DE3667345D1 - Verfahren zur herstellung von karten mit elektronischem speicher und derartig hergestellte karten. - Google Patents

Verfahren zur herstellung von karten mit elektronischem speicher und derartig hergestellte karten.

Info

Publication number
DE3667345D1
DE3667345D1 DE8686400670T DE3667345T DE3667345D1 DE 3667345 D1 DE3667345 D1 DE 3667345D1 DE 8686400670 T DE8686400670 T DE 8686400670T DE 3667345 T DE3667345 T DE 3667345T DE 3667345 D1 DE3667345 D1 DE 3667345D1
Authority
DE
Germany
Prior art keywords
cards
bumps
production
electronic module
electronic memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686400670T
Other languages
English (en)
Inventor
Jean-Paul Mollet
Alain Rebjock
Jean-Louis Hayart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger SA filed Critical Schlumberger SA
Application granted granted Critical
Publication of DE3667345D1 publication Critical patent/DE3667345D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Holo Graphy (AREA)
  • Photoreceptors In Electrophotography (AREA)
DE8686400670T 1985-03-28 1986-03-27 Verfahren zur herstellung von karten mit elektronischem speicher und derartig hergestellte karten. Expired - Lifetime DE3667345D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8504658A FR2579799B1 (fr) 1985-03-28 1985-03-28 Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede

Publications (1)

Publication Number Publication Date
DE3667345D1 true DE3667345D1 (de) 1990-01-11

Family

ID=9317687

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686400670T Expired - Lifetime DE3667345D1 (de) 1985-03-28 1986-03-27 Verfahren zur herstellung von karten mit elektronischem speicher und derartig hergestellte karten.

Country Status (8)

Country Link
US (1) US4737620A (de)
EP (1) EP0197847B1 (de)
JP (1) JPS61227094A (de)
AT (1) ATE48484T1 (de)
CA (1) CA1255388A (de)
DE (1) DE3667345D1 (de)
ES (2) ES8706990A1 (de)
FR (1) FR2579799B1 (de)

Families Citing this family (58)

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JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4996411A (en) * 1986-07-24 1991-02-26 Schlumberger Industries Method of manufacturing a card having electronic memory and a card obtained by performing said method
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
FR2613510A1 (fr) * 1987-03-31 1988-10-07 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes a memoire ainsi obtenues
CH672285A5 (de) * 1987-04-14 1989-11-15 Landis & Gyr Ag
JP2562476B2 (ja) * 1987-06-11 1996-12-11 大日本印刷株式会社 １ｃカードの製造方法
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
US4921160A (en) * 1988-02-29 1990-05-01 American Telephone And Telegraph Company Personal data card and method of constructing the same
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
US5282113A (en) * 1990-03-05 1994-01-25 Hitachi Maxell, Ltd. Memory card with a plurality of contact spaces
FR2664076A1 (fr) * 1990-03-28 1992-01-03 Schlumberger Ind Sa Procede de fabrication d'une carte a memoire electronique.
EP0472768A1 (de) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Verfahren zum Befestigen eines Chipmoduls auf einer Chipkarte
FR2668096B1 (fr) * 1990-10-19 1993-01-22 Schlumberger Ind Sa Procede de fabrication de carte a memoire apte a recevoir une image photographique et carte ainsi obtenue.
DE59205116D1 (de) * 1991-05-10 1996-02-29 Gao Ges Automation Org Verfahren und vorrichtung zum herstellen von kunststoff-formstücken mit bereichsweise reduzierter wandstärke
FR2677785A1 (fr) * 1991-06-17 1992-12-18 Philips Composants Procede de fabrication d'une carte a microcircuit.
DE9110057U1 (de) * 1991-08-14 1992-02-20 Orga Kartensysteme Gmbh, 6072 Dreieich, De
DE4126874C2 (de) * 1991-08-14 1997-05-22 Orga Kartensysteme Gmbh Datenträger mit integriertem Schaltkreis
DE4140529C2 (de) * 1991-12-09 1997-07-31 Gao Ges Automation Org Verfahren zum Bedrucken von Karten mit sacklochförmiger Aussparung und Vorrichtung zur Ausführung des Verfahrens
DE4142409A1 (de) * 1991-12-20 1993-07-01 Gao Ges Automation Org Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens
FR2695854B1 (fr) * 1992-09-22 1994-12-09 Leroux Ets Gilles Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités.
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
CH688696A5 (fr) * 1993-03-17 1998-01-15 François Droz Procédé de fabrication d'une carte comprenant au moins un élément électronique.
JP3866282B2 (ja) * 1994-05-27 2007-01-10 アッサ アブロイ アイデンティフィケイション テクノロジー グループ エービー 電子モジュールの製造方法及びこの方法により得られた電子モジュール
US5837992A (en) * 1994-07-15 1998-11-17 Shinko Nameplate Co., Ltd. Memory card and its manufacturing method
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
FR2727542B1 (fr) * 1994-11-25 1997-01-03 Droz Francois Carte incorporant au moins un element electronique
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
US5952713A (en) * 1994-12-27 1999-09-14 Takahira; Kenichi Non-contact type IC card
DE19502398A1 (de) * 1995-01-26 1996-08-01 Giesecke & Devrient Gmbh Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper
AU1750995A (en) * 1995-01-27 1996-08-14 Interprint Formularios Ltda. Memory card and method of producing same
DE19601389A1 (de) * 1996-01-16 1997-07-24 Siemens Ag Chipkartenkörper
EP0917687B1 (de) * 1996-08-05 2001-04-18 Gemplus Verbesserung eines herstellungsverfahrens einer speicherkarte
DE19701165C1 (de) 1997-01-15 1998-04-09 Siemens Ag Chipkartenmodul
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
KR100255108B1 (en) * 1997-06-18 2000-05-01 Samsung Electronics Co Ltd Chip card
DE19749243C1 (de) 1997-11-07 1998-11-19 Richard Herbst Verfahren und Vorrichtung zum Herstellen von Verbundkörpern aus einer Kunststoffmasse
FR2774198B1 (fr) * 1998-01-27 2001-08-31 Solaic Sa Procede de fixation d'un module electronique dans une cavite d'un corps d'objet portable, notamment corps de carte, par ultrasons
DE19816066A1 (de) * 1998-04-09 1999-10-14 Philips Patentverwaltung Folie als Träger von integrierten Schaltungen
FR2803434A1 (fr) * 1999-12-30 2001-07-06 Schlumberger Systems & Service Procede de protection d'un circuit integre dispose dans une cavite d'un corps de carte et outil correspondant
FR2805067B1 (fr) 2000-02-15 2003-09-12 Bourgogne Grasset Jeton a puce electronique et procedes de fabrication d'un tel jeton
DE10006515C5 (de) * 2000-02-15 2004-09-16 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
JP4516179B2 (ja) * 2000-05-22 2010-08-04 大日本印刷株式会社 接触・非接触共用ｉｃカードの製造方法及び製造装置
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
US20090091424A1 (en) * 2007-10-05 2009-04-09 Manfred Rietzler Transponder inlay for a personal document and method of manufacturing same
ITRM20090236A1 (it) * 2009-05-12 2010-11-13 Gep S P A Sistema di collocazione stabile del modulo del chip di silicio nella cava generata sull inlay tramite deposito di materiale collante sintetico
FR2968432B1 (fr) * 2010-12-06 2012-12-28 Oberthur Technologies Procédé d'encartage d'un module dans une carte a microcircuit
US11618191B2 (en) 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
MX2019001144A (es) * 2016-07-27 2019-06-10 Composecure Llc Componentes electronicos sobremoldeados para tarjetas de transaccion y metodos para hacer los mismos.
US10977540B2 (en) 2016-07-27 2021-04-13 Composecure, Llc RFID device
US10762412B2 (en) 2018-01-30 2020-09-01 Composecure, Llc DI capacitive embedded metal card
US11151437B2 (en) 2017-09-07 2021-10-19 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
FI3679523T3 (fi) 2017-09-07 2023-05-05 Composecure Llc Maksukortti upotetuilla elektroniikkakomponenteilla ja menetelmä sen valmistamiseksi
HUE060022T2 (hu) 2017-10-18 2023-01-28 Composecure Llc Fém, kerámia vagy kerámiabevonatos tranzakciókártya ablakkal vagy ablakmintával és opcionális háttévilágítással
USD948613S1 (en) 2020-04-27 2022-04-12 Composecure, Llc Layer of a transaction card

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US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
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DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby

Also Published As

Publication number Publication date
ES297137Y (es) 1989-10-16
FR2579799B1 (fr) 1990-06-22
FR2579799A1 (fr) 1986-10-03
ES297137U (es) 1989-04-01
EP0197847A1 (de) 1986-10-15
ES8706990A1 (es) 1987-06-16
JPS61227094A (ja) 1986-10-09
US4737620A (en) 1988-04-12
EP0197847B1 (de) 1989-12-06
ES553359A0 (es) 1987-06-16
CA1255388A (en) 1989-06-06
ATE48484T1 (de) 1989-12-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AXALTO S.A., MONTROUGE, FR