ES2968152T3 - Formación directa y secuencial de monocapas de nitruro de boro y grafeno sobre sustratos - Google Patents

Formación directa y secuencial de monocapas de nitruro de boro y grafeno sobre sustratos Download PDF

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Publication number
ES2968152T3
ES2968152T3 ES14727142T ES14727142T ES2968152T3 ES 2968152 T3 ES2968152 T3 ES 2968152T3 ES 14727142 T ES14727142 T ES 14727142T ES 14727142 T ES14727142 T ES 14727142T ES 2968152 T3 ES2968152 T3 ES 2968152T3
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Spain
Prior art keywords
metal film
layer
semiconductor substrate
graphene
carbon
Prior art date
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Application number
ES14727142T
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English (en)
Spanish (es)
Inventor
Michael R Seacrist
Vikas Berry
Phong T Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalWafers Co Ltd
Kansas State University
Original Assignee
GlobalWafers Co Ltd
Kansas State University
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Priority claimed from US13/890,316 external-priority patent/US9029228B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/6902—Inorganic materials composed of carbon, e.g. alpha-C, diamond or hydrogen doped carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3246—Monolayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3406—Carbon, e.g. diamond-like carbon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/342—Boron nitride
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
    • H10P14/274—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition using seed materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Chemical Vapour Deposition (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Formation Of Insulating Films (AREA)
  • Laminated Bodies (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
ES14727142T 2013-05-09 2014-05-01 Formación directa y secuencial de monocapas de nitruro de boro y grafeno sobre sustratos Active ES2968152T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/890,316 US9029228B2 (en) 2011-10-19 2013-05-09 Direct and sequential formation of monolayers of boron nitride and graphene on substrates
PCT/US2014/036405 WO2014182540A1 (en) 2013-05-09 2014-05-01 Direct and sequential formation of monolayers of boron nitride and graphene on substrates

Publications (1)

Publication Number Publication Date
ES2968152T3 true ES2968152T3 (es) 2024-05-08

Family

ID=50841980

Family Applications (1)

Application Number Title Priority Date Filing Date
ES14727142T Active ES2968152T3 (es) 2013-05-09 2014-05-01 Formación directa y secuencial de monocapas de nitruro de boro y grafeno sobre sustratos

Country Status (5)

Country Link
EP (3) EP2994933B1 (enExample)
JP (3) JP6228293B2 (enExample)
KR (1) KR102202991B1 (enExample)
ES (1) ES2968152T3 (enExample)
WO (1) WO2014182540A1 (enExample)

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JP6213328B2 (ja) * 2014-03-20 2017-10-18 Jsr株式会社 膜形成用組成物、レジスト下層膜及びその形成方法並びにパターン形成方法
JP2017037820A (ja) * 2015-08-14 2017-02-16 アルプス電気株式会社 接点材料、接点材料の製造方法、コネクタ、および電子・電気部品
GB201514542D0 (en) * 2015-08-14 2015-09-30 Thomas Simon C S A method of producing graphene
CN109791876B (zh) * 2016-05-12 2023-08-15 环球晶圆股份有限公司 在硅基电介质上直接形成六方氮化硼
US11352692B2 (en) 2017-01-06 2022-06-07 Japan Science And Technology Agency Hexagonal boron nitride thin film and method for producing the same
CN107164739B (zh) * 2017-06-12 2023-03-10 中国科学技术大学 Cvd生长多层异质结的方法和装置
KR101971550B1 (ko) * 2017-07-26 2019-04-23 주식회사 오투마 섬모를 이용한 방열장치
CN109534328B (zh) * 2017-09-22 2022-06-24 天津大学 一种二维氮掺杂石墨烯及其制备方法
KR102014132B1 (ko) * 2017-11-28 2019-08-26 광운대학교 산학협력단 고성능 ｉｇｚｏ ｔｆｔ를 위한 저온 용액 공정 기반의 고품질 ａｌ２ｏ３ ｂｎ 절연막 제조 방법 및 그 ｉｇｚｏ ｔｆｔ
KR101986788B1 (ko) * 2017-11-30 2019-06-07 한국세라믹기술원 단결정 성장 방법 및 중간 적층체
KR102123016B1 (ko) * 2018-02-28 2020-06-16 한국에너지기술연구원 기상반응에 의한 질화붕소 증착코팅 방법
KR102783987B1 (ko) * 2018-08-03 2025-03-21 삼성전자주식회사 나노결정질 그래핀의 형성방법 및 이를 포함하는 소자
KR102072580B1 (ko) 2018-11-06 2020-02-03 한국과학기술연구원 헥사고날 보론 니트라이드 박막의 제조 방법 및 이를 이용한 다층 구조의 제조 방법 및 스위칭 소자의 제조 방법
JP6829920B1 (ja) * 2019-03-14 2021-02-17 国立大学法人東京工業大学 ホウ素シートを用いた導電性および誘電体デバイス
CN110155991A (zh) * 2019-04-24 2019-08-23 华东师范大学 一种氧化还原石墨烯和氮掺杂石墨烯的制备方法
US11289582B2 (en) * 2019-05-23 2022-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Single-crystal hexagonal boron nitride layer and method forming same
KR102837989B1 (ko) * 2019-07-31 2025-07-24 주식회사 엘티아이 2d 물질 제조장치
DE102019129789A1 (de) * 2019-11-05 2021-05-06 Aixtron Se Verfahren zum Abscheiden einer zweidimensionalen Schicht sowie CVD-Reaktor
CN111072022A (zh) * 2019-12-11 2020-04-28 中国科学院上海微系统与信息技术研究所 一种石墨薄膜的制备方法
KR102314020B1 (ko) * 2020-05-06 2021-10-15 아주대학교산학협력단 육방정계 질화붕소/그래핀 2차원 복합 소재 제조방법
CN113979429B (zh) * 2021-10-19 2023-04-07 中国科学院上海微系统与信息技术研究所 六方氮化硼表面扭转双层石墨烯及其制备方法
KR102889730B1 (ko) * 2022-03-03 2025-11-21 울산과학기술원 다층박막 구조의 비정질 질화붕소 박막 및 이를 포함하는 전자 장치
KR20230152454A (ko) 2022-04-27 2023-11-03 삼성전자주식회사 나노결정질 질화붕소막, 이를 포함하는 이미지 센서 및 전계 효과 트랜지스터, 및 나노결정질 질화붕소막의 제조 방법

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Also Published As

Publication number Publication date
EP2994933C0 (en) 2023-11-01
EP4293707A3 (en) 2024-03-27
EP2994933A1 (en) 2016-03-16
JP2018050052A (ja) 2018-03-29
JP6488350B2 (ja) 2019-03-20
JP6228293B2 (ja) 2017-11-08
KR102202991B1 (ko) 2021-01-14
EP2994933B1 (en) 2023-11-01
EP4293706A2 (en) 2023-12-20
JP2016526286A (ja) 2016-09-01
EP4293706A3 (en) 2024-03-13
JP6567208B2 (ja) 2019-08-28
EP4293707A2 (en) 2023-12-20
JP2019125793A (ja) 2019-07-25
KR20160036012A (ko) 2016-04-01
WO2014182540A1 (en) 2014-11-13

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