ES2605805T3 - Soporte de sustratos no permeables para galvanoplastia - Google Patents

Soporte de sustratos no permeables para galvanoplastia Download PDF

Info

Publication number
ES2605805T3
ES2605805T3 ES11827131.1T ES11827131T ES2605805T3 ES 2605805 T3 ES2605805 T3 ES 2605805T3 ES 11827131 T ES11827131 T ES 11827131T ES 2605805 T3 ES2605805 T3 ES 2605805T3
Authority
ES
Spain
Prior art keywords
support
electroplating
substrates
substrate support
busbar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES11827131.1T
Other languages
English (en)
Spanish (es)
Inventor
Emmanuel Chua Abas
Chen-An Chen
Diana Xiaobing Ma
Kalyana Bhargava Ganti
Edmundo Anida Divino
Jake Randal G. Ermita
José Francisco S. CAPULONG
Arnold Villamor Castillo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunPower Corp
Original Assignee
SunPower Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/889,232 external-priority patent/US8221601B2/en
Priority claimed from US12/889,219 external-priority patent/US8317987B2/en
Priority claimed from US12/889,228 external-priority patent/US8221600B2/en
Application filed by SunPower Corp filed Critical SunPower Corp
Application granted granted Critical
Publication of ES2605805T3 publication Critical patent/ES2605805T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
ES11827131.1T 2010-09-23 2011-07-11 Soporte de sustratos no permeables para galvanoplastia Active ES2605805T3 (es)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US889228 1986-07-25
US12/889,232 US8221601B2 (en) 2010-09-23 2010-09-23 Maintainable substrate carrier for electroplating
US12/889,219 US8317987B2 (en) 2010-09-23 2010-09-23 Non-permeable substrate carrier for electroplating
US12/889,228 US8221600B2 (en) 2010-09-23 2010-09-23 Sealed substrate carrier for electroplating
US889219 2010-09-23
US889232 2010-09-23
PCT/US2011/043571 WO2012039816A1 (en) 2010-09-23 2011-07-11 Non-permeable substrate carrier for electroplating

Publications (1)

Publication Number Publication Date
ES2605805T3 true ES2605805T3 (es) 2017-03-16

Family

ID=45874099

Family Applications (1)

Application Number Title Priority Date Filing Date
ES11827131.1T Active ES2605805T3 (es) 2010-09-23 2011-07-11 Soporte de sustratos no permeables para galvanoplastia

Country Status (6)

Country Link
EP (2) EP2619349B1 (ja)
JP (2) JP5792820B2 (ja)
KR (2) KR101764275B1 (ja)
CN (2) CN203307439U (ja)
ES (1) ES2605805T3 (ja)
WO (3) WO2012039817A2 (ja)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4297197A (en) * 1980-11-13 1981-10-27 International Telephone And Telegraph Corp. Electroplating rack
US4796157A (en) * 1988-01-04 1989-01-03 Motorola, Inc. Substrate mounting assembly
US5078852A (en) * 1990-10-12 1992-01-07 Microelectronics And Computer Technology Corporation Plating rack
EP0991795B1 (en) * 1998-04-21 2006-02-22 Applied Materials, Inc. Electro-chemical deposition system and method of electroplating on substrates
JP2001234397A (ja) 2000-02-24 2001-08-31 Matsushita Electric Works Ltd 電気メッキ用冶具
JP3413185B2 (ja) 2000-11-15 2003-06-03 古河電気工業株式会社 めっき用治具
US7172184B2 (en) * 2003-08-06 2007-02-06 Sunpower Corporation Substrate carrier for electroplating solar cells
US7930006B2 (en) * 2004-09-08 2011-04-19 Belkin International, Inc. Holder, electrical supply, and RF transmitter unit for electronic devices
US20080248596A1 (en) * 2007-04-04 2008-10-09 Endicott Interconnect Technologies, Inc. Method of making a circuitized substrate having at least one capacitor therein
EP1717351A1 (de) * 2005-04-27 2006-11-02 Enthone Inc. Galvanikbad
DE102005039100A1 (de) * 2005-08-09 2007-02-15 Gebr. Schmid Gmbh & Co. Einrichtung zur Aufnahme bzw. Halterung mehrerer Substrate und Galvanisiereinrichtung
US7718888B2 (en) * 2005-12-30 2010-05-18 Sunpower Corporation Solar cell having polymer heterojunction contacts
WO2009042669A1 (en) * 2007-09-24 2009-04-02 Chemical Specialties Manufacturing Corp. Cleaning device

Also Published As

Publication number Publication date
JP6080320B2 (ja) 2017-02-15
KR20170091755A (ko) 2017-08-09
WO2012039817A2 (en) 2012-03-29
CN203795007U (zh) 2014-08-27
KR20130121704A (ko) 2013-11-06
WO2012039818A1 (en) 2012-03-29
JP2013537941A (ja) 2013-10-07
KR101828394B1 (ko) 2018-02-12
WO2012039816A1 (en) 2012-03-29
JP2016014192A (ja) 2016-01-28
CN203307439U (zh) 2013-11-27
JP5792820B2 (ja) 2015-10-14
EP2619349B1 (en) 2016-11-09
WO2012039817A3 (en) 2014-03-20
EP3150748B1 (en) 2018-05-09
EP3150748A1 (en) 2017-04-05
EP2619349A1 (en) 2013-07-31
EP2619349A4 (en) 2016-01-27
KR101764275B1 (ko) 2017-08-03

Similar Documents

Publication Publication Date Title
US11280019B2 (en) Non-permeable substrate carrier for electroplating
US8221600B2 (en) Sealed substrate carrier for electroplating
USRE46088E1 (en) Maintainable substrate carrier for electroplating
ES2348148T3 (es) Dispositivo para el alojamiento y la sujeción de sustratos y un dispositivo de galvanización.
CL2003002095A1 (es) Proceso para el tratamiento galvanoplastico de un metal desde una solucion de electrolito en una celda electrolitica que tiene por lo menos un anodo que comprende formar un revestimiento superior poroso sobre toda la superficie de un revestimiento de
CN105144347A (zh) 微电子衬底电处理系统
ES2605805T3 (es) Soporte de sustratos no permeables para galvanoplastia
ATE384503T1 (de) Verbesserungen der stentherstellung
JP6910600B2 (ja) めっき装置
CN109898109A (zh) 电镀方法和电泳涂装方法
KR102250050B1 (ko) 전기도금용 지그 및 이를 이용한 도금물 제조 방법
KR100820745B1 (ko) 소형 가공물 표면 처리용 지그 유니트
JP2011026638A (ja) 陽極酸化装置
JP2005350703A (ja) 袋状ワークの電解めっき方法、電解めっき用袋状ワーク保持治具及び袋状ワークの電解めっき装置
JP2008218757A (ja) 板状体の支持部材及び保持体、並びに板状体の支持部材の製造方法
JPH0111731Y2 (ja)
JP2010007156A (ja) めっき方法
JP4574237B2 (ja) 電解めっき装置
KR20170099919A (ko) 갈바닉 금속 디포지션을 위한 수평 갈바닉 도금 프로세싱 라인의 갈바닉 도금 디바이스 및 그것의 사용
RU2021137179A (ru) Электродный узел для электрохимических процессов
JP2005350697A (ja) 袋状ワークの電解めっき方法および電解めっき装置
JP4326099B2 (ja) 表面処理における給電装置
KR20170013771A (ko) 금속 증착 장치 및 이를 포함하는 금속 증착 장치 어셈블리
TWI473192B (zh) 具有側面保護之半導體晶圓製程方法及系統
TWM590310U (zh) 具有通孔的晶圓夾具