BR9808171A - Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange - Google Patents

Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange

Info

Publication number
BR9808171A
BR9808171A BR9808171-3A BR9808171A BR9808171A BR 9808171 A BR9808171 A BR 9808171A BR 9808171 A BR9808171 A BR 9808171A BR 9808171 A BR9808171 A BR 9808171A
Authority
BR
Brazil
Prior art keywords
chip card
semiconductor chip
smart card
card module
covers
Prior art date
Application number
BR9808171-3A
Other languages
English (en)
Inventor
Detlef Houdeau
Frank Pueschner
Peter Stampka
Michael Huber
Josef Heitzer
Josef Mundigl
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR9808171A publication Critical patent/BR9808171A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Patente de Invenção: <B>"MóDULO DE CARTãO CHIP E CARTãO CHIP QUE O ABRANGE"<D>. A invenção refere-se a um módulo de cartão chip (1) que abrange um chip semicondutor que está contactado com um quadro de conexão (2) metálico, conduzindo eletricidade, estando configuradas fases de contacto (3) neste quadro de conexão (2). O chip semicondutor e as faces de contacto (3) são contactadas, conduzindo eletricidade, através de faces de conexão (5) dispostas na superfície (4) de uma camada protetora isolante de eletricidade, aplicada no chip semicondutor. A contactação entre as faces de acoplamento (5) e as faces de contacto (3) pode ser produzida com ligações de solda (6) ou ligações de cola condutoras de eletricidade. Além disso, a invenção refere-se a um cartão chip (10) que abrange o módulo de cartão chip (1) de acordo com a invenção.
BR9808171-3A 1997-03-03 1998-02-06 Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange BR9808171A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19708617A DE19708617C2 (de) 1997-03-03 1997-03-03 Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
PCT/DE1998/000349 WO1998039733A1 (de) 1997-03-03 1998-02-06 Chipkartenmodul und diesen umfassende chipkarte

Publications (1)

Publication Number Publication Date
BR9808171A true BR9808171A (pt) 2000-05-16

Family

ID=7822094

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9808171-3A BR9808171A (pt) 1997-03-03 1998-02-06 Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange

Country Status (12)

Country Link
US (1) US6191951B1 (pt)
EP (1) EP0965103B1 (pt)
JP (1) JP2001513928A (pt)
KR (1) KR20000075916A (pt)
CN (1) CN1191617C (pt)
AT (1) ATE222387T1 (pt)
BR (1) BR9808171A (pt)
DE (2) DE19708617C2 (pt)
ES (1) ES2182279T3 (pt)
RU (1) RU2217795C2 (pt)
UA (1) UA58538C2 (pt)
WO (1) WO1998039733A1 (pt)

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DE19844965A1 (de) * 1998-09-30 2000-04-13 Siemens Ag Chipkartenmodul und Chipkarte
FR2785072B1 (fr) * 1998-10-23 2001-01-19 St Microelectronics Sa Circuit electronique autocollant
DE19940564C2 (de) * 1999-08-26 2002-03-21 Infineon Technologies Ag Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls
DE19955537B4 (de) * 1999-11-18 2006-04-13 Orga Kartensysteme Gmbh Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein
DE10006514C5 (de) * 2000-02-15 2004-08-12 Datacard Corp., Minnetonka Verfahren zum Einbau von Chips in Kartenkörper
US6462273B1 (en) 2001-03-16 2002-10-08 Micron Technology, Inc. Semiconductor card and method of fabrication
DE10145752B4 (de) * 2001-09-17 2004-09-02 Infineon Technologies Ag Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist
US6910635B1 (en) * 2002-10-08 2005-06-28 Amkor Technology, Inc. Die down multi-media card and method of making same
DE10356153B4 (de) 2003-12-02 2010-01-14 Infineon Technologies Ag Modul für kontaktlose Chipkarten oder Identifizierungssysteme
US7459376B2 (en) * 2005-02-04 2008-12-02 Infineon Technologies Ag Dissociated fabrication of packages and chips of integrated circuits
TW200905574A (en) * 2007-07-03 2009-02-01 Textilma Ag Rfid transponder chip module with connecting means for an antenna, textile tag with an rfid transponder chip module, and use of an rfid transponder chip module
US8358155B2 (en) * 2008-01-29 2013-01-22 Oracle America, Inc. Circuit that facilitates proximity communication
FR2929728B1 (fr) * 2008-04-02 2011-01-14 Eads Europ Aeronautic Defence Procede de determination du pronostic de fonctionnement d'un systeme.
DE102008024823A1 (de) * 2008-05-23 2009-12-10 Smartrac Ip B.V. Chipkarte mit einer Mehrzahl von Komponenten
RU2414749C1 (ru) * 2008-08-08 2011-03-20 Вячеслав Олегович Долгих Персональный носитель данных
TWM362572U (en) * 2009-04-13 2009-08-01 Phytrex Technology Corp Signal convertor
KR101073440B1 (ko) * 2011-05-16 2011-10-17 강수향 기폭제를 이용한 카드 및 그 제조방법
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9257341B2 (en) 2013-07-02 2016-02-09 Texas Instruments Incorporated Method and structure of packaging semiconductor devices
US20150008566A1 (en) * 2013-07-02 2015-01-08 Texas Instruments Incorporated Method and structure of panelized packaging of semiconductor devices
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN107025481B (zh) * 2016-02-02 2021-08-20 上海伯乐电子有限公司 柔性印制电路板及应用其的智能卡模块和智能卡
US10879144B2 (en) 2018-08-14 2020-12-29 Texas Instruments Incorporated Semiconductor package with multilayer mold

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FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE8122540U1 (de) * 1981-07-31 1983-01-13 Philips Patentverwaltung Gmbh, 2000 Hamburg "informationskarte mit integriertem baustein"
FR2581480A1 (fr) 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
FR2584235B1 (fr) 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
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FR2625067A1 (fr) * 1987-12-22 1989-06-23 Sgs Thomson Microelectronics Procede pour fixer sur un support un composant electronique et ses contacts
JPH063819B2 (ja) * 1989-04-17 1994-01-12 セイコーエプソン株式会社 半導体装置の実装構造および実装方法
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DE9422424U1 (de) * 1994-02-04 2002-02-21 Giesecke & Devrient GmbH, 81677 München Chipkarte mit einem elektronischen Modul
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
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DE4424396C2 (de) * 1994-07-11 1996-12-12 Ibm Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten
DE19512191C2 (de) * 1995-03-31 2000-03-09 Siemens Ag Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger
KR0169820B1 (ko) * 1995-08-22 1999-01-15 김광호 금속 회로 기판을 갖는 칩 스케일 패키지
DE19532755C1 (de) * 1995-09-05 1997-02-20 Siemens Ag Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls

Also Published As

Publication number Publication date
WO1998039733A1 (de) 1998-09-11
EP0965103B1 (de) 2002-08-14
ES2182279T3 (es) 2003-03-01
DE19708617A1 (de) 1998-09-10
US6191951B1 (en) 2001-02-20
UA58538C2 (uk) 2003-08-15
EP0965103A1 (de) 1999-12-22
ATE222387T1 (de) 2002-08-15
CN1249835A (zh) 2000-04-05
RU2217795C2 (ru) 2003-11-27
CN1191617C (zh) 2005-03-02
KR20000075916A (ko) 2000-12-26
DE19708617C2 (de) 1999-02-04
JP2001513928A (ja) 2001-09-04
DE59805191D1 (de) 2002-09-19

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A, 9A E 10A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1971 DE 14/10/2008.