ES2156914T3 - Material de soldadura blanda exento de plomo y su utilizacion. - Google Patents

Material de soldadura blanda exento de plomo y su utilizacion.

Info

Publication number
ES2156914T3
ES2156914T3 ES95118930T ES95118930T ES2156914T3 ES 2156914 T3 ES2156914 T3 ES 2156914T3 ES 95118930 T ES95118930 T ES 95118930T ES 95118930 T ES95118930 T ES 95118930T ES 2156914 T3 ES2156914 T3 ES 2156914T3
Authority
ES
Spain
Prior art keywords
welding material
white lead
exempted
exempted welding
white
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95118930T
Other languages
English (en)
Inventor
Isabell Dipl-Ing Dr Re Buresch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wieland Werke AG
Original Assignee
Wieland Werke AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wieland Werke AG filed Critical Wieland Werke AG
Application granted granted Critical
Publication of ES2156914T3 publication Critical patent/ES2156914T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Coating By Spraying Or Casting (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Powder Metallurgy (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

LA INVENCION SE REFIERE A UNA SOLDADURA BLANDA LIBRE DE PLOMO, COMPUESTA DE UNA ALEACION DE ESTAÑO, QUE CONTIENE BISMUTO Y/O INDIO, CON RESTOS RESPECTIVOS DE ESTAÑO E IMPURIFICACIONES HABITUALES. LA ADICION DE ACUERDO CON LA INVENCION DE 0,001 HASTA 5 % DE COBALTO ORIGINA UNA ESTRUCTURA COMPLETA DE GRANULACION FINA DE LA SOLDADURA Y DESPUES DE LA UTILIZACION POR EJEMPLO DE COBRE, NIQUEL Y ORO, ASI COMO SUS ALEACIONES ORIGINA UNA FASE INTERMETALICA, DE GRANO FINO, QUE ELEVA LA RESISTENCIA DE LA UNION DE COMPONENTES SOLDADOS.
ES95118930T 1994-12-07 1995-12-01 Material de soldadura blanda exento de plomo y su utilizacion. Expired - Lifetime ES2156914T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4443459A DE4443459C2 (de) 1994-12-07 1994-12-07 Bleifreies Weichlot und seine Verwendung

Publications (1)

Publication Number Publication Date
ES2156914T3 true ES2156914T3 (es) 2001-08-01

Family

ID=6535091

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95118930T Expired - Lifetime ES2156914T3 (es) 1994-12-07 1995-12-01 Material de soldadura blanda exento de plomo y su utilizacion.

Country Status (6)

Country Link
EP (1) EP0715927B1 (es)
JP (1) JP3562891B2 (es)
AT (1) ATE200048T1 (es)
DE (2) DE4443459C2 (es)
DK (1) DK0715927T3 (es)
ES (1) ES2156914T3 (es)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5755896A (en) * 1996-11-26 1998-05-26 Ford Motor Company Low temperature lead-free solder compositions
GB9701819D0 (en) * 1997-01-29 1997-03-19 Alpha Fry Ltd Lead-free tin alloy
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP3622462B2 (ja) 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
US6156132A (en) * 1998-02-05 2000-12-05 Fuji Electric Co., Ltd. Solder alloys
JP2000068410A (ja) * 1998-08-20 2000-03-03 Nishihara Riko Kk Ｐｂに代わる接合材料で接合端子部にバンプメッキを施した ＢＧＡ又は ＣＳＰ等のＩＣパッケ−ジ
US6660226B1 (en) 2000-08-07 2003-12-09 Murata Manufacturing Co., Ltd. Lead free solder and soldered article
JP3599101B2 (ja) * 2000-12-11 2004-12-08 株式会社トッパンＮｅｃサーキットソリューションズ はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法
JP4064217B2 (ja) 2002-11-26 2008-03-19 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用材料
US20140145097A1 (en) * 2004-04-14 2014-05-29 Steven G. Caldwell Radiation shields and methods of making the same
TWI279281B (en) * 2004-05-20 2007-04-21 Theresa Inst Co Ltd Lead-free solder alloy and preparation thereof
JP4939072B2 (ja) * 2005-02-15 2012-05-23 パナソニック株式会社 導電性接着剤
JP4831069B2 (ja) * 2005-08-18 2011-12-07 千住金属工業株式会社 鉛フリー低温はんだ
EP2052805B1 (en) * 2006-08-04 2016-09-28 Panasonic Intellectual Property Management Co., Ltd. Bonding material, bonded portion and circuit board
BR112014002504B8 (pt) * 2011-08-02 2023-01-31 Alpha Assembly Solutions Inc Liga de solda com alta tenacidade ao impacto, junta soldada e uso da liga
JP6548537B2 (ja) * 2015-09-10 2019-07-24 株式会社弘輝 はんだ合金及びはんだ組成物
JP6418349B1 (ja) * 2018-03-08 2018-11-07 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手
CN115647642B (zh) * 2022-11-05 2023-05-16 郑州机械研究所有限公司 一种低熔合金钎料粉及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481795A (en) * 1965-08-09 1969-12-02 Westinghouse Electric Corp Thermoelectric device including tin solder with particles of iron,cobalt or nickel
GB8617676D0 (en) * 1986-07-19 1986-08-28 Ae Plc Bearing alloys
SU1479250A1 (ru) * 1987-05-12 1989-05-15 Киевское Научно-Производственное Объединение Малотоннажных Смазочных Материалов "Масма" Припой дл низкотемпературной пайки
US5346775A (en) * 1993-02-22 1994-09-13 At&T Laboratories Article comprising solder with improved mechanical properties
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金

Also Published As

Publication number Publication date
DE4443459C2 (de) 1996-11-21
JPH08224689A (ja) 1996-09-03
EP0715927B1 (de) 2001-03-28
DE59509128D1 (de) 2001-05-03
ATE200048T1 (de) 2001-04-15
DK0715927T3 (da) 2001-07-16
EP0715927A1 (de) 1996-06-12
JP3562891B2 (ja) 2004-09-08
DE4443459A1 (de) 1996-06-13

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