ES2171968T3 - Aparato de formacion de imagenes provisto de una gran area de deteccion. - Google Patents

Aparato de formacion de imagenes provisto de una gran area de deteccion.

Info

Publication number
ES2171968T3
ES2171968T3 ES97931760T ES97931760T ES2171968T3 ES 2171968 T3 ES2171968 T3 ES 2171968T3 ES 97931760 T ES97931760 T ES 97931760T ES 97931760 T ES97931760 T ES 97931760T ES 2171968 T3 ES2171968 T3 ES 2171968T3
Authority
ES
Spain
Prior art keywords
image
loseta
image formation
address
device provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97931760T
Other languages
English (en)
Inventor
Tom Gunnar Schulman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Simage Oy
Original Assignee
Simage Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Simage Oy filed Critical Simage Oy
Application granted granted Critical
Publication of ES2171968T3 publication Critical patent/ES2171968T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Radiation (AREA)
  • Studio Devices (AREA)
  • Vehicle Body Suspensions (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Color Television Image Signal Generators (AREA)

Abstract

APARATO PARA LA FORMACION DE IMAGENES QUE INCLUYE UN SOPORTE DE IMAGENES Y UNA SERIE DE LOSETAS DE DISPOSITIVO DE IMAGENES (56, 58). CADA LOSETA TIENE UN DISPOSITIVO FORMADOR DE IMAGENES CON UNA SUPERFICIE FORMADORA DE IMAGENES Y CON UNA REGION NO ACTIVA (50) EN EL BORDE DE LA LOSETA O ADYACENTE A ESTA. EL DISPOSITIVO FORMADOR DE IMAGENES DE LA LOSETA MONTADA EN EL CITADO SOPORTE ESTA INCLINADO DE MANERA QUE UNA PARTE DE LA SUPERFICIE FORMADORA DE IMAGENES (60) DE UNA LOSETA SE SUPERPONGA AL MENOS PARCIALMENTE A LA REGION NO ACTIVA DE OTRA LOSETA, CON LO QUE SE OFRECE UNA FORMACION DE IMAGENES BASICAMENTE CONTINUA EN UNA PRIMERA DIRECCION. EL ESPACIO ENTRE LAS LOSETAS EN DIRECCION ORTOGONAL HACIA LA PRIMERA DIRECCION SE MINIMIZA GARANTIZANDO QUE LA ANCHURA DE LA SUPERFICIE DE FORMACION DE IMAGENES DE UNA CAPA DETECTORA DEL DISPOSITIVO FORMADOR DE IMAGENES ES LA MISMA O MAYOR QUE LA DE UNA CAPA DE LECTURA DISPUESTA EN EL DISPOSITIVO FORMADOR DE IMAGENES Y LA DE UN MONTAJE PARA EL DISPOSITIVOCITADO.
ES97931760T 1996-07-11 1997-07-03 Aparato de formacion de imagenes provisto de una gran area de deteccion. Expired - Lifetime ES2171968T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9614620A GB2315157B (en) 1996-07-11 1996-07-11 Imaging apparatus

Publications (1)

Publication Number Publication Date
ES2171968T3 true ES2171968T3 (es) 2002-09-16

Family

ID=10796769

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97931760T Expired - Lifetime ES2171968T3 (es) 1996-07-11 1997-07-03 Aparato de formacion de imagenes provisto de una gran area de deteccion.

Country Status (13)

Country Link
US (2) US6408110B2 (es)
EP (2) EP1162833A1 (es)
JP (1) JP2000514557A (es)
AT (1) ATE214531T1 (es)
AU (1) AU3540697A (es)
CA (1) CA2260103A1 (es)
DE (1) DE69711047T2 (es)
ES (1) ES2171968T3 (es)
GB (1) GB2315157B (es)
HK (1) HK1042397A1 (es)
IL (1) IL127285A (es)
NO (1) NO990089L (es)
WO (1) WO1998003011A1 (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999045411A1 (en) * 1997-02-18 1999-09-10 Simage Oy Semiconductor imaging device
GB2332608B (en) * 1997-12-18 2000-09-06 Simage Oy Modular imaging apparatus
WO2000065376A1 (en) * 1999-04-26 2000-11-02 Simage Oy Device for imaging radiation
US7333146B1 (en) 1999-10-02 2008-02-19 Takeharu Etoh Image capturing apparatus for adjusting a relative position between an image sensor and an optical axis
GB2374726A (en) * 2001-04-20 2002-10-23 Kingpak Tech Inc Stacked structure of an image sensor having image sensing chip located above integrated circuit
US7189971B2 (en) 2002-02-15 2007-03-13 Oy Ajat Ltd Radiation imaging device and system
US7170062B2 (en) 2002-03-29 2007-01-30 Oy Ajat Ltd. Conductive adhesive bonded semiconductor substrates for radiation imaging devices
DE60328904D1 (de) * 2002-10-25 2009-10-01 Ipl Intellectual Property Lice Schaltungssubstrat und verfahren
US7223981B1 (en) * 2002-12-04 2007-05-29 Aguila Technologies Inc. Gamma ray detector modules
US7247858B2 (en) 2003-04-10 2007-07-24 Agfa Healthcare, N.V. Method for creating a contiguous image using multiple X-ray imagers
JP4594624B2 (ja) * 2004-01-13 2010-12-08 株式会社日立製作所 放射線検出装置および核医学診断装置
WO2005109037A1 (ja) 2004-05-11 2005-11-17 Hamamatsu Photonics K.K. 放射線撮像装置
JP4440749B2 (ja) * 2004-11-02 2010-03-24 ローム株式会社 画像読み取り装置
DE102005045895B3 (de) * 2005-09-26 2007-06-14 Siemens Ag CMOS Röntgenflachdetektor
WO2008003351A1 (en) * 2006-07-04 2008-01-10 Mario Caria Imaging system with tiled sensor chips having partially overlapping active areas
US8296168B2 (en) * 2006-09-13 2012-10-23 University Of Maryland System and method for analysis of an opinion expressed in documents with regard to a particular topic
US20110001052A1 (en) * 2006-12-04 2011-01-06 Luc Struye Computed radiography system
FI124818B (fi) 2011-10-06 2015-02-13 Advacam Oy Hybridipikseli-ilmaisinrakenne ja tämän valmistusmenetelmä
JP6319759B2 (ja) * 2013-04-18 2018-05-09 日東電工株式会社 光電気混載モジュール
CZ2013669A3 (cs) 2013-08-30 2015-01-07 České vysoké učení technické v Praze Ústav technické a experimentální fyziky Detektor ionizujícího záření umožňující vytvoření souvislého digitálního obrazu
US10459094B2 (en) * 2014-04-30 2019-10-29 Analogic Corporation Detector array for imaging modality
WO2016066850A1 (en) * 2014-10-31 2016-05-06 Koninklijke Philips N.V. Sensor device and imaging system for detecting radiation signals
US9599723B2 (en) 2015-08-18 2017-03-21 Carestream Health, Inc. Method and apparatus with tiled image sensors
WO2018053778A1 (en) * 2016-09-23 2018-03-29 Shenzhen Xpectvision Technology Co.,Ltd. Packaging of semiconductor x-ray detectors
WO2018202465A1 (en) * 2017-05-01 2018-11-08 Koninklijke Philips N.V. Multi-layer radiation detector
EP3743742A4 (en) 2018-01-24 2021-07-28 Shenzhen Xpectvision Technology Co., Ltd. PACKAGING RADIATION DETECTORS IN AN IMAGE SENSOR
US11253212B2 (en) * 2020-01-07 2022-02-22 General Electric Company Tileable X-ray detector cassettes
CN112951864B (zh) * 2021-04-29 2022-08-02 中国科学院长春光学精密机械与物理研究所 一种拼接用图像传感器的窄边柔性封装结构及其封装方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3939555A (en) * 1972-07-20 1976-02-24 Siemens Aktiengesellschaft Strip type radiation detector and method of making same
US4467342A (en) * 1982-07-15 1984-08-21 Rca Corporation Multi-chip imager
JPH0229180B2 (ja) * 1983-06-02 1990-06-28 Matsushita Electric Ind Co Ltd Sekigaisenkenshutsuki
US4755681A (en) * 1986-09-30 1988-07-05 Shimadzu Corporation Radiation image detecting apparatus with IC modules stacked stepwise
JPS63284485A (ja) * 1987-05-15 1988-11-21 Shimadzu Corp 放射線像受像装置
US4891522A (en) * 1988-10-11 1990-01-02 Microtronics Associates, Inc. Modular multi-element high energy particle detector
FR2652655A1 (fr) * 1989-10-04 1991-04-05 Commissariat Energie Atomique Dispositif matriciel de grandes dimensions pour la prise ou la restitution d'images.
US5065245A (en) * 1990-04-30 1991-11-12 Eastman Kodak Company Modular image sensor array
FR2693033B1 (fr) * 1992-06-30 1994-08-19 Commissariat Energie Atomique Dispositif d'imagerie de grande dimension.
US6165813A (en) * 1995-04-03 2000-12-26 Xerox Corporation Replacing semiconductor chips in a full-width chip array

Also Published As

Publication number Publication date
GB2315157B (en) 1998-09-30
GB2315157A (en) 1998-01-21
AU3540697A (en) 1998-02-09
EP0910918B1 (en) 2002-03-13
IL127285A0 (en) 1999-09-22
WO1998003011A1 (en) 1998-01-22
NO990089D0 (no) 1999-01-08
JP2000514557A (ja) 2000-10-31
ATE214531T1 (de) 2002-03-15
US20020006236A1 (en) 2002-01-17
DE69711047D1 (de) 2002-04-18
EP0910918A1 (en) 1999-04-28
HK1042397A1 (zh) 2002-08-09
US6408110B2 (en) 2002-06-18
DE69711047T2 (de) 2002-11-28
NO990089L (no) 1999-03-11
EP1162833A1 (en) 2001-12-12
IL127285A (en) 2004-03-28
GB9614620D0 (en) 1996-09-04
CA2260103A1 (en) 1998-01-22
US20010012412A1 (en) 2001-08-09

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