BR9808171A - Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange - Google Patents
Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrangeInfo
- Publication number
- BR9808171A BR9808171A BR9808171-3A BR9808171A BR9808171A BR 9808171 A BR9808171 A BR 9808171A BR 9808171 A BR9808171 A BR 9808171A BR 9808171 A BR9808171 A BR 9808171A
- Authority
- BR
- Brazil
- Prior art keywords
- chip card
- semiconductor chip
- smart card
- card module
- covers
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Patente de Invenção: <B>"MóDULO DE CARTãO CHIP E CARTãO CHIP QUE O ABRANGE"<D>. A invenção refere-se a um módulo de cartão chip (1) que abrange um chip semicondutor que está contactado com um quadro de conexão (2) metálico, conduzindo eletricidade, estando configuradas fases de contacto (3) neste quadro de conexão (2). O chip semicondutor e as faces de contacto (3) são contactadas, conduzindo eletricidade, através de faces de conexão (5) dispostas na superfície (4) de uma camada protetora isolante de eletricidade, aplicada no chip semicondutor. A contactação entre as faces de acoplamento (5) e as faces de contacto (3) pode ser produzida com ligações de solda (6) ou ligações de cola condutoras de eletricidade. Além disso, a invenção refere-se a um cartão chip (10) que abrange o módulo de cartão chip (1) de acordo com a invenção.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19708617A DE19708617C2 (de) | 1997-03-03 | 1997-03-03 | Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte |
PCT/DE1998/000349 WO1998039733A1 (de) | 1997-03-03 | 1998-02-06 | Chipkartenmodul und diesen umfassende chipkarte |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9808171A true BR9808171A (pt) | 2000-05-16 |
Family
ID=7822094
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9808171-3A BR9808171A (pt) | 1997-03-03 | 1998-02-06 | Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange |
Country Status (12)
Country | Link |
---|---|
US (1) | US6191951B1 (pt) |
EP (1) | EP0965103B1 (pt) |
JP (1) | JP2001513928A (pt) |
KR (1) | KR20000075916A (pt) |
CN (1) | CN1191617C (pt) |
AT (1) | ATE222387T1 (pt) |
BR (1) | BR9808171A (pt) |
DE (2) | DE19708617C2 (pt) |
ES (1) | ES2182279T3 (pt) |
RU (1) | RU2217795C2 (pt) |
UA (1) | UA58538C2 (pt) |
WO (1) | WO1998039733A1 (pt) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19844965A1 (de) * | 1998-09-30 | 2000-04-13 | Siemens Ag | Chipkartenmodul und Chipkarte |
FR2785072B1 (fr) * | 1998-10-23 | 2001-01-19 | St Microelectronics Sa | Circuit electronique autocollant |
DE19940564C2 (de) | 1999-08-26 | 2002-03-21 | Infineon Technologies Ag | Chipkartenmodul und diesen umfassende Chipkarte, sowie Verfahren zur Herstellung des Chipkartenmoduls |
DE19955537B4 (de) * | 1999-11-18 | 2006-04-13 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung eines Trägerelementes für einen IC-Baustein |
DE10006514C5 (de) * | 2000-02-15 | 2004-08-12 | Datacard Corp., Minnetonka | Verfahren zum Einbau von Chips in Kartenkörper |
US6462273B1 (en) | 2001-03-16 | 2002-10-08 | Micron Technology, Inc. | Semiconductor card and method of fabrication |
DE10145752B4 (de) * | 2001-09-17 | 2004-09-02 | Infineon Technologies Ag | Nicht-leitendes, ein Band oder einen Nutzen bildendes Substrat, auf dem eine Vielzahl von Trägerelementen ausgebildet ist |
US6910635B1 (en) * | 2002-10-08 | 2005-06-28 | Amkor Technology, Inc. | Die down multi-media card and method of making same |
DE10356153B4 (de) * | 2003-12-02 | 2010-01-14 | Infineon Technologies Ag | Modul für kontaktlose Chipkarten oder Identifizierungssysteme |
US7459376B2 (en) * | 2005-02-04 | 2008-12-02 | Infineon Technologies Ag | Dissociated fabrication of packages and chips of integrated circuits |
TW200905574A (en) * | 2007-07-03 | 2009-02-01 | Textilma Ag | Rfid transponder chip module with connecting means for an antenna, textile tag with an rfid transponder chip module, and use of an rfid transponder chip module |
US8358155B2 (en) * | 2008-01-29 | 2013-01-22 | Oracle America, Inc. | Circuit that facilitates proximity communication |
FR2929728B1 (fr) * | 2008-04-02 | 2011-01-14 | Eads Europ Aeronautic Defence | Procede de determination du pronostic de fonctionnement d'un systeme. |
DE102008024823A1 (de) * | 2008-05-23 | 2009-12-10 | Smartrac Ip B.V. | Chipkarte mit einer Mehrzahl von Komponenten |
RU2414749C1 (ru) * | 2008-08-08 | 2011-03-20 | Вячеслав Олегович Долгих | Персональный носитель данных |
TWM362572U (en) * | 2009-04-13 | 2009-08-01 | Phytrex Technology Corp | Signal convertor |
KR101073440B1 (ko) * | 2011-05-16 | 2011-10-17 | 강수향 | 기폭제를 이용한 카드 및 그 제조방법 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
USD703208S1 (en) | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
USD759022S1 (en) * | 2013-03-13 | 2016-06-14 | Nagrastar Llc | Smart card interface |
USD729808S1 (en) | 2013-03-13 | 2015-05-19 | Nagrastar Llc | Smart card interface |
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD758372S1 (en) | 2013-03-13 | 2016-06-07 | Nagrastar Llc | Smart card interface |
US9647997B2 (en) | 2013-03-13 | 2017-05-09 | Nagrastar, Llc | USB interface for performing transport I/O |
US20150008566A1 (en) * | 2013-07-02 | 2015-01-08 | Texas Instruments Incorporated | Method and structure of panelized packaging of semiconductor devices |
US9257341B2 (en) | 2013-07-02 | 2016-02-09 | Texas Instruments Incorporated | Method and structure of packaging semiconductor devices |
USD780763S1 (en) | 2015-03-20 | 2017-03-07 | Nagrastar Llc | Smart card interface |
USD864968S1 (en) | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
CN107025481B (zh) * | 2016-02-02 | 2021-08-20 | 上海伯乐电子有限公司 | 柔性印制电路板及应用其的智能卡模块和智能卡 |
US10879144B2 (en) | 2018-08-14 | 2020-12-29 | Texas Instruments Incorporated | Semiconductor package with multilayer mold |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
DE8122540U1 (de) * | 1981-07-31 | 1983-01-13 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "informationskarte mit integriertem baustein" |
FR2581480A1 (fr) | 1985-04-10 | 1986-11-07 | Ebauches Electroniques Sa | Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite |
FR2584235B1 (fr) | 1985-06-26 | 1988-04-22 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
FR2584236B1 (fr) * | 1985-06-26 | 1988-04-29 | Bull Sa | Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques |
US5122860A (en) * | 1987-08-26 | 1992-06-16 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit device and manufacturing method thereof |
FR2625067A1 (fr) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Procede pour fixer sur un support un composant electronique et ses contacts |
JPH063819B2 (ja) * | 1989-04-17 | 1994-01-12 | セイコーエプソン株式会社 | 半導体装置の実装構造および実装方法 |
WO1992013319A1 (de) * | 1991-01-28 | 1992-08-06 | Siemens Aktiengesellschaft | Verfahren zur herstellung einer tragbaren datenträgeranordnung |
KR940007757Y1 (ko) * | 1991-11-14 | 1994-10-24 | 금성일렉트론 주식회사 | 반도체 패키지 |
KR0152901B1 (ko) * | 1993-06-23 | 1998-10-01 | 문정환 | 플라스틱 반도체 패키지 및 그 제조방법 |
DE4403513A1 (de) * | 1994-02-04 | 1995-08-10 | Giesecke & Devrient Gmbh | Chipkarte mit einem elektronischen Modul und Verfahren zur Herstellung einer solchen Chipkarte |
EP0688050A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue |
IL110261A0 (en) * | 1994-07-10 | 1994-10-21 | Schellcase Ltd | Packaged integrated circuit |
DE4424396C2 (de) * | 1994-07-11 | 1996-12-12 | Ibm | Trägerelement zum Einbau in Chipkarten oder anderen Datenträgerkarten |
DE19512191C2 (de) * | 1995-03-31 | 2000-03-09 | Siemens Ag | Kartenförmiger Datenträger und Leadframe zur Verwendung in einem solchen Datenträger |
KR0169820B1 (ko) * | 1995-08-22 | 1999-01-15 | 김광호 | 금속 회로 기판을 갖는 칩 스케일 패키지 |
DE19532755C1 (de) * | 1995-09-05 | 1997-02-20 | Siemens Ag | Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls |
-
1997
- 1997-03-03 DE DE19708617A patent/DE19708617C2/de not_active Expired - Fee Related
-
1998
- 1998-02-06 WO PCT/DE1998/000349 patent/WO1998039733A1/de not_active Application Discontinuation
- 1998-02-06 JP JP53804098A patent/JP2001513928A/ja active Pending
- 1998-02-06 KR KR1019997007996A patent/KR20000075916A/ko not_active Application Discontinuation
- 1998-02-06 ES ES98909358T patent/ES2182279T3/es not_active Expired - Lifetime
- 1998-02-06 BR BR9808171-3A patent/BR9808171A/pt not_active IP Right Cessation
- 1998-02-06 AT AT98909358T patent/ATE222387T1/de not_active IP Right Cessation
- 1998-02-06 RU RU99120781/09A patent/RU2217795C2/ru not_active IP Right Cessation
- 1998-02-06 CN CNB988029804A patent/CN1191617C/zh not_active Expired - Lifetime
- 1998-02-06 DE DE59805191T patent/DE59805191D1/de not_active Expired - Lifetime
- 1998-02-06 EP EP98909358A patent/EP0965103B1/de not_active Expired - Lifetime
- 1998-06-02 UA UA99094922A patent/UA58538C2/uk unknown
-
1999
- 1999-09-03 US US09/390,494 patent/US6191951B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
RU2217795C2 (ru) | 2003-11-27 |
CN1191617C (zh) | 2005-03-02 |
DE19708617C2 (de) | 1999-02-04 |
EP0965103B1 (de) | 2002-08-14 |
ATE222387T1 (de) | 2002-08-15 |
UA58538C2 (uk) | 2003-08-15 |
US6191951B1 (en) | 2001-02-20 |
EP0965103A1 (de) | 1999-12-22 |
WO1998039733A1 (de) | 1998-09-11 |
CN1249835A (zh) | 2000-04-05 |
KR20000075916A (ko) | 2000-12-26 |
DE59805191D1 (de) | 2002-09-19 |
JP2001513928A (ja) | 2001-09-04 |
ES2182279T3 (es) | 2003-03-01 |
DE19708617A1 (de) | 1998-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR9808171A (pt) | Módulo de cartão chip e processo para a sua fabricação, bem como cartão chip que o abrange | |
ES2125649T3 (es) | Elemento de soporte para circuito integrado. | |
MY141371A (en) | Smart card body, smart card and manufacturing process for same | |
US9792543B2 (en) | Transponder layer and method for the production thereof | |
WO1997011437A8 (de) | Ic-kartenmodul zur herstellung einer ic-karte sowie verfahren zur herstellung einer ic-karte | |
DE69805204D1 (de) | Chipkarte mit einem sicherheitssiegel | |
RU99120781A (ru) | Модуль для чип-карты и способ его изготовления, а также чип-карта, включающая в себя такой модуль | |
BR9912812A (pt) | Sensor biométrico e processo para produção do mesmo | |
AU2006252092A1 (en) | Card and manufacturing method | |
EP1115086A3 (en) | Non-contact type IC card and process for manufacturing same | |
DE50002616D1 (de) | Flächiger träger mit mindestens einem halbleiterchip | |
US10854804B2 (en) | Light-emitting component and method of producing a light-emitting component | |
KR101158128B1 (ko) | 기판 상에 전자 부품을 장착하는 방법 | |
CA2364448A1 (en) | Electronic tag assembly and method therefor | |
CN109409486B (zh) | 一种智能卡及其加工方法 | |
ATE298464T1 (de) | Elektronikmodul und seine montage | |
JP2007511811A5 (pt) | ||
KR20170098476A (ko) | 지문인식 센서 패키지 및 그 제조 방법 | |
WO2002047161A3 (fr) | Barriere anti debordement de colle fixation d'une puce semi-conductrice | |
CN107946200B (zh) | 指纹传感芯片的封装方法及封装指纹传感芯片 | |
FR2794265B1 (fr) | Procede de fabrication de cartes a puce a contact avec dielectrique bas cout | |
US6992898B2 (en) | Smart-card module with an anisotropically conductive substrate film | |
JP3888674B2 (ja) | 非接触データ通信媒体およびその製造方法 | |
JPS61258797A (ja) | Icカ−ド | |
JPS61131185A (ja) | Icカ−ド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 8A, 9A E 10A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1971 DE 14/10/2008. |