ES553359A0 - Procedimiento para fabricar una tarjeta de memoria electronica. - Google Patents
Procedimiento para fabricar una tarjeta de memoria electronica.Info
- Publication number
- ES553359A0 ES553359A0 ES553359A ES553359A ES553359A0 ES 553359 A0 ES553359 A0 ES 553359A0 ES 553359 A ES553359 A ES 553359A ES 553359 A ES553359 A ES 553359A ES 553359 A0 ES553359 A0 ES 553359A0
- Authority
- ES
- Spain
- Prior art keywords
- bumps
- procedure
- manufacture
- electronic module
- memory card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Credit Cards Or The Like (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Holo Graphy (AREA)
- Photoreceptors In Electrophotography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504658A FR2579799B1 (fr) | 1985-03-28 | 1985-03-28 | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8706990A1 ES8706990A1 (es) | 1987-06-16 |
ES553359A0 true ES553359A0 (es) | 1987-06-16 |
Family
ID=9317687
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES553359A Expired ES8706990A1 (es) | 1985-03-28 | 1986-03-25 | Procedimiento para fabricar una tarjeta de memoria electronica. |
ES1987297137U Expired ES297137Y (es) | 1985-03-28 | 1987-03-16 | Tarjeta de memoria electronica |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES1987297137U Expired ES297137Y (es) | 1985-03-28 | 1987-03-16 | Tarjeta de memoria electronica |
Country Status (8)
Country | Link |
---|---|
US (1) | US4737620A (es) |
EP (1) | EP0197847B1 (es) |
JP (1) | JPS61227094A (es) |
AT (1) | ATE48484T1 (es) |
CA (1) | CA1255388A (es) |
DE (1) | DE3667345D1 (es) |
ES (2) | ES8706990A1 (es) |
FR (1) | FR2579799B1 (es) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2502511B2 (ja) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | 半導体装置の製造方法 |
US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
FR2605144B1 (fr) | 1986-10-14 | 1989-02-24 | Flonic Sa | Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede |
FR2613510A1 (fr) * | 1987-03-31 | 1988-10-07 | Flonic Sa | Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues |
CH672285A5 (es) * | 1987-04-14 | 1989-11-15 | Landis & Gyr Ag | |
JP2562476B2 (ja) * | 1987-06-11 | 1996-12-11 | 大日本印刷株式会社 | 1cカードの製造方法 |
FR2617666B1 (fr) * | 1987-07-02 | 1989-10-27 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
US4921160A (en) * | 1988-02-29 | 1990-05-01 | American Telephone And Telegraph Company | Personal data card and method of constructing the same |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
FR2636453B1 (fr) * | 1988-09-14 | 1992-01-17 | Sgs Thomson Microelectronics | Procede d'encapsulation de circuits-integres notamment pour cartes a puces |
JPH0687484B2 (ja) * | 1989-04-06 | 1994-11-02 | 三菱電機株式会社 | Icカード用モジュール |
FR2650530B1 (fr) * | 1989-08-07 | 1991-11-29 | Schlumberger Ind Sa | Procede de realisation de corps de carte avec graphisme |
US5282113A (en) * | 1990-03-05 | 1994-01-25 | Hitachi Maxell, Ltd. | Memory card with a plurality of contact spaces |
FR2664076A1 (fr) * | 1990-03-28 | 1992-01-03 | Schlumberger Ind Sa | Procede de fabrication d'une carte a memoire electronique. |
EP0472768A1 (de) * | 1990-08-30 | 1992-03-04 | Siemens Aktiengesellschaft | Verfahren zum Befestigen eines Chipmoduls auf einer Chipkarte |
FR2668096B1 (fr) * | 1990-10-19 | 1993-01-22 | Schlumberger Ind Sa | Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue. |
DK0584143T3 (da) * | 1991-05-10 | 1996-02-12 | Gao Ges F | Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse |
FR2677785A1 (fr) * | 1991-06-17 | 1992-12-18 | Philips Composants | Procede de fabrication d'une carte a microcircuit. |
DE9110057U1 (es) * | 1991-08-14 | 1992-02-20 | Orga Kartensysteme Gmbh, 6072 Dreieich, De | |
DE4126874C2 (de) * | 1991-08-14 | 1997-05-22 | Orga Kartensysteme Gmbh | Datenträger mit integriertem Schaltkreis |
DE4140529C2 (de) * | 1991-12-09 | 1997-07-31 | Gao Ges Automation Org | Verfahren zum Bedrucken von Karten mit sacklochförmiger Aussparung und Vorrichtung zur Ausführung des Verfahrens |
DE4142409A1 (de) * | 1991-12-20 | 1993-07-01 | Gao Ges Automation Org | Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens |
FR2695854B1 (fr) | 1992-09-22 | 1994-12-09 | Leroux Ets Gilles | Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités. |
FR2702067B1 (fr) * | 1993-02-23 | 1995-04-14 | Schlumberger Ind Sa | Procédé et dispositif de fabrication de cartes à mémoire. |
CH688696A5 (fr) * | 1993-03-17 | 1998-01-15 | François Droz | Procédé de fabrication d'une carte comprenant au moins un élément électronique. |
ATE170307T1 (de) * | 1994-05-27 | 1998-09-15 | Ake Gustafson | Verfahren zur herstellung eines elektronischen moduls und nach diesem verfahren hergestelltes modul |
US5837992A (en) * | 1994-07-15 | 1998-11-17 | Shinko Nameplate Co., Ltd. | Memory card and its manufacturing method |
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
FR2727542B1 (fr) * | 1994-11-25 | 1997-01-03 | Droz Francois | Carte incorporant au moins un element electronique |
DE4443767A1 (de) * | 1994-12-08 | 1996-06-13 | Giesecke & Devrient Gmbh | Elektronisches Modul und Datenträger mit elektrischem Modul |
US5952713A (en) * | 1994-12-27 | 1999-09-14 | Takahira; Kenichi | Non-contact type IC card |
DE19502398A1 (de) * | 1995-01-26 | 1996-08-01 | Giesecke & Devrient Gmbh | Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper |
US5837367A (en) * | 1995-01-27 | 1998-11-17 | Interprint Formularios Ltda. | Memory card and method of producing same |
DE19601389A1 (de) * | 1996-01-16 | 1997-07-24 | Siemens Ag | Chipkartenkörper |
JP2001505329A (ja) * | 1996-08-05 | 2001-04-17 | ジェムプリュス エス.セー.アー. | メモリカード実現方法の改良とそれによって得られるカード |
DE19701165C1 (de) | 1997-01-15 | 1998-04-09 | Siemens Ag | Chipkartenmodul |
US5955021A (en) * | 1997-05-19 | 1999-09-21 | Cardxx, Llc | Method of making smart cards |
KR100255108B1 (en) * | 1997-06-18 | 2000-05-01 | Samsung Electronics Co Ltd | Chip card |
DE19749243C1 (de) | 1997-11-07 | 1998-11-19 | Richard Herbst | Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse |
FR2774198B1 (fr) * | 1998-01-27 | 2001-08-31 | Solaic Sa | Procede de fixation d'un module electronique dans une cavite d'un corps d'objet portable, notamment corps de carte, par ultrasons |
DE19816066A1 (de) * | 1998-04-09 | 1999-10-14 | Philips Patentverwaltung | Folie als Träger von integrierten Schaltungen |
FR2803434A1 (fr) * | 1999-12-30 | 2001-07-06 | Schlumberger Systems & Service | Procede de protection d'un circuit integre dispose dans une cavite d'un corps de carte et outil correspondant |
FR2805067B1 (fr) | 2000-02-15 | 2003-09-12 | Bourgogne Grasset | Jeton a puce electronique et procedes de fabrication d'un tel jeton |
DE10006515C5 (de) * | 2000-02-15 | 2004-09-16 | Datacard Corp., Minnetonka | Verfahren zum Einbau von Chips in Kartenkörper |
JP4516179B2 (ja) * | 2000-05-22 | 2010-08-04 | 大日本印刷株式会社 | 接触・非接触共用icカードの製造方法及び製造装置 |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
US20090091424A1 (en) * | 2007-10-05 | 2009-04-09 | Manfred Rietzler | Transponder inlay for a personal document and method of manufacturing same |
ITRM20090236A1 (it) * | 2009-05-12 | 2010-11-13 | Gep S P A | Sistema di collocazione stabile del modulo del chip di silicio nella cava generata sull inlay tramite deposito di materiale collante sintetico |
FR2968432B1 (fr) * | 2010-12-06 | 2012-12-28 | Oberthur Technologies | Procédé d'encartage d'un module dans une carte a microcircuit |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
KR102286490B1 (ko) * | 2016-07-27 | 2021-08-04 | 컴포시큐어 엘엘씨 | 트랜잭션 카드들을 위한 오버몰딩된 전자 컴포넌트 및 이를 제조하는 방법 |
PE20201177A1 (es) | 2017-09-07 | 2020-11-03 | Composecure Llc | Tarjeta de transaccion con componentes electronicos incorporados y procedimiento para su fabricacion |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
US11232341B2 (en) | 2017-10-18 | 2022-01-25 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
DE3153769C2 (de) * | 1981-04-14 | 1995-10-26 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
US4483067A (en) * | 1981-09-11 | 1984-11-20 | U.S. Philips Corporation | Method of manufacturing an identification card and an identification manufactured, for example, by this method |
FR2538930B1 (fr) * | 1983-01-05 | 1989-05-19 | Seiichiro Aigo | Carte d'information |
DE3466108D1 (en) * | 1983-06-09 | 1987-10-15 | Flonic Sa | Method of producing memory cards, and cards obtained thereby |
-
1985
- 1985-03-28 FR FR8504658A patent/FR2579799B1/fr not_active Expired - Lifetime
-
1986
- 1986-03-25 US US06/844,039 patent/US4737620A/en not_active Expired - Lifetime
- 1986-03-25 ES ES553359A patent/ES8706990A1/es not_active Expired
- 1986-03-26 JP JP61068246A patent/JPS61227094A/ja active Pending
- 1986-03-27 DE DE8686400670T patent/DE3667345D1/de not_active Expired - Lifetime
- 1986-03-27 EP EP86400670A patent/EP0197847B1/fr not_active Expired
- 1986-03-27 CA CA000505281A patent/CA1255388A/en not_active Expired
- 1986-03-27 AT AT86400670T patent/ATE48484T1/de not_active IP Right Cessation
-
1987
- 1987-03-16 ES ES1987297137U patent/ES297137Y/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2579799B1 (fr) | 1990-06-22 |
DE3667345D1 (de) | 1990-01-11 |
EP0197847A1 (fr) | 1986-10-15 |
ES8706990A1 (es) | 1987-06-16 |
ES297137Y (es) | 1989-10-16 |
EP0197847B1 (fr) | 1989-12-06 |
JPS61227094A (ja) | 1986-10-09 |
ATE48484T1 (de) | 1989-12-15 |
FR2579799A1 (fr) | 1986-10-03 |
US4737620A (en) | 1988-04-12 |
CA1255388A (en) | 1989-06-06 |
ES297137U (es) | 1989-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES553359A0 (es) | Procedimiento para fabricar una tarjeta de memoria electronica. | |
DE3752101D1 (de) | Baustein mit integrierten Schaltkreisen | |
DE3480881D1 (de) | Apparat zum ablesen von karten mit elektronischen speichern. | |
SE8106889L (sv) | Berelement for komponenter i form av integrerade kretsar | |
JPS5626451A (en) | Identification card having ic chip and method of manufacturing same | |
FR2761497B1 (fr) | Procede de fabrication d'une carte a puce ou analogue | |
SE8107263L (sv) | Berelement for en ic-modul | |
IT8123373A0 (it) | Scheda di riconoscimento con un modulo a circuito integrato eprocedimento per la sua produzione. | |
ES543176A0 (es) | Soporte de datos con un modulo de circuito impreso y metodo para su fabricacion | |
EP0843358A3 (de) | Elektronikmodul in Flachbauweise und Chipkarte | |
BR9808171A (pt) | Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange | |
SE8102962L (sv) | Berelement for en ic-chip | |
ES2097159T3 (es) | Cabezal de verificacion para tarjetas de credito, con semiconductor incorporado. | |
ATE118632T1 (de) | Elektronisches modul mit einer integrierten schaltung für ein kleines tragbares objekt, z.b. eine karte oder ein schlüssel und herstellungsverfahren für solche module. | |
IT8121777A0 (it) | Procedimento per realizzare il contatto di contatti galvanici di una scheda di riconosciumento con modulo a circuito integrato incorporato. | |
DE69903513D1 (de) | Kontakt-chipkarte mit herausnehmbarer minikarte | |
DE69808112T2 (de) | Herstellungsverfahren einer karte mit gewickelter antenne | |
ES2103710T3 (es) | Procedimiento de realizacion de un modulo electronico y modulo electronico que se obtiene por dicho procedimiento. | |
ES2192409T3 (es) | Sensor biometrico y procedimiento para su fabricacion. | |
FR2362494A1 (fr) | Perfectionnement aux panneaux de photopiles solaires | |
JPS54137968A (en) | Method of mounting lead wire and method of assembling microminiature circuit | |
CH627609B (fr) | Dispositif de maintien d'une pile dans une montre-bracelet electronique. | |
KR890013586A (ko) | 칩 카드의 조립방법 | |
JPS644396A (en) | Ic card | |
JPS568588A (en) | Circuit structure of electronic watch |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 20070414 |