ES2082470T5 - Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. - Google Patents
Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.Info
- Publication number
- ES2082470T5 ES2082470T5 ES92909860T ES92909860T ES2082470T5 ES 2082470 T5 ES2082470 T5 ES 2082470T5 ES 92909860 T ES92909860 T ES 92909860T ES 92909860 T ES92909860 T ES 92909860T ES 2082470 T5 ES2082470 T5 ES 2082470T5
- Authority
- ES
- Spain
- Prior art keywords
- plastic material
- manufacture
- zones
- procedure
- wall thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 238000006073 displacement reaction Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
- B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
- B29C45/14024—Intermittently feeding endless articles, e.g. transfer films, to the mould and punching or cutting a portion from the endless articles during mould closing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
- B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2017/00—Carriers for sound or information
- B29L2017/006—Memory cards, chip cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Credit Cards Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
EL PROCESO DE ACUERDO CON LA INVENCION PARA LA FABRICACION DE TARJETAS DE PLASTICO LIGERAS Y PIEZAS EN BRUTO PARA TARJETAS DE PLASTICO CON ZONAS DE PARED DE ESPESOR NOTABLEMENTE REDUCIDO, PREVE INYECTAR EL MATERIAL DE PLASTICO PRIMERAMENTE EN UNA CAVIDAD DE MOLDEO INICIAL QUE NO TIENE ZONAS DE PARED DE ESPESOR REDUCIDO. A CONTINUACION SE REDUCE LA DISTANCIA ENTRE CIERTAS REGIONES DE PARED DE LA CAVIDAD DE MOLDEO INICIAL HASTA LA DIMENSION EXIGIDA CON DESPLAZAMIENTO DEL MATERIAL PLASTICO A LAS ZONAS VECINAS DE LA CAVIDAD DE MOLDEO.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19914115208 DE4115208C2 (de) | 1991-05-10 | 1991-05-10 | Verfahren und Vorrichtung zum Herstellen von Kunststoff-Formstücken mit bereichsweise reduzierter Wandstärke |
DE19914142392 DE4142392C2 (de) | 1991-12-20 | 1991-12-20 | Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2082470T3 ES2082470T3 (es) | 1996-03-16 |
ES2082470T5 true ES2082470T5 (es) | 2003-12-16 |
Family
ID=25903497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92909860T Expired - Lifetime ES2082470T5 (es) | 1991-05-10 | 1992-05-07 | Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. |
Country Status (10)
Country | Link |
---|---|
US (1) | US5681356A (es) |
EP (1) | EP0584143B2 (es) |
JP (1) | JP3290986B2 (es) |
AT (1) | ATE133105T1 (es) |
DE (1) | DE59205116D1 (es) |
DK (1) | DK0584143T3 (es) |
ES (1) | ES2082470T5 (es) |
GR (1) | GR3018955T3 (es) |
HK (1) | HK1007705A1 (es) |
WO (1) | WO1992020506A1 (es) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476629A (en) * | 1992-12-25 | 1995-12-19 | Citizen Watch Co. Ltd. | Method for manufacturing IC card substrate |
DE4401588C2 (de) * | 1994-01-20 | 2003-02-20 | Gemplus Gmbh | Verfahren zum Verkappen eines Chipkarten-Moduls und Chipkarten-Modul |
ES2102317B1 (es) * | 1994-09-19 | 1998-04-16 | Nacional Moneda Timbre | Tarjeta inteligente de uso en telefonia y similar. |
FR2735714B1 (fr) * | 1995-06-21 | 1997-07-25 | Schlumberger Ind Sa | Procede pour imprimer un graphisme sur une carte a memoire |
US5975584A (en) * | 1996-08-30 | 1999-11-02 | Adaptech S.A. | Carrier card with value chip |
US6190942B1 (en) * | 1996-10-09 | 2001-02-20 | Pav Card Gmbh | Method and connection arrangement for producing a smart card |
US5823071A (en) * | 1996-10-31 | 1998-10-20 | Borg-Warner Automotive, Inc. | Integrated transmission control system |
DE19703122C1 (de) * | 1997-01-29 | 1998-05-20 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung von Datenträgern |
DE19736082C1 (de) | 1997-08-20 | 1999-01-14 | Orga Kartensysteme Gmbh | Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens |
FR2778002B1 (fr) * | 1998-04-22 | 2000-06-30 | Gemplus Card Int | Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede |
EP1076315B1 (de) * | 1999-08-12 | 2005-02-02 | OVD Kinegram AG | Datenträger |
JP4606553B2 (ja) * | 2000-08-11 | 2011-01-05 | 大日本印刷株式会社 | カード状基材の製造用金型およびカード状基材の製造方法 |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
US6588099B2 (en) * | 2001-01-22 | 2003-07-08 | Sankyo Kasei Kabushiki Kaisha | Process for manufacturing molded circuit board |
CN1527760A (zh) * | 2001-02-22 | 2004-09-08 | - | 用于生产具有可分离模块的光盘的方法 |
EP1249330A1 (de) * | 2001-04-12 | 2002-10-16 | Dynamit Nobel Kunststoff GmbH | Verfahren zur Herstellung eines Kunststoff-Bauteils und Bauteil |
DK1456810T3 (da) | 2001-12-18 | 2011-07-18 | L 1 Secure Credentialing Inc | Multiple billedsikkerhedstræk til at identificere dokumenter og fremgangsmåder til fremstilling deraf |
FR2834103B1 (fr) * | 2001-12-20 | 2004-04-02 | Gemplus Card Int | Carte a puce a module de surface etendue |
US7694887B2 (en) | 2001-12-24 | 2010-04-13 | L-1 Secure Credentialing, Inc. | Optically variable personalized indicia for identification documents |
EP1459246B1 (en) | 2001-12-24 | 2012-05-02 | L-1 Secure Credentialing, Inc. | Method for full color laser marking of id documents |
US6843422B2 (en) * | 2001-12-24 | 2005-01-18 | Digimarc Corporation | Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same |
US7728048B2 (en) | 2002-12-20 | 2010-06-01 | L-1 Secure Credentialing, Inc. | Increasing thermal conductivity of host polymer used with laser engraving methods and compositions |
US7207494B2 (en) | 2001-12-24 | 2007-04-24 | Digimarc Corporation | Laser etched security features for identification documents and methods of making same |
AU2002364255A1 (en) | 2001-12-24 | 2003-07-15 | Digimarc Id Systems, Llc | Covert variable information on id documents and methods of making same |
WO2003088144A2 (en) | 2002-04-09 | 2003-10-23 | Digimarc Id Systems, Llc | Image processing techniques for printing identification cards and documents |
US7824029B2 (en) | 2002-05-10 | 2010-11-02 | L-1 Secure Credentialing, Inc. | Identification card printer-assembler for over the counter card issuing |
WO2004049242A2 (en) | 2002-11-26 | 2004-06-10 | Digimarc Id Systems | Systems and methods for managing and detecting fraud in image databases used with identification documents |
DE602004030434D1 (de) | 2003-04-16 | 2011-01-20 | L 1 Secure Credentialing Inc | Dreidimensionale datenspeicherung |
US7744002B2 (en) | 2004-03-11 | 2010-06-29 | L-1 Secure Credentialing, Inc. | Tamper evident adhesive and identification document including same |
DE102007062459B4 (de) | 2007-12-22 | 2022-10-27 | Leuze Electronic Gmbh + Co. Kg | Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile |
JP5720695B2 (ja) * | 2010-10-29 | 2015-05-20 | コニカミノルタ株式会社 | 成形型及びマイクロチップ製造装置 |
NO20130600A1 (no) * | 2013-04-30 | 2014-10-31 | Sinvent As | Lab-on-a-chip-system og fremstillingsmåte for samme |
GB2542712B (en) * | 2015-09-25 | 2019-04-10 | Gr8 Eng Ltd | Injection moulding method |
DE102015119235B4 (de) * | 2015-11-09 | 2019-01-10 | Selectrona GmbH | Vorrichtung zum Spritzgießen und Umspritzen von Objekten |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
PL3491584T3 (pl) | 2016-07-27 | 2022-11-07 | Composecure Llc | Elektroniczne komponenty do kart transakcyjnych i sposoby ich wytwarzania |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
CN111201538A (zh) | 2017-09-07 | 2020-05-26 | 安全创造有限责任公司 | 具有嵌入式电子部件的交易卡及其制造方法 |
DK3698280T3 (da) | 2017-10-18 | 2022-10-31 | Composecure Llc | Metal-, keramik- eller keramikbelagt transaktionskort med vindue eller vinduesmønster og eventuelt baggrundsbelysning |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
DE102021210271A1 (de) * | 2021-09-16 | 2023-03-16 | Magna Exteriors Gmbh | Verfahren zum Herstellen von Kunststoffbauteilen |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3030666A (en) * | 1960-01-07 | 1962-04-24 | Owens Illinois Glass Co | Method for low pressure molding |
DE1729368A1 (de) * | 1967-10-13 | 1971-06-09 | Per Thorkildsen | Verfahren und Vorrichtung zur Herstellung von dekorierten,spritzgegossenen Plastgegenstaenden |
US4184835A (en) * | 1978-09-28 | 1980-01-22 | General Electric Company | Mold apparatus |
DE3029667A1 (de) * | 1980-08-05 | 1982-03-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-baustein |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
JPS6058010B2 (ja) * | 1981-04-14 | 1985-12-18 | 三井化学株式会社 | 射出圧縮成形方法 |
US4470786A (en) * | 1981-07-28 | 1984-09-11 | Omron Tateisi Electronics Co. | Molding apparatus with retractable preform support pins |
JPS5839425A (ja) * | 1981-09-04 | 1983-03-08 | Hashimoto Forming Co Ltd | 低圧射出成形法 |
FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
DD230476A3 (de) * | 1983-03-25 | 1985-12-04 | Schwarzenberg Waschgeraete | Verfahren zur herstellung von spritzgussteilen mit aussparungen |
JPS59185636A (ja) * | 1983-04-08 | 1984-10-22 | Ricoh Co Ltd | 射出圧縮成形法 |
US4540534A (en) * | 1983-10-11 | 1985-09-10 | American Optical Corporation | Apparatus and method for injection molding lenses |
JPS60193347A (ja) * | 1984-03-15 | 1985-10-01 | Toshiba Corp | 半導体製造装置 |
JPS6168209A (ja) * | 1984-09-12 | 1986-04-08 | Aisin Seiki Co Ltd | ポリアミド成形品の成形加工法 |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
JPS6213094A (ja) * | 1985-07-10 | 1987-01-21 | 三井化学株式会社 | 配線用プリント基板の製法及びその装置 |
FR2599165A1 (fr) * | 1986-05-21 | 1987-11-27 | Michot Gerard | Objet associe a un element electronique et procede d'obtention |
US4980115A (en) * | 1987-05-28 | 1990-12-25 | Yoshida Industry Co. Ltd. | Method for making an injection-molded product having a partly thin portion |
US5304513A (en) * | 1987-07-16 | 1994-04-19 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame |
US4954308A (en) * | 1988-03-04 | 1990-09-04 | Citizen Watch Co., Ltd. | Resin encapsulating method |
US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
US4944908A (en) * | 1988-10-28 | 1990-07-31 | Eaton Corporation | Method for forming a molded plastic article |
US5417905A (en) * | 1989-05-26 | 1995-05-23 | Esec (Far East) Limited | Method of making a card having decorations on both faces |
-
1992
- 1992-05-07 ES ES92909860T patent/ES2082470T5/es not_active Expired - Lifetime
- 1992-05-07 DE DE59205116T patent/DE59205116D1/de not_active Expired - Fee Related
- 1992-05-07 EP EP92909860A patent/EP0584143B2/de not_active Expired - Lifetime
- 1992-05-07 WO PCT/EP1992/000991 patent/WO1992020506A1/de active IP Right Grant
- 1992-05-07 US US08/146,087 patent/US5681356A/en not_active Expired - Fee Related
- 1992-05-07 DK DK92909860.6T patent/DK0584143T3/da active
- 1992-05-07 JP JP50898592A patent/JP3290986B2/ja not_active Expired - Fee Related
- 1992-05-07 AT AT92909860T patent/ATE133105T1/de not_active IP Right Cessation
-
1996
- 1996-02-14 GR GR960400356T patent/GR3018955T3/el unknown
-
1998
- 1998-06-26 HK HK98106916A patent/HK1007705A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0584143B2 (de) | 2003-04-16 |
JPH06507126A (ja) | 1994-08-11 |
EP0584143B1 (de) | 1996-01-17 |
DK0584143T3 (da) | 1996-02-12 |
EP0584143A1 (de) | 1994-03-02 |
ATE133105T1 (de) | 1996-02-15 |
GR3018955T3 (en) | 1996-05-31 |
US5681356A (en) | 1997-10-28 |
HK1007705A1 (en) | 1999-04-23 |
ES2082470T3 (es) | 1996-03-16 |
DE59205116D1 (de) | 1996-02-29 |
JP3290986B2 (ja) | 2002-06-10 |
WO1992020506A1 (de) | 1992-11-26 |
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