8800785A1 (es)
ZA (1) ZA859821B (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4735662A (en) * 1987-01-06 1988-04-05 The Standard Oil Company Stable ohmic contacts to thin films of p-type tellurium-containing II-VI semiconductors
JP2659714B2 (ja) * 1987-07-21 1997-09-30 株式会社日立製作所 半導体集積回路装置
JPH01111380A (ja) * 1987-10-23 1989-04-28 Sumitomo Metal Ind Ltd 光起電力素子及びその製造方法
US5393675A (en) * 1993-05-10 1995-02-28 The University Of Toledo Process for RF sputtering of cadmium telluride photovoltaic cell
US5557146A (en) * 1993-07-14 1996-09-17 University Of South Florida Ohmic contact using binder paste with semiconductor material dispersed therein
US5909632A (en) * 1997-09-25 1999-06-01 Midwest Research Institute Use of separate ZnTe interface layers to form OHMIC contacts to p-CdTe films
WO2009110403A1 (ja) * 2008-03-07 2009-09-11 国立大学法人東北大学 光電変換素子構造及び太陽電池
US8524524B2 (en) * 2010-04-22 2013-09-03 General Electric Company Methods for forming back contact electrodes for cadmium telluride photovoltaic cells
US20110272010A1 (en) * 2010-05-10 2011-11-10 International Business Machines Corporation High work function metal interfacial films for improving fill factor in solar cells
WO2017091269A2 (en) * 2015-08-31 2017-06-01 The Board Of Regents Of The University Of Oklahoma Semiconductor devices having matrix-embedded nano-structured materials

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3370207A (en) * 1964-02-24 1968-02-20 Gen Electric Multilayer contact system for semiconductor devices including gold and copper layers
US3268309A (en) * 1964-03-30 1966-08-23 Gen Electric Semiconductor contact means
US3465428A (en) * 1966-10-27 1969-09-09 Trw Inc Method of fabricating semiconductor devices and the like
US4065781A (en) * 1974-06-21 1977-12-27 Westinghouse Electric Corporation Insulated-gate thin film transistor with low leakage current
US4000508A (en) * 1975-07-17 1976-12-28 Honeywell Inc. Ohmic contacts to p-type mercury cadmium telluride
JPS5237785A (en) * 1975-09-20 1977-03-23 Agency Of Ind Science & Technol Process for production of photovoltaic elements
JPS5356988A (en) * 1976-11-04 1978-05-23 Agency Of Ind Science & Technol Photovoltaic element
JPS5454589A (en) * 1977-10-11 1979-04-28 Agency Of Ind Science & Technol Photoelectric transducer and production of the same
US4319069A (en) * 1980-07-25 1982-03-09 Eastman Kodak Company Semiconductor devices having improved low-resistance contacts to p-type CdTe, and method of preparation
JPS6033793B2 (ja) * 1981-01-19 1985-08-05 株式会社村田製作所 銅被膜を有するセラミツク体
JPS57126101A (en) * 1981-01-29 1982-08-05 Murata Manufacturing Co Method of forming electrode for barium titanate series semiconductor porcelain
US4388483A (en) * 1981-09-08 1983-06-14 Monosolar, Inc. Thin film heterojunction photovoltaic cells and methods of making the same
JPS5931041A (ja) * 1982-08-13 1984-02-18 Seiko Epson Corp 薄膜半導体装置
US4456630A (en) * 1983-08-18 1984-06-26 Monosolar, Inc. Method of forming ohmic contacts
JPH1151A (ja) * 1997-06-11 1999-01-06 Takashi Osawa ゲルマニウムミネラルを含んだ野菜を作る 土壌改良植成剤

Also Published As

Publication number Publication date
ATE56105T1 (de) 1990-09-15
AU5085185A (en) 1986-07-03
EP0186350A3 (en) 1988-01-20
ZA859821B (en) 1986-09-24
ES550464A0 (es) 1987-11-16
AU608154B2 (en) 1991-03-21
AU3404589A (en) 1989-08-31
EP0186350A2 (en) 1986-07-02
US4680611A (en) 1987-07-14
DE3579429D1 (de) 1990-10-04
CA1236224A (en) 1988-05-03
AU581946B2 (en) 1989-03-09
JPS61222180A (ja) 1986-10-02
EP0186350B1 (en) 1990-08-29

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19981001