TW254875B - Lead-free solder alloy - Google Patents

Lead-free solder alloy

Info

Publication number
TW254875B
TW254875B TW084102288A TW84102288A TW254875B TW 254875 B TW254875 B TW 254875B TW 084102288 A TW084102288 A TW 084102288A TW 84102288 A TW84102288 A TW 84102288A TW 254875 B TW254875 B TW 254875B
Authority
TW
Taiwan
Prior art keywords
lead
free solder
solder alloy
formula
value
Prior art date
Application number
TW084102288A
Other languages
Chinese (zh)
Inventor
Ryuji Futamiya
Junichi Matsunaga
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Application granted granted Critical
Publication of TW254875B publication Critical patent/TW254875B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)

Abstract

A lead-free solder alloy, which is characterized in comprising 1~4 wt% of Ag comprising at least one of Bi, In so that the A value in formula (1) is higher than 5.00 and the B value in formula (2) is lower than 6.90, and the remaining part of Sn. A = [Ag wt%]+1.23[Bi wt%]+0.52[In wt%] ...(1) B = [Ag wt%]+1.19[Bi wt%]+0.50[In wt%] ...(2)
TW084102288A 1994-11-02 1995-03-10 Lead-free solder alloy TW254875B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29388094 1994-11-02

Publications (1)

Publication Number Publication Date
TW254875B true TW254875B (en) 1995-08-21

Family

ID=51401535

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084102288A TW254875B (en) 1994-11-02 1995-03-10 Lead-free solder alloy

Country Status (2)

Country Link
KR (1) KR100320317B1 (en)
TW (1) TW254875B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101640691B1 (en) * 2014-12-31 2016-07-19 세종대학교산학협력단 Sn based alloy having improved mechanical property

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
US5256370B1 (en) * 1992-05-04 1996-09-03 Indium Corp America Lead-free alloy containing tin silver and indium

Also Published As

Publication number Publication date
KR100320317B1 (en) 2002-04-22
KR960017880A (en) 1996-06-17

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Legal Events

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MK4A Expiration of patent term of an invention patent