DK0584143T3 - Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse - Google Patents
Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelseInfo
- Publication number
- DK0584143T3 DK0584143T3 DK92909860.6T DK92909860T DK0584143T3 DK 0584143 T3 DK0584143 T3 DK 0584143T3 DK 92909860 T DK92909860 T DK 92909860T DK 0584143 T3 DK0584143 T3 DK 0584143T3
- Authority
- DK
- Denmark
- Prior art keywords
- areas
- pct
- mold space
- reduced thickness
- reduced
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000010137 moulding (plastic) Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000009467 reduction Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
- B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
- B29C45/14024—Intermittently feeding endless articles, e.g. transfer films, to the mould and punching or cutting a portion from the endless articles during mould closing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Credit Cards Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19914115208 DE4115208C2 (de) | 1991-05-10 | 1991-05-10 | Verfahren und Vorrichtung zum Herstellen von Kunststoff-Formstücken mit bereichsweise reduzierter Wandstärke |
DE19914142392 DE4142392C2 (de) | 1991-12-20 | 1991-12-20 | Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke |
Publications (1)
Publication Number | Publication Date |
---|---|
DK0584143T3 true DK0584143T3 (da) | 1996-02-12 |
Family
ID=25903497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK92909860.6T DK0584143T3 (da) | 1991-05-10 | 1992-05-07 | Fremgangsmåde og indretning til fremstilling af kunststofstøbninger med områder af reduceret godstykkelse |
Country Status (10)
Country | Link |
---|---|
US (1) | US5681356A (da) |
EP (1) | EP0584143B2 (da) |
JP (1) | JP3290986B2 (da) |
AT (1) | ATE133105T1 (da) |
DE (1) | DE59205116D1 (da) |
DK (1) | DK0584143T3 (da) |
ES (1) | ES2082470T5 (da) |
GR (1) | GR3018955T3 (da) |
HK (1) | HK1007705A1 (da) |
WO (1) | WO1992020506A1 (da) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476629A (en) * | 1992-12-25 | 1995-12-19 | Citizen Watch Co. Ltd. | Method for manufacturing IC card substrate |
DE4401588C2 (de) * | 1994-01-20 | 2003-02-20 | Gemplus Gmbh | Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul |
ES2102317B1 (es) * | 1994-09-19 | 1998-04-16 | Nacional Moneda Timbre | Tarjeta inteligente de uso en telefonia y similar. |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
US5975584A (en) * | 1996-08-30 | 1999-11-02 | Adaptech S.A. | Carrier card with value chip |
US6190942B1 (en) * | 1996-10-09 | 2001-02-20 | Pav Card Gmbh | Method and connection arrangement for producing a smart card |
US5823071A (en) * | 1996-10-31 | 1998-10-20 | Borg-Warner Automotive, Inc. | Integrated transmission control system |
DE19703122C1 (de) * | 1997-01-29 | 1998-05-20 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung von Datenträgern |
DE19736082C1 (de) | 1997-08-20 | 1999-01-14 | Orga Kartensysteme Gmbh | Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens |
FR2778002B1 (fr) * | 1998-04-22 | 2000-06-30 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede |
ES2236997T3 (es) * | 1999-08-12 | 2005-07-16 | Ovd Kinegram Ag | Soporte de datos. |
JP4606553B2 (ja) * | 2000-08-11 | 2011-01-05 | 大日本印刷株式会社 | カード状基材の製造用金型およびカード状基材の製造方法 |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
US6588099B2 (en) * | 2001-01-22 | 2003-07-08 | Sankyo Kasei Kabushiki Kaisha | Process for manufacturing molded circuit board |
BR0207501A (pt) * | 2001-02-22 | 2004-03-09 | Tele Cd Company As | Método para produção de um disco ótico com um módulo destacável |
EP1249330A1 (de) * | 2001-04-12 | 2002-10-16 | Dynamit Nobel Kunststoff GmbH | Verfahren zur Herstellung eines Kunststoff-Bauteils und Bauteil |
PT1456810E (pt) | 2001-12-18 | 2011-07-25 | L 1 Secure Credentialing Inc | Características de segurança com imagens múltiplas para documentos de identificação e processo para as efectuar |
FR2834103B1 (fr) * | 2001-12-20 | 2004-04-02 | Gemplus Card Int | Carte a puce a module de surface etendue |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
AU2002364255A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
AU2002361855A1 (en) * | 2001-12-24 | 2003-07-15 | Digimarc Id Systems Llc | Pet based multi-multi-layer smart cards |
US7815124B2 (en) | 2002-04-09 | 2010-10-19 | L-1 Secure Credentialing, Inc. | Image processing techniques for printing identification cards and documents |
US7793846B2 (en) | 2001-12-24 | 2010-09-14 | L-1 Secure Credentialing, Inc. | Systems, compositions, and methods for full color laser engraving of ID documents |
AU2002364036A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Laser etched security features for identification documents and methods of making same |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
US7804982B2 (en) | 2002-11-26 | 2010-09-28 | L-1 Secure Credentialing, Inc. | Systems and methods for managing and detecting fraud in image databases used with identification documents |
US7225991B2 (en) | 2003-04-16 | 2007-06-05 | Digimarc Corporation | Three dimensional data storage |
US7744002B2 (en) | 2004-03-11 | 2010-06-29 | L-1 Secure Credentialing, Inc. | Tamper evident adhesive and identification document including same |
DE102007062459B4 (de) | 2007-12-22 | 2022-10-27 | Leuze Electronic Gmbh + Co. Kg | Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile |
US20130221544A1 (en) * | 2010-10-29 | 2013-08-29 | Konica Minolta, Inc. | Molding die, microchip manufactured by using molding die, and manufacturing apparatus for manufacturing microchip |
NO20130600A1 (no) * | 2013-04-30 | 2014-10-31 | Sinvent As | Lab-on-a-chip-system og fremstillingsmåte for samme |
GB2542712B (en) | 2015-09-25 | 2019-04-10 | Gr8 Eng Ltd | Injection moulding method |
DE102015119235B4 (de) * | 2015-11-09 | 2019-01-10 | Selectrona GmbH | Vorrichtung zum Spritzgießen und Umspritzen von Objekten |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US11267172B2 (en) * | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
MX2020002661A (es) | 2017-09-07 | 2021-10-19 | Composecure Llc | Tarjeta de transacción con componentes electrónicos incorporados y procedimiento para su fabricación. |
MX2020004012A (es) | 2017-10-18 | 2020-09-25 | Composecure Llc | Tarjeta de transacción de metal, cerámica o recubierta con cerámica con ventana o patrón de ventana y retroiluminación opcional. |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
DE102021210271A1 (de) * | 2021-09-16 | 2023-03-16 | Magna Exteriors Gmbh | Verfahren zum Herstellen von Kunststoffbauteilen |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3030666A (en) * | 1960-01-07 | 1962-04-24 | Owens Illinois Glass Co | Method for low pressure molding |
DE1729368A1 (de) * | 1967-10-13 | 1971-06-09 | Per Thorkildsen | Verfahren und Vorrichtung zur Herstellung von dekorierten,spritzgegossenen Plastgegenstaenden |
US4184835A (en) * | 1978-09-28 | 1980-01-22 | General Electric Company | Mold apparatus |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
JPS6058010B2 (ja) * | 1981-04-14 | 1985-12-18 | 三井化学株式会社 | 射出圧縮成形方法 |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
US4470786A (en) * | 1981-07-28 | 1984-09-11 | Omron Tateisi Electronics Co. | Molding apparatus with retractable preform support pins |
JPS5839425A (ja) * | 1981-09-04 | 1983-03-08 | Hashimoto Forming Co Ltd | 低圧射出成形法 |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
DD230476A3 (de) * | 1983-03-25 | 1985-12-04 | Schwarzenberg Waschgeraete | Verfahren zur herstellung von spritzgussteilen mit aussparungen |
JPS59185636A (ja) * | 1983-04-08 | 1984-10-22 | Ricoh Co Ltd | 射出圧縮成形法 |
US4540534A (en) * | 1983-10-11 | 1985-09-10 | American Optical Corporation | Apparatus and method for injection molding lenses |
JPS60193347A (ja) * | 1984-03-15 | 1985-10-01 | Toshiba Corp | 半導体製造装置 |
JPS6168209A (ja) * | 1984-09-12 | 1986-04-08 | Aisin Seiki Co Ltd | ポリアミド成形品の成形加工法 |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS6213094A (ja) * | 1985-07-10 | 1987-01-21 | 三井化学株式会社 | 配線用プリント基板の製法及びその装置 |
FR2599165A1 (fr) * | 1986-05-21 | 1987-11-27 | Michot Gerard | Objet associe a un element electronique et procede d'obtention |
US4980115A (en) * | 1987-05-28 | 1990-12-25 | Yoshida Industry Co. Ltd. | Method for making an injection-molded product having a partly thin portion |
US5304513A (en) * | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
US4961893A (en) * | 1988-04-28 | 1990-10-09 | Schlumberger Industries | Method for manufacturing memory cards |
US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
-
1992
- 1992-05-07 ES ES92909860T patent/ES2082470T5/es not_active Expired - Lifetime
- 1992-05-07 JP JP50898592A patent/JP3290986B2/ja not_active Expired - Fee Related
- 1992-05-07 DK DK92909860.6T patent/DK0584143T3/da active
- 1992-05-07 WO PCT/EP1992/000991 patent/WO1992020506A1/de active IP Right Grant
- 1992-05-07 US US08/146,087 patent/US5681356A/en not_active Expired - Fee Related
- 1992-05-07 AT AT92909860T patent/ATE133105T1/de not_active IP Right Cessation
- 1992-05-07 DE DE59205116T patent/DE59205116D1/de not_active Expired - Fee Related
- 1992-05-07 EP EP92909860A patent/EP0584143B2/de not_active Expired - Lifetime
-
1996
- 1996-02-14 GR GR960400356T patent/GR3018955T3/el unknown
-
1998
- 1998-06-26 HK HK98106916A patent/HK1007705A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO1992020506A1 (de) | 1992-11-26 |
ES2082470T5 (es) | 2003-12-16 |
US5681356A (en) | 1997-10-28 |
GR3018955T3 (en) | 1996-05-31 |
ATE133105T1 (de) | 1996-02-15 |
JPH06507126A (ja) | 1994-08-11 |
EP0584143B1 (de) | 1996-01-17 |
JP3290986B2 (ja) | 2002-06-10 |
DE59205116D1 (de) | 1996-02-29 |
EP0584143A1 (de) | 1994-03-02 |
EP0584143B2 (de) | 2003-04-16 |
ES2082470T3 (es) | 1996-03-16 |
HK1007705A1 (en) | 1999-04-23 |
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