ES2332106T3 - Cargas conductoras y su utilizacion. - Google Patents
Cargas conductoras y su utilizacion. Download PDFInfo
- Publication number
- ES2332106T3 ES2332106T3 ES06405255T ES06405255T ES2332106T3 ES 2332106 T3 ES2332106 T3 ES 2332106T3 ES 06405255 T ES06405255 T ES 06405255T ES 06405255 T ES06405255 T ES 06405255T ES 2332106 T3 ES2332106 T3 ES 2332106T3
- Authority
- ES
- Spain
- Prior art keywords
- conductive
- nickel
- carbon
- metal coating
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 69
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 239000011248 coating agent Substances 0.000 claims abstract description 51
- 238000000576 coating method Methods 0.000 claims abstract description 51
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 29
- 239000011159 matrix material Substances 0.000 claims abstract description 27
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 22
- 239000010439 graphite Substances 0.000 claims abstract description 22
- 239000002131 composite material Substances 0.000 claims abstract description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 112
- 239000002245 particle Substances 0.000 claims description 73
- 229910052759 nickel Inorganic materials 0.000 claims description 55
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 26
- 239000004332 silver Substances 0.000 claims description 26
- 229910000510 noble metal Inorganic materials 0.000 claims description 25
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 229910052737 gold Inorganic materials 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 229910052741 iridium Inorganic materials 0.000 claims description 11
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 10
- 229910017052 cobalt Inorganic materials 0.000 claims description 10
- 239000010941 cobalt Substances 0.000 claims description 10
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 10
- 229920001940 conductive polymer Polymers 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 10
- 229910021382 natural graphite Inorganic materials 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 10
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 229910052703 rhodium Inorganic materials 0.000 claims description 10
- 239000010948 rhodium Substances 0.000 claims description 10
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 10
- 239000011135 tin Substances 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- 229910052725 zinc Inorganic materials 0.000 claims description 10
- 239000011701 zinc Substances 0.000 claims description 10
- 229910021383 artificial graphite Inorganic materials 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 7
- -1 indian Chemical compound 0.000 claims description 6
- 150000002739 metals Chemical class 0.000 claims description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims description 4
- 229920002943 EPDM rubber Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 229920006397 acrylic thermoplastic Polymers 0.000 claims description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 claims description 4
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims description 4
- 150000002825 nitriles Chemical class 0.000 claims description 4
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920000570 polyether Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 229920001021 polysulfide Polymers 0.000 claims description 4
- 239000005077 polysulfide Substances 0.000 claims description 4
- 150000008117 polysulfides Polymers 0.000 claims description 4
- 229920002635 polyurethane Polymers 0.000 claims description 4
- 239000004814 polyurethane Substances 0.000 claims description 4
- XTHPWXDJESJLNJ-UHFFFAOYSA-N sulfurochloridic acid Chemical class OS(Cl)(=O)=O XTHPWXDJESJLNJ-UHFFFAOYSA-N 0.000 claims description 4
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 229920005573 silicon-containing polymer Polymers 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 abstract description 16
- 239000000806 elastomer Substances 0.000 abstract description 11
- 229920002379 silicone rubber Polymers 0.000 abstract description 4
- 239000011231 conductive filler Substances 0.000 abstract 2
- 239000011162 core material Substances 0.000 description 20
- 239000000843 powder Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 239000000523 sample Substances 0.000 description 5
- 229920003052 natural elastomer Polymers 0.000 description 4
- 229920001194 natural rubber Polymers 0.000 description 4
- 244000043261 Hevea brasiliensis Species 0.000 description 3
- 239000011362 coarse particle Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000000518 rheometry Methods 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009854 hydrometallurgy Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 238000003878 thermal aging Methods 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000005325 percolation Methods 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05405434 | 2005-07-12 | ||
| EP05405434 | 2005-07-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2332106T3 true ES2332106T3 (es) | 2010-01-26 |
Family
ID=34943000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES06405255T Active ES2332106T3 (es) | 2005-07-12 | 2006-06-13 | Cargas conductoras y su utilizacion. |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US20070012900A1 (enExample) |
| EP (1) | EP1744326B1 (enExample) |
| JP (1) | JP2007027111A (enExample) |
| KR (1) | KR101224091B1 (enExample) |
| AT (1) | ATE444558T1 (enExample) |
| CA (1) | CA2548835C (enExample) |
| DE (1) | DE602006009442D1 (enExample) |
| DK (1) | DK1744326T3 (enExample) |
| ES (1) | ES2332106T3 (enExample) |
| PL (1) | PL1744326T3 (enExample) |
| SG (1) | SG129379A1 (enExample) |
| SI (1) | SI1744326T1 (enExample) |
| TW (1) | TWI381399B (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI381399B (zh) * | 2005-07-12 | 2013-01-01 | Sulzer Metco Canada Inc | 性能增進之導電性填料及由該填料製成的聚合物 |
| JP5496446B2 (ja) * | 2007-07-12 | 2014-05-21 | 東海ゴム工業株式会社 | 静電容量型センサ |
| KR100850007B1 (ko) * | 2007-08-31 | 2008-08-01 | 이재욱 | 전자파를 차폐하는 조성물, 이의 제조방법 및 전자파차폐기능을 갖는 카메라 하우징 |
| KR100956240B1 (ko) * | 2007-11-14 | 2010-05-06 | 삼성전기주식회사 | 고분자 복합체 |
| US8299159B2 (en) * | 2009-08-17 | 2012-10-30 | Laird Technologies, Inc. | Highly thermally-conductive moldable thermoplastic composites and compositions |
| KR101432995B1 (ko) * | 2009-08-17 | 2014-08-22 | 라이르드 테크놀로지스, 아이엔씨 | 복수의 충전제를 구비한 높은 도전성의 폴리머 복합재의 형성 |
| RU2504933C2 (ru) * | 2009-10-02 | 2014-01-20 | Сэнт-Гобен Перформанс Пластикс Корпорейшн | Уплотнение, содержащая его система и способ изготовления уплотнения |
| US8673416B2 (en) * | 2009-10-28 | 2014-03-18 | Xerox Corporation | Multilayer electrical component, coating composition, and method of making electrical component |
| US20120080639A1 (en) * | 2010-10-04 | 2012-04-05 | Laird Technologies, Inc. | Potato shaped graphite filler, thermal interface materials and emi shielding |
| CN103250478A (zh) * | 2010-12-28 | 2013-08-14 | 美国圣戈班性能塑料公司 | 用于emi屏蔽的具有金属填充剂的聚合物 |
| US9346991B2 (en) * | 2011-04-14 | 2016-05-24 | Ada Technologies, Inc. | Thermal interface materials and systems and devices containing the same |
| EP2557571B1 (en) * | 2011-08-08 | 2014-07-02 | Tyco Electronics Corporation | Electrically conductive metal/plastic hybrid comprising a polymer material, a first metal and metal particles of a second metal embedded in the first metal and method of producing such |
| WO2013074967A1 (en) * | 2011-11-17 | 2013-05-23 | Gentherm Incorporated | Thermoelectric devices with interface materials and methods of manufacturing the same |
| US9780061B2 (en) * | 2014-05-26 | 2017-10-03 | Infineon Technologies Ag | Molded chip package and method of manufacturing the same |
| KR101597346B1 (ko) | 2014-05-30 | 2016-02-25 | (주) 유니플라텍 | 저비중 도전 입자를 포함하는 코팅제 조성물을 이용한 전자파 차폐 필름 |
| CN104558979B (zh) * | 2014-12-26 | 2016-08-24 | 中北大学 | 通过导电性大分子偶联剂制备碳基填料/聚合物基复合材料的方法 |
| CN104637566B (zh) * | 2015-02-16 | 2017-01-04 | 中国科学院宁波材料技术与工程研究所 | 一种金属/石墨烯复合材料及其制备方法和应用 |
| KR101704454B1 (ko) * | 2015-05-18 | 2017-02-09 | 대상에스티 주식회사 | 전자파 차폐 필름 |
| CN208791533U (zh) | 2015-06-12 | 2019-04-26 | 新格拉夫解决方案有限责任公司 | 复合物制品、制品以及服装 |
| JP6704229B2 (ja) | 2015-09-14 | 2020-06-03 | リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． | 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法 |
| US10183420B2 (en) * | 2016-02-15 | 2019-01-22 | General Electric Company | Resistively heated thermoplastic washout mandrel |
| KR102359198B1 (ko) | 2016-03-31 | 2022-02-07 | 네오그라프 솔루션즈, 엘엘씨 | 노이즈 억제 조립체 |
| US10711141B1 (en) * | 2016-10-04 | 2020-07-14 | Triton Systems, Inc. | Nickel free conductive filler |
| US10468574B2 (en) * | 2017-05-04 | 2019-11-05 | Baker Hughes, A Ge Company, Llc | Thermoelectric materials and related compositions and methods |
| US11075331B2 (en) | 2018-07-30 | 2021-07-27 | Gentherm Incorporated | Thermoelectric device having circuitry with structural rigidity |
| US20200123379A1 (en) * | 2018-10-23 | 2020-04-23 | Lockheed Martin Corporation | Toughened, high conductivity emi thermoplastic with nanomaterials and articles and methods thereof |
| EP4248723A4 (en) * | 2020-11-20 | 2024-10-23 | Oerlikon Metco (US) Inc. | Electrically conductive fillers with improved microwave shielding performance |
| WO2022120186A1 (en) * | 2020-12-03 | 2022-06-09 | Oerlikon Metco (Us) Inc. | Electrically conductive fillers with improved corrosion resistance |
| CN115019999A (zh) * | 2022-06-30 | 2022-09-06 | 航天特种材料及工艺技术研究所 | 一种耐高温铂包镍导电浆料及其制备方法 |
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| US5614320A (en) * | 1991-07-17 | 1997-03-25 | Beane; Alan F. | Particles having engineered properties |
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| TWI381399B (zh) * | 2005-07-12 | 2013-01-01 | Sulzer Metco Canada Inc | 性能增進之導電性填料及由該填料製成的聚合物 |
-
2006
- 2006-05-24 TW TW095118473A patent/TWI381399B/zh not_active IP Right Cessation
- 2006-05-30 CA CA2548835A patent/CA2548835C/en not_active Expired - Fee Related
- 2006-06-13 ES ES06405255T patent/ES2332106T3/es active Active
- 2006-06-13 DK DK06405255T patent/DK1744326T3/da active
- 2006-06-13 DE DE602006009442T patent/DE602006009442D1/de active Active
- 2006-06-13 EP EP06405255A patent/EP1744326B1/en not_active Not-in-force
- 2006-06-13 SI SI200630498T patent/SI1744326T1/sl unknown
- 2006-06-13 AT AT06405255T patent/ATE444558T1/de active
- 2006-06-13 PL PL06405255T patent/PL1744326T3/pl unknown
- 2006-06-27 US US11/476,440 patent/US20070012900A1/en not_active Abandoned
- 2006-07-10 KR KR1020060064328A patent/KR101224091B1/ko not_active Expired - Fee Related
- 2006-07-11 SG SG200604660A patent/SG129379A1/en unknown
- 2006-07-11 JP JP2006189913A patent/JP2007027111A/ja active Pending
-
2011
- 2011-01-20 US US13/010,686 patent/US20110108775A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| ATE444558T1 (de) | 2009-10-15 |
| SI1744326T1 (sl) | 2010-01-29 |
| TW200707467A (en) | 2007-02-16 |
| DE602006009442D1 (de) | 2009-11-12 |
| TWI381399B (zh) | 2013-01-01 |
| US20110108775A1 (en) | 2011-05-12 |
| SG129379A1 (en) | 2007-02-26 |
| EP1744326A1 (en) | 2007-01-17 |
| KR101224091B1 (ko) | 2013-01-18 |
| PL1744326T3 (pl) | 2010-03-31 |
| KR20070008407A (ko) | 2007-01-17 |
| EP1744326B1 (en) | 2009-09-30 |
| US20070012900A1 (en) | 2007-01-18 |
| DK1744326T3 (da) | 2009-11-23 |
| HK1098246A1 (en) | 2007-07-13 |
| JP2007027111A (ja) | 2007-02-01 |
| CA2548835A1 (en) | 2007-01-12 |
| CA2548835C (en) | 2013-11-12 |
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