ES8700538A1 - Procedimiento para la obtencion de circuitos impresos - Google Patents
Procedimiento para la obtencion de circuitos impresosInfo
- Publication number
- ES8700538A1 ES8700538A1 ES544533A ES544533A ES8700538A1 ES 8700538 A1 ES8700538 A1 ES 8700538A1 ES 544533 A ES544533 A ES 544533A ES 544533 A ES544533 A ES 544533A ES 8700538 A1 ES8700538 A1 ES 8700538A1
- Authority
- ES
- Spain
- Prior art keywords
- baseboards
- printed circuits
- cyclohexene
- activated
- way
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Auxiliary Devices For Music (AREA)
- Luminescent Compositions (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Paper (AREA)
- Electroplating Methods And Accessories (AREA)
- Control Of Electric Motors In General (AREA)
- Networks Using Active Elements (AREA)
- Emergency Protection Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843423457 DE3423457A1 (de) | 1984-06-26 | 1984-06-26 | Verfahren zur herstellung von leiterplatten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES544533A0 ES544533A0 (es) | 1986-10-16 |
| ES8700538A1 true ES8700538A1 (es) | 1986-10-16 |
Family
ID=6239138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES544533A Expired ES8700538A1 (es) | 1984-06-26 | 1985-06-25 | Procedimiento para la obtencion de circuitos impresos |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0166327B1 (de) |
| JP (1) | JPS6118195A (de) |
| AT (1) | ATE39367T1 (de) |
| DE (2) | DE3423457A1 (de) |
| ES (1) | ES8700538A1 (de) |
| FI (1) | FI852488L (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4576685A (en) * | 1985-04-23 | 1986-03-18 | Schering Ag | Process and apparatus for plating onto articles |
| EP4314384A1 (de) * | 2021-03-29 | 2024-02-07 | HSO Herbert Schmidt GmbH & Co. KG | Beize für polyamid |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA956294A (en) * | 1973-03-14 | 1974-10-15 | Stanley J. Whittaker | Rotary valve |
| JPS5694690A (en) * | 1979-12-27 | 1981-07-31 | Asahi Chemical Ind | Method of manufacturing thick film fine pattern |
| DE3148280A1 (de) * | 1981-12-05 | 1983-06-09 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung |
| DE3324767A1 (de) * | 1983-07-08 | 1985-01-17 | Bayer Ag, 5090 Leverkusen | Verfahren zur aktivierung von substraten fuer die stromlose metallisierung |
-
1984
- 1984-06-26 DE DE19843423457 patent/DE3423457A1/de not_active Withdrawn
-
1985
- 1985-06-14 EP EP85107381A patent/EP0166327B1/de not_active Expired
- 1985-06-14 DE DE8585107381T patent/DE3566905D1/de not_active Expired
- 1985-06-14 AT AT85107381T patent/ATE39367T1/de not_active IP Right Cessation
- 1985-06-24 FI FI852488A patent/FI852488L/fi not_active Application Discontinuation
- 1985-06-25 ES ES544533A patent/ES8700538A1/es not_active Expired
- 1985-06-26 JP JP60138051A patent/JPS6118195A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE3423457A1 (de) | 1986-01-02 |
| FI852488A7 (fi) | 1985-12-27 |
| JPS6118195A (ja) | 1986-01-27 |
| EP0166327A3 (en) | 1986-10-08 |
| ATE39367T1 (de) | 1989-01-15 |
| FI852488L (fi) | 1985-12-27 |
| FI852488A0 (fi) | 1985-06-24 |
| ES544533A0 (es) | 1986-10-16 |
| EP0166327A2 (de) | 1986-01-02 |
| DE3566905D1 (en) | 1989-01-26 |
| EP0166327B1 (de) | 1988-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5733599A (en) | Method for enhancing the solderability of a surface | |
| FR2569725B1 (fr) | Procede de metallisation selective de substrats isolants de plaquettes a circuits | |
| DK0502120T3 (da) | Fremgangsmåde til direkte elektroplettering af et dielektrisk substrat | |
| ES8205269A1 (es) | Procedimiento para activar superficies metalicas y no meta- licas para la precipitacion sin corriente de metal | |
| GB1248142A (en) | Improvements in or relating to electrical circuits assemblies | |
| GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
| DE59805020D1 (de) | Verfahren zum metallisieren eines elektrisch nichtleitende oberflächenbereiche aufweisenden substrats | |
| GB1101299A (en) | Method of manufacturing an electric circuit unit | |
| ES8700538A1 (es) | Procedimiento para la obtencion de circuitos impresos | |
| EP0248683A3 (de) | Verfahren und Zusammenstellung zur Elektroplattierung von Leiterplatten ohne stromlose Plattierung | |
| ATE66967T1 (de) | Verfahren zur metallisierung von keramik. | |
| ATE73179T1 (de) | Verfahren zur metallisierung nichtleitender substrate. | |
| DE69316750D1 (de) | Verfahren zur herstellung einer leiterplatte. | |
| JPS55138864A (en) | Method of fabricating semiconductor assembling substrate | |
| US6403146B1 (en) | Process for the manufacture of printed circuit boards | |
| GB1164591A (en) | mprovements in Metallization of Insulating Substrates | |
| Duva et al. | Electroless Plating Process | |
| JP3218698B2 (ja) | 銅のメタライズ方法 | |
| JPS6422095A (en) | Manufacture of printed wiring board | |
| JPS6489585A (en) | Multilayer wiring board | |
| GR880100623A (el) | Επενδυσις υποστρωματων δια σχεδιασματων κυκλωματων εκ παχεως μεταλλου | |
| JPS6453592A (en) | Conductive substrate for transfer of conductor circuit | |
| JPS6417450A (en) | Formation of bump | |
| GB1364660A (en) | Method of producing electrical interconnection patterns | |
| Utsumi et al. | Metallized Ceramic Substrate and Method of Manufacturing the Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FD1A | Patent lapsed |
Effective date: 19970401 |