ES461390A1 - Procedimiento de fabricacion de conductores de conexion en- tre los componentes de un circuito electrico. - Google Patents
Procedimiento de fabricacion de conductores de conexion en- tre los componentes de un circuito electrico.Info
- Publication number
- ES461390A1 ES461390A1 ES461390A ES461390A ES461390A1 ES 461390 A1 ES461390 A1 ES 461390A1 ES 461390 A ES461390 A ES 461390A ES 461390 A ES461390 A ES 461390A ES 461390 A1 ES461390 A1 ES 461390A1
- Authority
- ES
- Spain
- Prior art keywords
- circuit
- components
- sheet
- intended
- conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Synchronous Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Motors, Generators (AREA)
Abstract
Procedimiento de fabricación de conductores de conexión entre los componentes de un circuito eléctrico, procedimiento según el cual, en primer lugar, se corta siguiendo el esquema del circuito a realizar, una hoja de metal conductor, a fin de dejar subsistir las partes de la hoja que están destinadas a formar los conductores del circuito, destinados a quedar unidos entre sí por los componentes del circuito y, en segundo lugar, se procede al sobremoldeo de la hoja cortada por una materia plática, eléctricamente aislante, dejando al descubierto las partes de la hoja destinadas a formar los puntos de conexión de los componentes y/o los puntos de paso de los órganos de fijación, caracterizado por el hecho de que se prevén, entre las partes de la hoja cortada, que están destinadas a formar los conductores del circuito, puentes de unión mecánica constituídos por zonas estrechas de metal conductor, adecuadamente posicionadas sobre la superficie ocupada por la hoja, para asegurar una buena rigidezde la hoja cortada por, al menos, un puente de unión, y de que se procede al sobremoldeo de la hoja cortada, estando previstos además vaciados en la materia plástica sobremoldeada a la altura de cada puente de unión mecánica, destinado a ser roto para constituir el circuito deseado.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7624204A FR2361007A1 (fr) | 1976-08-06 | 1976-08-06 | Procede de fabrication d'un circuit electrique notamment pour un pont redresseur d'alternateur de vehicule automobile |
Publications (1)
Publication Number | Publication Date |
---|---|
ES461390A1 true ES461390A1 (es) | 1978-12-01 |
Family
ID=9176659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES461390A Expired ES461390A1 (es) | 1976-08-06 | 1977-08-05 | Procedimiento de fabricacion de conductores de conexion en- tre los componentes de un circuito electrico. |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS6027158B2 (es) |
BR (1) | BR7705207A (es) |
DE (1) | DE2735124A1 (es) |
ES (1) | ES461390A1 (es) |
FR (1) | FR2361007A1 (es) |
GB (1) | GB1548517A (es) |
IT (1) | IT1083395B (es) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4430798A1 (de) * | 1994-08-30 | 1996-03-07 | Siemens Ag | Stanzgitter zur Verbindung von elektrischen Bauelementen |
FR2486323A1 (fr) * | 1980-07-04 | 1982-01-08 | Paris & Du Rhone | Ensemble regulateur et porte-balais pour alternateur, notamment de vehicule automobile |
FR2544581B1 (fr) * | 1983-04-14 | 1985-07-19 | Paris & Du Rhone | Pont redresseur pour alternateur de vehicule automobile, avec condensateur d'antiparasitage |
DE3515911A1 (de) * | 1985-05-03 | 1986-11-06 | SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen | Elektrischer schalter, insbesondere lenkstockschalter fuer kraftfahrzeuge |
DE3641995C1 (de) * | 1986-12-09 | 1988-05-19 | Philips Patentverwaltung | Verfahren zum Herstellen von gedruckten Schaltungen |
DE3728081A1 (de) * | 1987-08-22 | 1989-03-02 | Bosch Gmbh Robert | Gleichrichterlagereinrichtung |
DE3924176A1 (de) * | 1988-07-26 | 1990-02-01 | Steinmueller Kg Atlanta Kabel | Verfahren zur herstellung einer leiterplatine |
DE3943261C2 (de) * | 1989-12-29 | 1994-11-24 | Stocko Metallwarenfab Henkels | Elektrische Schaltung |
US5043614A (en) * | 1990-02-02 | 1991-08-27 | Ford Motor Company | Alternator rectifier bridge assembly |
KR0165544B1 (ko) * | 1990-03-05 | 1999-03-20 | 야마다 로꾸이찌 | 전자발음장치 |
DE4017673C2 (de) * | 1990-06-01 | 2001-02-01 | Teves Gmbh Alfred | Isolierstoffplatte für elektrische Schalter |
DE4323827C1 (de) * | 1993-07-15 | 1994-12-08 | Siemens Ag | Steckbare Baugruppe |
DE4327584A1 (de) * | 1993-08-17 | 1995-02-23 | Bayerische Motoren Werke Ag | Elektrische Antriebseinheit |
DE19531126C1 (de) * | 1995-08-24 | 1996-12-12 | Delphi Automotive Systems Gmbh | Verfahren zur Herstellung eines elektrischen Verbinders |
DE29516161U1 (de) * | 1995-10-12 | 1995-12-07 | Stocko Metallwarenfabriken Henkels Und Sohn Gmbh & Co, 42327 Wuppertal | Leiterplatte |
DE19707709C1 (de) * | 1997-02-26 | 1998-04-16 | Siemens Ag | Leiterplatte für elektrische Schaltungen und Verfahren zur Herstellung einer solchen Leiterplatte, sowie Anordnung einer Leiterplatte auf einem Stecksockel |
DE19712314A1 (de) * | 1997-03-24 | 1998-10-01 | Thomas & Betts Gmbh | Verbindung für die Zündeinrichtung von Airbag-Systemen in Kraftfahrzeugen |
DE19733237C1 (de) * | 1997-08-01 | 1999-05-20 | Barlian Reinhold | Elektrisches Gerät |
FR2872622B1 (fr) * | 2004-07-02 | 2006-09-29 | Valeo Securite Habitacle Sas | Procede de fabrication d'un dispositif electrique comportant des pistes conductrices croisees |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1156131B (de) * | 1958-06-23 | 1963-10-24 | Ibm Deutschland | Verfahren zur Herstellung eines elektrischen Leitungsmusters |
DE2305883A1 (de) * | 1973-02-07 | 1974-08-15 | Finsterhoelzl Rafi Elekt | Leiterplatte |
-
1976
- 1976-08-06 FR FR7624204A patent/FR2361007A1/fr active Granted
-
1977
- 1977-08-04 GB GB3279777A patent/GB1548517A/en not_active Expired
- 1977-08-04 DE DE19772735124 patent/DE2735124A1/de active Granted
- 1977-08-05 IT IT6882477A patent/IT1083395B/it active
- 1977-08-05 BR BR7705207A patent/BR7705207A/pt unknown
- 1977-08-05 ES ES461390A patent/ES461390A1/es not_active Expired
- 1977-08-06 JP JP9376377A patent/JPS6027158B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2735124A1 (de) | 1978-02-09 |
JPS5340889A (en) | 1978-04-13 |
GB1548517A (en) | 1979-07-18 |
BR7705207A (pt) | 1978-06-06 |
FR2361007A1 (fr) | 1978-03-03 |
IT1083395B (it) | 1985-05-21 |
JPS6027158B2 (ja) | 1985-06-27 |
DE2735124C2 (es) | 1988-10-13 |
FR2361007B1 (es) | 1981-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19981103 |