ES2082470T5 - Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. - Google Patents

Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.

Info

Publication number
ES2082470T5
ES2082470T5 ES92909860T ES92909860T ES2082470T5 ES 2082470 T5 ES2082470 T5 ES 2082470T5 ES 92909860 T ES92909860 T ES 92909860T ES 92909860 T ES92909860 T ES 92909860T ES 2082470 T5 ES2082470 T5 ES 2082470T5
Authority
ES
Spain
Prior art keywords
plastic material
manufacture
zones
procedure
wall thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92909860T
Other languages
English (en)
Other versions
ES2082470T3 (es
Inventor
Renee-Lucia Barak
Yahya Haghiri-Tehrani
Helmut Baader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GAO Gesellschaft fuer Automation und Organisation mbH
Original Assignee
GAO Gesellschaft fuer Automation und Organisation mbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25903497&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2082470(T5) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from DE19914115208 external-priority patent/DE4115208C2/de
Priority claimed from DE19914142392 external-priority patent/DE4142392C2/de
Application filed by GAO Gesellschaft fuer Automation und Organisation mbH filed Critical GAO Gesellschaft fuer Automation und Organisation mbH
Publication of ES2082470T3 publication Critical patent/ES2082470T3/es
Application granted granted Critical
Publication of ES2082470T5 publication Critical patent/ES2082470T5/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B29C45/14016—Intermittently feeding endless articles, e.g. transfer films, to the mould
    • B29C45/14024—Intermittently feeding endless articles, e.g. transfer films, to the mould and punching or cutting a portion from the endless articles during mould closing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C2045/569—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding using a mould part for decreasing and a mould part for increasing the volume of the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

EL PROCESO DE ACUERDO CON LA INVENCION PARA LA FABRICACION DE TARJETAS DE PLASTICO LIGERAS Y PIEZAS EN BRUTO PARA TARJETAS DE PLASTICO CON ZONAS DE PARED DE ESPESOR NOTABLEMENTE REDUCIDO, PREVE INYECTAR EL MATERIAL DE PLASTICO PRIMERAMENTE EN UNA CAVIDAD DE MOLDEO INICIAL QUE NO TIENE ZONAS DE PARED DE ESPESOR REDUCIDO. A CONTINUACION SE REDUCE LA DISTANCIA ENTRE CIERTAS REGIONES DE PARED DE LA CAVIDAD DE MOLDEO INICIAL HASTA LA DIMENSION EXIGIDA CON DESPLAZAMIENTO DEL MATERIAL PLASTICO A LAS ZONAS VECINAS DE LA CAVIDAD DE MOLDEO.
ES92909860T 1991-05-10 1992-05-07 Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas. Expired - Lifetime ES2082470T5 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19914115208 DE4115208C2 (de) 1991-05-10 1991-05-10 Verfahren und Vorrichtung zum Herstellen von Kunststoff-Formstücken mit bereichsweise reduzierter Wandstärke
DE19914142392 DE4142392C2 (de) 1991-12-20 1991-12-20 Verfahren und Vorrichtung zum Herstellen von spritzgegossenen Chipkarten mit bereichsweise reduzierter Wandstärke

Publications (2)

Publication Number Publication Date
ES2082470T3 ES2082470T3 (es) 1996-03-16
ES2082470T5 true ES2082470T5 (es) 2003-12-16

Family

ID=25903497

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92909860T Expired - Lifetime ES2082470T5 (es) 1991-05-10 1992-05-07 Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.

Country Status (10)

Country Link
US (1) US5681356A (es)
EP (1) EP0584143B2 (es)
JP (1) JP3290986B2 (es)
AT (1) ATE133105T1 (es)
DE (1) DE59205116D1 (es)
DK (1) DK0584143T3 (es)
ES (1) ES2082470T5 (es)
GR (1) GR3018955T3 (es)
HK (1) HK1007705A1 (es)
WO (1) WO1992020506A1 (es)

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ES2102317B1 (es) * 1994-09-19 1998-04-16 Nacional Moneda Timbre Tarjeta inteligente de uso en telefonia y similar.
FR2735714B1 (fr) * 1995-06-21 1997-07-25 Schlumberger Ind Sa Procede pour imprimer un graphisme sur une carte a memoire
US5975584A (en) * 1996-08-30 1999-11-02 Adaptech S.A. Carrier card with value chip
US6190942B1 (en) * 1996-10-09 2001-02-20 Pav Card Gmbh Method and connection arrangement for producing a smart card
US5823071A (en) * 1996-10-31 1998-10-20 Borg-Warner Automotive, Inc. Integrated transmission control system
DE19703122C1 (de) * 1997-01-29 1998-05-20 Orga Kartensysteme Gmbh Verfahren zur Herstellung von Datenträgern
DE19736082C1 (de) 1997-08-20 1999-01-14 Orga Kartensysteme Gmbh Verfahren und Herstellen einer Chipkarte und Vorrichtung zur Durchführung des Verfahrens
FR2778002B1 (fr) * 1998-04-22 2000-06-30 Gemplus Card Int Procede de fabrication d'une carte a circuit integre a contact et une carte obtenue selon ce procede
EP1076315B1 (de) * 1999-08-12 2005-02-02 OVD Kinegram AG Datenträger
JP4606553B2 (ja) * 2000-08-11 2011-01-05 大日本印刷株式会社 カード状基材の製造用金型およびカード状基材の製造方法
US6923378B2 (en) * 2000-12-22 2005-08-02 Digimarc Id Systems Identification card
US6588099B2 (en) * 2001-01-22 2003-07-08 Sankyo Kasei Kabushiki Kaisha Process for manufacturing molded circuit board
CN1527760A (zh) * 2001-02-22 2004-09-08 - 用于生产具有可分离模块的光盘的方法
EP1249330A1 (de) * 2001-04-12 2002-10-16 Dynamit Nobel Kunststoff GmbH Verfahren zur Herstellung eines Kunststoff-Bauteils und Bauteil
DK1456810T3 (da) 2001-12-18 2011-07-18 L 1 Secure Credentialing Inc Multiple billedsikkerhedstræk til at identificere dokumenter og fremgangsmåder til fremstilling deraf
FR2834103B1 (fr) * 2001-12-20 2004-04-02 Gemplus Card Int Carte a puce a module de surface etendue
US7694887B2 (en) 2001-12-24 2010-04-13 L-1 Secure Credentialing, Inc. Optically variable personalized indicia for identification documents
EP1459246B1 (en) 2001-12-24 2012-05-02 L-1 Secure Credentialing, Inc. Method for full color laser marking of id documents
US6843422B2 (en) * 2001-12-24 2005-01-18 Digimarc Corporation Contact smart cards having a document core, contactless smart cards including multi-layered structure, pet-based identification document, and methods of making same
US7728048B2 (en) 2002-12-20 2010-06-01 L-1 Secure Credentialing, Inc. Increasing thermal conductivity of host polymer used with laser engraving methods and compositions
US7207494B2 (en) 2001-12-24 2007-04-24 Digimarc Corporation Laser etched security features for identification documents and methods of making same
AU2002364255A1 (en) 2001-12-24 2003-07-15 Digimarc Id Systems, Llc Covert variable information on id documents and methods of making same
WO2003088144A2 (en) 2002-04-09 2003-10-23 Digimarc Id Systems, Llc Image processing techniques for printing identification cards and documents
US7824029B2 (en) 2002-05-10 2010-11-02 L-1 Secure Credentialing, Inc. Identification card printer-assembler for over the counter card issuing
WO2004049242A2 (en) 2002-11-26 2004-06-10 Digimarc Id Systems Systems and methods for managing and detecting fraud in image databases used with identification documents
DE602004030434D1 (de) 2003-04-16 2011-01-20 L 1 Secure Credentialing Inc Dreidimensionale datenspeicherung
US7744002B2 (en) 2004-03-11 2010-06-29 L-1 Secure Credentialing, Inc. Tamper evident adhesive and identification document including same
DE102007062459B4 (de) 2007-12-22 2022-10-27 Leuze Electronic Gmbh + Co. Kg Vorrichtung zum Verbinden zweier optischer und/oder elektronischer Bauteile
JP5720695B2 (ja) * 2010-10-29 2015-05-20 コニカミノルタ株式会社 成形型及びマイクロチップ製造装置
NO20130600A1 (no) * 2013-04-30 2014-10-31 Sinvent As Lab-on-a-chip-system og fremstillingsmåte for samme
GB2542712B (en) * 2015-09-25 2019-04-10 Gr8 Eng Ltd Injection moulding method
DE102015119235B4 (de) * 2015-11-09 2019-01-10 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
PL3491584T3 (pl) 2016-07-27 2022-11-07 Composecure Llc Elektroniczne komponenty do kart transakcyjnych i sposoby ich wytwarzania
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
CN111201538A (zh) 2017-09-07 2020-05-26 安全创造有限责任公司 具有嵌入式电子部件的交易卡及其制造方法
DK3698280T3 (da) 2017-10-18 2022-10-31 Composecure Llc Metal-, keramik- eller keramikbelagt transaktionskort med vindue eller vinduesmønster og eventuelt baggrundsbelysning
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card
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Also Published As

Publication number Publication date
EP0584143B2 (de) 2003-04-16
JPH06507126A (ja) 1994-08-11
EP0584143B1 (de) 1996-01-17
DK0584143T3 (da) 1996-02-12
EP0584143A1 (de) 1994-03-02
ATE133105T1 (de) 1996-02-15
GR3018955T3 (en) 1996-05-31
US5681356A (en) 1997-10-28
HK1007705A1 (en) 1999-04-23
ES2082470T3 (es) 1996-03-16
DE59205116D1 (de) 1996-02-29
JP3290986B2 (ja) 2002-06-10
WO1992020506A1 (de) 1992-11-26

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