ES2655275T3 - Material compuesto y sustrato de circuito de alta frecuencia fabricado con el material compuesto y el método de fabricación del mismo - Google Patents
Material compuesto y sustrato de circuito de alta frecuencia fabricado con el material compuesto y el método de fabricación del mismo Download PDFInfo
- Publication number
- ES2655275T3 ES2655275T3 ES10849617.5T ES10849617T ES2655275T3 ES 2655275 T3 ES2655275 T3 ES 2655275T3 ES 10849617 T ES10849617 T ES 10849617T ES 2655275 T3 ES2655275 T3 ES 2655275T3
- Authority
- ES
- Spain
- Prior art keywords
- weight
- composite material
- parts
- polybutadiene
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229920005989 resin Polymers 0.000 claims abstract description 92
- 239000011347 resin Substances 0.000 claims abstract description 92
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 32
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 30
- 239000011152 fibreglass Substances 0.000 claims abstract description 28
- 239000004744 fabric Substances 0.000 claims abstract description 27
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 26
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 25
- 239000003063 flame retardant Substances 0.000 claims abstract description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 25
- 125000000524 functional group Chemical group 0.000 claims abstract description 21
- 239000003999 initiator Substances 0.000 claims abstract description 18
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 14
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 11
- 229920001577 copolymer Polymers 0.000 claims abstract description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- 125000003277 amino group Chemical group 0.000 claims abstract description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- -1 polyphenylene Polymers 0.000 claims description 11
- 238000011068 loading method Methods 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 claims description 8
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 239000003431 cross linking reagent Substances 0.000 claims description 5
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 3
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 3
- DYIZJUDNMOIZQO-UHFFFAOYSA-N 4,5,6,7-tetrabromo-2-[2-(4,5,6,7-tetrabromo-1,3-dioxoisoindol-2-yl)ethyl]isoindole-1,3-dione Chemical compound O=C1C(C(=C(Br)C(Br)=C2Br)Br)=C2C(=O)N1CCN1C(=O)C2=C(Br)C(Br)=C(Br)C(Br)=C2C1=O DYIZJUDNMOIZQO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- JUIBLDFFVYKUAC-UHFFFAOYSA-N [5-(2-ethylhexanoylperoxy)-2,5-dimethylhexan-2-yl] 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C(CC)CCCC JUIBLDFFVYKUAC-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 3
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical group BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 3
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- RERMPCBBVZEPBS-UHFFFAOYSA-N tris(2,6-dimethylphenyl)phosphane Chemical compound CC1=CC=CC(C)=C1P(C=1C(=CC=CC=1C)C)C1=C(C)C=CC=C1C RERMPCBBVZEPBS-UHFFFAOYSA-N 0.000 claims description 3
- 229920000265 Polyparaphenylene Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000178 monomer Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 2
- YPFVPWQTXAOXBW-UHFFFAOYSA-N Br.Br.C=CC1=CC=CC=C1 Chemical compound Br.Br.C=CC1=CC=CC=C1 YPFVPWQTXAOXBW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ZVYNXVUIVLDHNO-UHFFFAOYSA-N [2-(2,6-dimethylphenyl)phenyl]phosphane Chemical compound CC1=CC=CC(C)=C1C1=CC=CC=C1P ZVYNXVUIVLDHNO-UHFFFAOYSA-N 0.000 description 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/016—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2010/075149 WO2012006776A1 (zh) | 2010-07-14 | 2010-07-14 | 复合材料、用其制作的高频电路基板及其制作方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2655275T3 true ES2655275T3 (es) | 2018-02-19 |
Family
ID=45468875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES10849617.5T Active ES2655275T3 (es) | 2010-07-14 | 2010-07-14 | Material compuesto y sustrato de circuito de alta frecuencia fabricado con el material compuesto y el método de fabricación del mismo |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9890276B2 (https=) |
| EP (1) | EP2595460B1 (https=) |
| AU (1) | AU2010345325B2 (https=) |
| ES (1) | ES2655275T3 (https=) |
| NO (1) | NO2595460T3 (https=) |
| WO (1) | WO2012006776A1 (https=) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9051465B1 (en) | 2012-02-21 | 2015-06-09 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| US9243164B1 (en) | 2012-02-21 | 2016-01-26 | Park Electrochemical Corporation | Thermosetting resin composition containing a polyphenylene ether and a brominated fire retardant compound |
| TWI464213B (zh) * | 2013-03-07 | 2014-12-11 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
| EP2838086A1 (en) | 2013-07-22 | 2015-02-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | In an reduction of comb filter artifacts in multi-channel downmix with adaptive phase alignment |
| TWI506077B (zh) | 2013-12-31 | 2015-11-01 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
| WO2016105051A1 (ko) * | 2014-12-22 | 2016-06-30 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
| KR101865649B1 (ko) * | 2014-12-22 | 2018-07-04 | 주식회사 두산 | 고주파용 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
| JP6335384B2 (ja) * | 2015-03-13 | 2018-05-30 | 京セラ株式会社 | 樹脂組成物、プリプレグ、金属張積層板および配線基板 |
| WO2017201592A1 (pt) * | 2016-05-25 | 2017-11-30 | Luciano Fusco | Método para a fabricação de um compósito líquido feito de resina e fibra de vidro e um compósito líquido feito pelo método |
| KR102337574B1 (ko) * | 2016-07-12 | 2021-12-13 | 주식회사 두산 | 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 |
| CN109053944B (zh) * | 2017-06-13 | 2020-03-17 | 广东生益科技股份有限公司 | 一种聚合物树脂及其在高频电路板中的应用 |
| CN109912908B (zh) | 2017-12-13 | 2021-05-18 | 财团法人工业技术研究院 | 基板组合物及由其所制备的基板 |
| CN111378242B (zh) * | 2018-12-29 | 2022-10-18 | 广东生益科技股份有限公司 | 一种树脂组合物、包含其的预浸料、介质基板以及印刷电路板 |
| CN111154212B (zh) * | 2019-09-24 | 2022-10-21 | 张家界皓文树脂合成有限公司 | 热塑型高频高速树脂组合物 |
| WO2021085009A1 (ja) * | 2019-10-30 | 2021-05-06 | リンテック株式会社 | 接着剤組成物及び接着シート |
| JP7286569B2 (ja) * | 2020-02-17 | 2023-06-05 | 信越化学工業株式会社 | 熱硬化性樹脂組成物、熱硬化性接着剤、熱硬化性樹脂フィルム並びに前記熱硬化性樹脂組成物を用いた積層板、プリプレグ、及び回路基板 |
| JP6905160B1 (ja) * | 2020-03-13 | 2021-07-21 | リンテック株式会社 | デバイス用硬化性接着シート |
| CN111253702B (zh) * | 2020-03-30 | 2023-06-06 | 广东生益科技股份有限公司 | 一种树脂组合物及使用其的预浸料和电路材料 |
| KR102873149B1 (ko) * | 2020-09-29 | 2025-10-17 | 주식회사 엘지에너지솔루션 | 수지 조성물 |
| CN112266602A (zh) * | 2020-11-23 | 2021-01-26 | 江苏诺德新材料股份有限公司 | 一种碳氢复合材料及其制造的高频覆铜板 |
| CN113316320A (zh) * | 2021-04-13 | 2021-08-27 | 青岛中青电子软件有限公司 | 一种高导热pcb基板的加工制备方法 |
| CN115073858B (zh) * | 2022-06-15 | 2023-11-14 | 西安天和嘉膜工业材料有限责任公司 | 高频板用双马改性烯烃树脂胶液、胶布及制备方法和应用 |
| CN115093818B (zh) * | 2022-06-27 | 2023-08-11 | 浙江亦龙新材料有限公司 | 一种电子级胶黏剂及其制备方法 |
| CN121136403A (zh) * | 2025-10-16 | 2025-12-16 | 苏州大耀信息科技有限公司 | 一种热塑性高频介质基板及其制备方法与覆铜板 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5571609A (en) | 1994-10-13 | 1996-11-05 | Rogers Corporation | Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof |
| WO1997038564A1 (en) | 1996-04-09 | 1997-10-16 | Arlon, Inc. | Composite dielectric material |
| JPH1112456A (ja) * | 1997-06-24 | 1999-01-19 | Matsushita Electric Works Ltd | 樹脂組成物、プリプレグ及び積層板 |
| US6333384B1 (en) | 1998-11-02 | 2001-12-25 | Gil Technologies | Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom |
| US6352782B2 (en) | 1999-12-01 | 2002-03-05 | General Electric Company | Poly(phenylene ether)-polyvinyl thermosetting resin |
| US6878782B2 (en) | 1999-12-01 | 2005-04-12 | General Electric | Thermoset composition, method, and article |
| US6306963B1 (en) * | 2000-05-08 | 2001-10-23 | General Electric Co. | Thermosetting resins and laminates |
| JP5328064B2 (ja) * | 2000-08-10 | 2013-10-30 | 日本化薬株式会社 | 多価フェノール化合物、熱硬化性樹脂組成物及びその硬化物 |
| JP2005105062A (ja) * | 2003-09-29 | 2005-04-21 | Tdk Corp | 樹脂組成物、樹脂付導体箔、プリプレグ、シート、導体箔付シート、積層板およびプリント配線基板 |
| TW200730601A (en) * | 2006-02-07 | 2007-08-16 | Nanya Plastics Corp | Electronic insulating bond play or bonding sheet |
| WO2007142140A1 (ja) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP5433416B2 (ja) * | 2006-08-08 | 2014-03-05 | ワールド プラパティーズ、 インコーポレイテッド | 回路材料、回路および多層回路積層板 |
| JP5104507B2 (ja) | 2007-04-26 | 2012-12-19 | 日立化成工業株式会社 | セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板 |
| JP5181221B2 (ja) | 2008-01-15 | 2013-04-10 | 日立化成株式会社 | 低熱膨張性低誘電損失プリプレグ及びその応用品 |
| JP4613977B2 (ja) * | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | 薄層石英ガラスクロスを含むプリプレグ、およびそれを用いた配線板 |
| CN101328277B (zh) * | 2008-07-28 | 2010-07-21 | 广东生益科技股份有限公司 | 一种复合材料、用其制作的高频电路基板及制作方法 |
| JP5093059B2 (ja) * | 2008-11-06 | 2012-12-05 | 日立化成工業株式会社 | 樹脂組成物、プリプレグ、積層板及びプリント基板 |
| CN101747854B (zh) * | 2008-12-04 | 2012-11-21 | 比亚迪股份有限公司 | 胶粘剂组合物以及覆盖膜和柔性线路板 |
| US8227948B1 (en) | 2009-01-09 | 2012-07-24 | Hydro-Gear Limited Partnership | Electric motor |
| CN101544841B (zh) * | 2009-04-10 | 2010-07-21 | 广东生益科技股份有限公司 | 复合材料及用其制作的高频电路基板 |
| CN101643565B (zh) * | 2009-08-24 | 2010-07-21 | 广东生益科技股份有限公司 | 复合材料、用其制作的高频电路基板及其制作方法 |
| CN101735562B (zh) * | 2009-12-11 | 2012-09-26 | 广东生益科技股份有限公司 | 环氧树脂组合物及其制备方法及采用其制作的层压材料及覆铜箔层压板 |
-
2010
- 2010-07-14 NO NO10849617A patent/NO2595460T3/no unknown
- 2010-07-14 AU AU2010345325A patent/AU2010345325B2/en not_active Ceased
- 2010-07-14 WO PCT/CN2010/075149 patent/WO2012006776A1/zh not_active Ceased
- 2010-07-14 US US13/809,893 patent/US9890276B2/en not_active Expired - Fee Related
- 2010-07-14 EP EP10849617.5A patent/EP2595460B1/en active Active
- 2010-07-14 ES ES10849617.5T patent/ES2655275T3/es active Active
Also Published As
| Publication number | Publication date |
|---|---|
| NO2595460T3 (https=) | 2018-03-10 |
| WO2012006776A1 (zh) | 2012-01-19 |
| AU2010345325A1 (en) | 2012-02-02 |
| EP2595460B1 (en) | 2017-10-11 |
| EP2595460A1 (en) | 2013-05-22 |
| US9890276B2 (en) | 2018-02-13 |
| EP2595460A4 (en) | 2015-06-10 |
| US20130180770A1 (en) | 2013-07-18 |
| AU2010345325B2 (en) | 2013-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2655275T3 (es) | Material compuesto y sustrato de circuito de alta frecuencia fabricado con el material compuesto y el método de fabricación del mismo | |
| KR101716990B1 (ko) | 폴리페닐에테르 수지 조성물 및 이를 이용하여 제조되는 반경화 시트 및 동박 적층판 | |
| AU2010200472B2 (en) | Composite Material, High-Frequency Circuit Substrate Made Therefrom and Making Method Thereof | |
| TWI778506B (zh) | 一種熱固性樹脂組成物、使用其的半固化片與覆銅箔層壓板 | |
| CN101544841B (zh) | 复合材料及用其制作的高频电路基板 | |
| CN102161823B (zh) | 复合材料、用其制作的高频电路基板及其制作方法 | |
| JP5181221B2 (ja) | 低熱膨張性低誘電損失プリプレグ及びその応用品 | |
| US8551628B2 (en) | Composite material, high-frequency circuit substrate made therefrom and making method thereof | |
| KR101965940B1 (ko) | 수지 조성물 및 그 고주파 회로기판에서의 응용 | |
| CN111959063A (zh) | 一种低介电无卤阻燃覆铜板及其制作方法 | |
| WO2015120653A1 (zh) | 一种无卤树脂组合物及其用途 | |
| TWI704185B (zh) | 樹脂組合物、印刷電路用預浸片及覆金屬層壓板 | |
| CN110655775B (zh) | 树脂组合物及具有其的半固化片、层压板、印制线路板 | |
| KR101798798B1 (ko) | 할로겐 비함유 수지 조성물 및 그 용도 | |
| CN113773632A (zh) | 一种含可固化聚苯醚树脂的组合物及其应用 | |
| CN113462143B (zh) | 聚苯醚树脂组合物及使用其制备的半固化片和层压板 | |
| CN114106267B (zh) | 含苯乙烯化合物的热固性树脂组合物及其制备方法和应用 | |
| CN114685929B (zh) | 一种热固性树脂组合物及其应用 | |
| TWI532782B (zh) | A halogen-free resin composition and use thereof | |
| CN104845365A (zh) | 一种无卤树脂组合物及其用途 | |
| TW201902949A (zh) | 一種聚合物樹脂及其在高頻電路板中的應用 |