TW254875B - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- TW254875B TW254875B TW084102288A TW84102288A TW254875B TW 254875 B TW254875 B TW 254875B TW 084102288 A TW084102288 A TW 084102288A TW 84102288 A TW84102288 A TW 84102288A TW 254875 B TW254875 B TW 254875B
- Authority
- TW
- Taiwan
- Prior art keywords
- lead
- free solder
- solder alloy
- formula
- value
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Abstract
A lead-free solder alloy, which is characterized in comprising 1~4 wt% of Ag comprising at least one of Bi, In so that the A value in formula (1) is higher than 5.00 and the B value in formula (2) is lower than 6.90, and the remaining part of Sn. A = [Ag wt%]+1.23[Bi wt%]+0.52[In wt%] ...(1) B = [Ag wt%]+1.19[Bi wt%]+0.50[In wt%] ...(2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29388094 | 1994-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW254875B true TW254875B (en) | 1995-08-21 |
Family
ID=51401535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW084102288A TW254875B (en) | 1994-11-02 | 1995-03-10 | Lead-free solder alloy |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100320317B1 (en) |
TW (1) | TW254875B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101640691B1 (en) * | 2014-12-31 | 2016-07-19 | 세종대학교산학협력단 | Sn based alloy having improved mechanical property |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9103018D0 (en) * | 1991-02-13 | 1991-03-27 | Lancashire Fittings Ltd | Lead free soft solder for stainless steel |
US5256370B1 (en) * | 1992-05-04 | 1996-09-03 | Indium Corp America | Lead-free alloy containing tin silver and indium |
-
1995
- 1995-03-10 TW TW084102288A patent/TW254875B/en not_active IP Right Cessation
- 1995-03-11 KR KR1019950005048A patent/KR100320317B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960017880A (en) | 1996-06-17 |
KR100320317B1 (en) | 2002-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |