DK510382A - Fremgangsmaade til fremstilling af elektrisk ledende moenstre - Google Patents
Fremgangsmaade til fremstilling af elektrisk ledende moenstre Download PDFInfo
- Publication number
- DK510382A DK510382A DK510382A DK510382A DK510382A DK 510382 A DK510382 A DK 510382A DK 510382 A DK510382 A DK 510382A DK 510382 A DK510382 A DK 510382A DK 510382 A DK510382 A DK 510382A
- Authority
- DK
- Denmark
- Prior art keywords
- procedure
- manufacturing
- conductive patterns
- electric conductive
- electric
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813145585 DE3145585A1 (de) | 1981-11-17 | 1981-11-17 | Verfahren zur herstellung elektrisch leitfaehiger bereiche |
DE3145585 | 1981-11-17 |
Publications (3)
Publication Number | Publication Date |
---|---|
DK510382A true DK510382A (da) | 1983-05-18 |
DK161280B DK161280B (da) | 1991-06-17 |
DK161280C DK161280C (da) | 1991-12-02 |
Family
ID=6146592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK510382A DK161280C (da) | 1981-11-17 | 1982-11-16 | Fremgangsmaade til fremstilling af elektriske viklinger og elektriske ledende moenstre ved trykning med elektrisk ledende pasta |
Country Status (4)
Country | Link |
---|---|
US (1) | US4522671A (da) |
EP (1) | EP0079602B1 (da) |
DE (2) | DE3145585A1 (da) |
DK (1) | DK161280C (da) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3437527A1 (de) * | 1984-10-12 | 1986-04-17 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 8000 München | Anordnung von schaltungsbauteilen eines elektronischen vorschaltgeraetes zum betreiben einer niederdruckentladungslampe |
EP0199810B1 (en) * | 1984-11-05 | 1989-10-25 | JACOB SCHLAEPFER & CO. AG | Improvements in and relating to the production of transfers |
DE3738455A1 (de) * | 1986-11-25 | 1988-06-01 | Landis & Gyr Ag | Anordnung zum messen eines flussarmen magnetfeldes |
CH669852A5 (da) * | 1986-12-12 | 1989-04-14 | Lem Liaisons Electron Mec | |
DE3709206A1 (de) * | 1987-03-20 | 1988-09-29 | Standard Elektrik Lorenz Ag | Herstellverfahren fuer den leuchtschirm einer bildwiedergabevorrichtung |
EP0293678A1 (de) * | 1987-06-04 | 1988-12-07 | Robert Bosch Gmbh | Hochfrequenz-Spule |
US5066360A (en) * | 1990-09-24 | 1991-11-19 | International Business Machines Corp. | Pad printing of resist over via holes |
US5487214A (en) * | 1991-07-10 | 1996-01-30 | International Business Machines Corp. | Method of making a monolithic magnetic device with printed circuit interconnections |
US5430613A (en) * | 1993-06-01 | 1995-07-04 | Eaton Corporation | Current transformer using a laminated toroidal core structure and a lead frame |
US5619791A (en) * | 1994-06-30 | 1997-04-15 | Lucent Technologies Inc. | Method for fabricating highly conductive vias |
TW265450B (en) * | 1994-06-30 | 1995-12-11 | At & T Corp | Devices using metallized magnetic substrates |
DE4442346A1 (de) | 1994-11-29 | 1996-05-30 | Basf Ag | Verfahren zur Herstellung eines Katalysators, bestehend aus einem Trägerkörper und einer auf der Oberfläche des Trägerkörpers aufgebrachten katalytisch aktiven Oxidmasse |
US5781091A (en) * | 1995-07-24 | 1998-07-14 | Autosplice Systems Inc. | Electronic inductive device and method for manufacturing |
US5837609A (en) * | 1997-01-16 | 1998-11-17 | Ford Motor Company | Fully additive method of applying a circuit pattern to a three-dimensional, nonconductive part |
US6470803B1 (en) | 1997-12-17 | 2002-10-29 | Prime Perforating Systems Limited | Blasting machine and detonator apparatus |
AU2001271799A1 (en) * | 2000-06-30 | 2002-01-14 | President And Fellows Of Harvard College | Electric microcontact printing method and apparatus |
SG135065A1 (en) * | 2006-02-20 | 2007-09-28 | Micron Technology Inc | Conductive vias having two or more elements for providing communication between traces in different substrate planes, semiconductor device assemblies including such vias, and accompanying methods |
US7129567B2 (en) * | 2004-08-31 | 2006-10-31 | Micron Technology, Inc. | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements |
DE102005010645A1 (de) * | 2005-03-08 | 2005-08-04 | Basf Ag | Verfahren zum Befüllen eines Reaktors |
DE102007037248A1 (de) * | 2006-09-15 | 2008-03-27 | Samsung Electro - Mechanics Co., Ltd., Suwon | Verfahren zur Herstellung eines eine Metallfilm-Leiterbahn bildenden Körpers |
US20150053606A1 (en) | 2012-03-29 | 2015-02-26 | Kuraray Co., Ltd. | Nonwoven sheet, process for producing the same, and filter |
DE102012220022B4 (de) * | 2012-11-02 | 2014-09-25 | Festo Ag & Co. Kg | Verfahren zur Herstellung einer Spule und elektronisches Gerät |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB828291A (en) * | 1954-10-08 | 1960-02-17 | Burndept Ltd | Improvements in and relating to electric inductors |
DE1521441B1 (de) * | 1965-07-19 | 1970-04-30 | Photocircuits Corp | Verfahren zum Herstellen von metallisch leitenden Flaechen in Vertiefungen von Koerpern,insbesondere elektrischen Bauelementen |
GB1161774A (en) * | 1966-02-21 | 1969-08-20 | Int Standard Electric Corp | An Inductor on a Flat Insulating Substrate |
US3431350A (en) * | 1966-03-31 | 1969-03-04 | Texas Instruments Inc | Circuit board |
DE1614792A1 (de) * | 1967-03-23 | 1970-12-23 | Telefunken Patent | In Duenn-oder Dickfilmtechnik hergestellte Spule |
GB1196201A (en) * | 1967-09-19 | 1970-06-24 | Tokyo Shibaura Electric Co | A method of Printing Electrical Circuits onto Substrates |
US3887420A (en) * | 1971-04-30 | 1975-06-03 | Pictorial Prod Inc | Offset transfer of decalcomanias |
US3833872A (en) * | 1972-06-13 | 1974-09-03 | I Marcus | Microminiature monolithic ferroceramic transformer |
US3858138A (en) * | 1973-03-05 | 1974-12-31 | Rca Corp | Tuneable thin film inductor |
US3932251A (en) * | 1974-05-16 | 1976-01-13 | Tomoji Tanaka | Method for manufacturing an ink-containable stamp |
US4117588A (en) * | 1977-01-24 | 1978-10-03 | The United States Of America As Represented By The Secretary Of The Navy | Method of manufacturing three dimensional integrated circuits |
GB2045540B (en) * | 1978-12-28 | 1983-08-03 | Tdk Electronics Co Ltd | Electrical inductive device |
DE2913633C2 (de) * | 1979-04-05 | 1986-01-23 | Robert Bosch Gmbh, 7000 Stuttgart | Elektrochemischer Meßfühler für die Bestimmung des Sauerstoffgehaltes in Gasen, insbesondere in Abgasen von Verbrennungsmotoren sowie Verfahren zur Herstellung desselben |
US4264647A (en) * | 1979-04-17 | 1981-04-28 | General Motors Corporation | Reference electrode printing process and mask for exhaust gas oxygen sensor |
US4392905A (en) * | 1981-07-30 | 1983-07-12 | Dennison Manufacturing Company | Method of transferring designs onto articles |
JPS58140104A (ja) * | 1982-02-16 | 1983-08-19 | Olympus Optical Co Ltd | 電気コイル |
-
1981
- 1981-11-17 DE DE19813145585 patent/DE3145585A1/de active Granted
-
1982
- 1982-11-12 US US06/441,033 patent/US4522671A/en not_active Expired - Fee Related
- 1982-11-13 EP EP82110495A patent/EP0079602B1/de not_active Expired
- 1982-11-13 DE DE8282110495T patent/DE3275783D1/de not_active Expired
- 1982-11-16 DK DK510382A patent/DK161280C/da active
Also Published As
Publication number | Publication date |
---|---|
EP0079602A2 (de) | 1983-05-25 |
EP0079602B1 (de) | 1987-03-18 |
DE3145585C2 (da) | 1987-06-04 |
DE3275783D1 (en) | 1987-04-23 |
EP0079602A3 (en) | 1984-05-09 |
US4522671A (en) | 1985-06-11 |
DE3145585A1 (de) | 1983-05-26 |
DK161280C (da) | 1991-12-02 |
DK161280B (da) | 1991-06-17 |
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