ES2617184T3 - Partículas de material compuesto de poliamida y método para producir las mismas - Google Patents

Partículas de material compuesto de poliamida y método para producir las mismas Download PDF

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Publication number
ES2617184T3
ES2617184T3 ES13749799.6T ES13749799T ES2617184T3 ES 2617184 T3 ES2617184 T3 ES 2617184T3 ES 13749799 T ES13749799 T ES 13749799T ES 2617184 T3 ES2617184 T3 ES 2617184T3
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polyamide
domains
particles
diameter
polymer
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ES13749799.6T
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Hiroshi Kobayashi
Takahiko OTSUBO
Hiroshi Takezaki
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Toray Industries Inc
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Toray Industries Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/005—Processes for mixing polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2329/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Derivatives of such polymer
    • C08J2329/02—Homopolymers or copolymers of unsaturated alcohols
    • C08J2329/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C08J2477/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof

Abstract

Partículas finas de material compuesto de poliamida que comprenden una poliamida (A1) que tiene un punto de fusión o una temperatura de transición vítrea superior a 100 ºC y un polímero (A2) diferente de dicha poliamida (A1), caracterizado por que dicho polímero (A2) comprende al menos uno seleccionado del grupo que consiste en una poliamida diferente de dicha poliamida (A1), un elastómero de poliamida, un poliéster, un elastómero de poliéster, un poliarilato amorfo, un policarbonato, una polietersulfona, un éter de poliarileno, una polieterimida, una poliamidaimida, una poliéter cetona y una polieteréter cetona, dichas partículas finas de material compuesto de poliamida tienen una estructura de dispersión en la que una pluralidad de dominios, que tiene cada uno un diámetro de partícula de 0,05 a 100 μm, cuyo componente principal es dicho polímero (A2), se dispersan en una matriz que tiene dicha poliamida (A1) como su componente principal, y dichas partículas finas de material compuesto de poliamida tienen un diámetro promedio de partícula de 0,1 a 500 μm y una esfericidad de 80 o superior, en el que, cuando los parámetros de solubilidad de dicha poliamida (A1) y dicho polímero (A2) se denominan δA1 y δA2, respectivamente, se satisface una relación de | δA1 - δA2 | >= 0,1 (J/cm3)1/2]; midiéndose el diámetro de partícula de los dominios con el componente principal (A2) incorporando las partículas finas de polímero en una resina epoxi para microscopía electrónica y el curado de la misma, preparando una muestra mediante la técnica de sección congelada con un espesor de 0,1 μm, observando secciones transversales de partículas por microscopía electrónica de transmisión, midiendo las áreas de sección transversal de 50 dominios seleccionados al azar de la fotografía obtenida del microscopio electrónico de transmisión y definiendo el diámetro de partícula como un promedio de los diámetros de los círculos verdaderos obtenidos de acuerdo con la siguiente ecuación de conversión mediante la conversión de cada uno de los 50 dominios a un círculo verdadero que tiene un área equivalente a la del dominio correspondiente; por lo que si existen menos de 50 dominios en una sola partícula, la medición se lleva a cabo seleccionando 50 dominios al azar a partir de fotografías de sección transversal de dos o más partículas:**Fórmula** en la que Ddominio representa el diámetro de partícula de los dominios, Si representa el área de la sección transversal de cada dominio y n representa el número de mediciones (50); midiéndose el diámetro promedio de partícula de las partículas finas de material compuesto de poliamida midiendo los diámetros de 100 partículas seleccionadas al azar a partir de una fotografía de microscopio electrónico de barrido y el cálculo de su media aritmética; y midiéndose la esfericidad de las partículas finas de material compuesto de poliamida midiendo el diámetro más largo y el diámetro más corto de 30 partículas seleccionadas al azar durante la observación de las partículas usando microscopía electrónica de barrido y calculando a continuación el valor de acuerdo con la siguiente ecuación:**Fórmula** en la que S representa la esfericidad, DSi representa el diámetro más corto, DLi representa el diámetro más largo y n representa el número de mediciones (30).

Description

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Claims (1)

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ES13749799.6T 2012-02-15 2013-02-08 Partículas de material compuesto de poliamida y método para producir las mismas Active ES2617184T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012030075 2012-02-15
JP2012030075 2012-02-15
PCT/JP2013/053104 WO2013122008A1 (ja) 2012-02-15 2013-02-08 複合ポリアミド微粒子およびその製造方法

Publications (1)

Publication Number Publication Date
ES2617184T3 true ES2617184T3 (es) 2017-06-15

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ES13749799.6T Active ES2617184T3 (es) 2012-02-15 2013-02-08 Partículas de material compuesto de poliamida y método para producir las mismas

Country Status (8)

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US (1) US9416233B2 (es)
EP (1) EP2816072B1 (es)
JP (1) JP5648740B2 (es)
KR (1) KR101945576B1 (es)
CN (1) CN104105740B (es)
ES (1) ES2617184T3 (es)
TW (1) TWI593750B (es)
WO (1) WO2013122008A1 (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2949689A4 (en) * 2013-01-28 2016-09-07 Toray Industries PREPREG, FIBER-REINFORCED COMPOSITE AND THERMOPLASTIC RESIN PARTICLE
JP5780367B2 (ja) * 2013-08-07 2015-09-16 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
DE102013220135A1 (de) * 2013-10-04 2015-04-09 Evonik Industries Ag Polyamidmischung
KR101695515B1 (ko) * 2014-01-09 2017-01-11 롯데첨단소재(주) 전도성 폴리아미드/폴리페닐렌 에테르 수지 조성물 및 이로부터 제조된 자동차용 성형품
CN104465224B (zh) * 2014-11-20 2015-12-09 宁波市鄞州永林电子电器有限公司 一种汽车用电磁继电器
US10056168B2 (en) * 2015-04-10 2018-08-21 Lotte Advanced Materials Co., Ltd. Electrically conductive polyamide/polyphenylene ether resin composition and molded article for vehicle using the same
WO2017061502A1 (ja) * 2015-10-07 2017-04-13 ダイセル・エボニック株式会社 繊維強化樹脂及びその製造方法並びに成形品
KR102556719B1 (ko) * 2016-12-23 2023-07-18 에스에이치피피 글로벌 테크놀러지스 비.브이. 적층 가공용 폴리에테르이미드 분체
KR102538062B1 (ko) * 2017-05-12 2023-05-30 도레이 카부시키가이샤 폴리아미드 미립자의 제조 방법 및 폴리아미드 미립자
CN110229515B (zh) * 2019-06-28 2021-12-10 江苏晋伦塑料科技有限公司 一种高耐热聚酰胺组合物及其制备方法
US11866552B2 (en) * 2019-09-09 2024-01-09 Xerox Corporation Polyamide particles and methods of production and uses thereof
JPWO2022113993A1 (es) * 2020-11-30 2022-06-02
KR20230128320A (ko) * 2020-12-30 2023-09-04 인터페이셜 컨설턴츠, 엘엘씨 폴리머 미립자 조성물
WO2023223912A1 (ja) * 2022-05-17 2023-11-23 ポリプラ・エボニック株式会社 熱硬化性樹脂組成物、及び、硬化物
WO2023223911A1 (ja) * 2022-05-17 2023-11-23 ポリプラ・エボニック株式会社 樹脂粒子

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JP4574978B2 (ja) 2003-11-28 2010-11-04 ダイセル化学工業株式会社 複合粒子及び分散体
JP5132950B2 (ja) 2006-02-22 2013-01-30 株式会社日本触媒 光学フィルムの製造方法
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JP5204984B2 (ja) 2007-03-23 2013-06-05 株式会社ダイセル 樹脂粒子およびその製造方法
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JP5358132B2 (ja) 2008-07-09 2013-12-04 株式会社メタルカラー 複合型微粒子の製造方法
JP5558702B2 (ja) 2008-12-05 2014-07-23 ダイセル・エボニック株式会社 球状複合粒子およびその製造方法
JP2011094128A (ja) * 2009-09-30 2011-05-12 Toray Ind Inc ポリアミド微粒子の製造方法
JP5860598B2 (ja) * 2011-02-25 2016-02-16 住友理工株式会社 冷媒輸送ホースおよびその製法

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Publication number Publication date
JP5648740B2 (ja) 2015-01-07
KR20140127289A (ko) 2014-11-03
KR101945576B1 (ko) 2019-02-07
JPWO2013122008A1 (ja) 2015-05-11
TW201339244A (zh) 2013-10-01
US9416233B2 (en) 2016-08-16
EP2816072A1 (en) 2014-12-24
TWI593750B (zh) 2017-08-01
CN104105740A (zh) 2014-10-15
CN104105740B (zh) 2016-02-10
WO2013122008A1 (ja) 2013-08-22
US20150031834A1 (en) 2015-01-29
EP2816072A4 (en) 2015-09-02
EP2816072B1 (en) 2016-11-30

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