ES2150957T3 - Modulo de un elemento de semiconductor. - Google Patents

Modulo de un elemento de semiconductor.

Info

Publication number
ES2150957T3
ES2150957T3 ES94105703T ES94105703T ES2150957T3 ES 2150957 T3 ES2150957 T3 ES 2150957T3 ES 94105703 T ES94105703 T ES 94105703T ES 94105703 T ES94105703 T ES 94105703T ES 2150957 T3 ES2150957 T3 ES 2150957T3
Authority
ES
Spain
Prior art keywords
sleeve
lens
semiconductor
stem
accommodation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94105703T
Other languages
English (en)
Inventor
Ichiro Tonai
Osamu Akita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of ES2150957T3 publication Critical patent/ES2150957T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Guides In General And Applications Therefor (AREA)

Abstract

EL ELEMENTO MODULAR SEMICONDUCTOR DE LA INVENCION COMPRENDE UN MANGUITO (1), UN VASTAGO (31), UN ELEMENTO SEMICONDUCTOR EMISOR O RECEPTOR DE LUZ (41) Y UNA LENTE CONVERGENTE (20). EN EL MANGUITO (1), UNA PARTE DE AJUSTE (11), EN LA QUE SE HA DE COLOCAR UNA TAPA DE CONTACTO PARA COLOCAR UNA FIBRA OPTICA, SE FORMA DESDE UN EXTREMO ABIERTO HACIA EL INTERIOR, SE FORMA UNA PARTE DE ELEMENTO DE ALOJAMIENTO (13), COAXIAL CON LA PARTE DE AJUSTE (11), DESDE EL OTRO EXTREMO ABIERTO HACIA EL INTERIOR, Y UNA PARTE SUSTENTADORA DE LA LENTE (12) SE FORMA PARA CONECTAR LA PARTE DE AJUSTE (11) Y LA PARTE DE ELEMENTO DE ALOJAMIENTO (13). EL VASTAGO (31) SE SUJETA AL MANGUITO (19 EN EL OTRO EXTREMO ABIERTO. EL ELEMENTO SEMICONDUCTOR RECEPTOR O EMISOR DE LUZ (41) SE SUJETA SOBRE UNA SUPERFICIE DEL VASTAGO (31) SOBRE EL LADO DE LA PARTE DEL ELEMENTO DE ALOJAMIENTO. LA LENTE CONVERGENTE (20) SE ALOJA EN LA PARTE SUSTENTADORA DE LENTE Y FIJA AL MANGUITO (1), Y EMPAREJA OPTICAMENTE UNA DE LAS CARAS DE LA FIBRA OPTICA A LA CARA EMISORA DE LUZ DEL ELEMENTO SEMICONDUCTOR EMISOR DE LUZ (41) O LA CARA RECEPTORA DE LUZ DEL ELEMENTO SEMICONDUCTOR RECEPTOR DE LUZ (419. EL MATERIAL QUE CONSTITUYE EL MANGUITO (1) INCLUYE UN METAL QUE TIENE UN COEFICIENTE DE EXPANSION TERMICA PROXIMO AL DEL MATERIAL QUE CONSTITUYE LA LENTE CONVERGENTE (20).
ES94105703T 1993-04-16 1994-04-13 Modulo de un elemento de semiconductor. Expired - Lifetime ES2150957T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5090059A JPH06300943A (ja) 1993-04-16 1993-04-16 半導体素子モジュール

Publications (1)

Publication Number Publication Date
ES2150957T3 true ES2150957T3 (es) 2000-12-16

Family

ID=13988007

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94105703T Expired - Lifetime ES2150957T3 (es) 1993-04-16 1994-04-13 Modulo de un elemento de semiconductor.

Country Status (8)

Country Link
US (1) US5452389A (es)
EP (1) EP0620460B1 (es)
JP (1) JPH06300943A (es)
KR (1) KR0179057B1 (es)
CA (1) CA2120964C (es)
DE (1) DE69425521T2 (es)
DK (1) DK0620460T3 (es)
ES (1) ES2150957T3 (es)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5764838A (en) * 1995-09-05 1998-06-09 Nippon Aspherical Lens Co., Ltd. Aspherical lens for optical fiber and optically coupling construction using the same
KR0171844B1 (ko) * 1995-11-10 1999-05-01 김광호 볼렌즈를 이용한 광결합계 장치 및 광결합계 제작방법
US6071017A (en) * 1996-01-18 2000-06-06 Methode Electronics, Inc. Optical package with alignment means and method of assembling an optical package
US6283644B1 (en) * 1996-01-18 2001-09-04 Stratos Lightwave, Inc. Optical package with alignment means and method of assembling an optical package
US5815623A (en) * 1996-01-18 1998-09-29 Methode Electronics, Inc. Optical package with alignment means and method of assembling an optical package
US5812717A (en) * 1996-01-18 1998-09-22 Methode Electronics, Inc. Optical package with alignment means and method of assembling an optical package
US6550983B1 (en) * 1996-01-18 2003-04-22 Stratos Lightwave Llc Optical package with alignment means and method of assembling an optical package
JPH09218324A (ja) * 1996-02-08 1997-08-19 Alps Electric Co Ltd 発光モジュール
JP3310910B2 (ja) * 1997-06-24 2002-08-05 日本板硝子株式会社 光モジュール
US5940564A (en) * 1997-08-05 1999-08-17 Picolight, Inc. Device for coupling a light source or receiver to an optical waveguide
JPH11231177A (ja) * 1997-12-12 1999-08-27 Oki Electric Ind Co Ltd 光素子モジュール及び光素子モジュールの製造方法
US6243508B1 (en) * 1999-06-01 2001-06-05 Picolight Incorporated Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide
TW449948B (en) * 1999-06-29 2001-08-11 Rohm Co Ltd Semiconductor device
US6325551B1 (en) 1999-12-08 2001-12-04 New Focus, Inc. Method and apparatus for optically aligning optical fibers with optical devices
TW474056B (en) * 1999-12-10 2002-01-21 Sumitomo Electric Industries Optical semiconductor module
US6632029B1 (en) 1999-12-22 2003-10-14 New Focus, Inc. Method & apparatus for packaging high frequency components
US6540412B2 (en) * 2000-02-10 2003-04-01 Sumitomo Electric Industries, Ltd. Optical transceiver
US6812057B2 (en) * 2000-07-07 2004-11-02 Nippon Sheet Glass Co., Ltd. Method of producing an optical module
JP2002043675A (ja) * 2000-07-25 2002-02-08 Nippon Sheet Glass Co Ltd 光モジュール
JP2003185892A (ja) 2001-12-19 2003-07-03 Sumitomo Electric Ind Ltd 光接続用スリーブ、光モジュール、及び光通信モジュール
US6966705B2 (en) * 2001-12-19 2005-11-22 Sumitomo Electric Industries, Ltd. Optical connection sleeve, optical module and optical communication module
US20050141820A1 (en) * 2003-10-01 2005-06-30 Tyco Electronics Corporation Optoelectric package
JP4965201B2 (ja) 2005-12-09 2012-07-04 株式会社エンプラス 光モジュール用ホルダ、光モジュールおよび光コネクタ
KR100746260B1 (ko) * 2007-01-30 2007-08-03 (주)디나옵틱스 광송수신 모듈의 광송신/수신 서브어셈블리용 볼렌즈유닛과그 제조장치 및 제조방법
US9547133B2 (en) * 2010-03-31 2017-01-17 University Court Of The University Of St Andrews LED illuminator for side-emitting optical fibers
JP5947490B2 (ja) * 2011-04-12 2016-07-06 三菱鉛筆株式会社 光コリメータ
JP6411088B2 (ja) * 2013-09-26 2018-10-24 オリンパス株式会社 光伝送モジュールおよび内視鏡
CN108957619B (zh) * 2018-07-25 2022-09-27 京东方科技集团股份有限公司 一种导光组件、导光组件的制作方法以及背光源
CN114614338B (zh) * 2022-02-24 2023-06-27 中国电子科技集团公司第二十九研究所 一种高可靠性的激光器输出光纤封装结构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3429282A1 (de) * 1984-08-08 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches modul
US4726648A (en) * 1985-02-13 1988-02-23 Siemens Aktiengesellschaft Optoelectronic module
JPS6279213U (es) * 1985-11-01 1987-05-21
US4752743A (en) * 1986-09-26 1988-06-21 Varian Associates, Inc. Linearizer for TWT amplifiers
EP0407919B1 (en) * 1989-07-11 1996-04-24 Harmonic Lightwaves, Inc. Optical transmitters linearized by means of parametric feedback
US5127072A (en) * 1990-03-08 1992-06-30 Ortel Corporation Laser module with compliant optical fiber coupling
DE4022076A1 (de) * 1990-07-10 1992-01-16 Siemens Ag Vorrichtung zur uebertragung von licht
JPH04165312A (ja) * 1990-10-30 1992-06-11 Nikko Kyodo Co Ltd 光モジュール及びその製造方法
JPH04309907A (ja) * 1991-04-09 1992-11-02 Mitsubishi Electric Corp 光半導体素子モジュールの製造方法
US5146526A (en) * 1991-04-12 1992-09-08 Amoco Corporation Laser pigtail assembly and method
JP2763016B2 (ja) * 1991-12-25 1998-06-11 日本電気株式会社 光学素子基板の実装構造
US5291571A (en) * 1992-03-19 1994-03-01 Fujitsu Limited Duplicated light source module

Also Published As

Publication number Publication date
US5452389A (en) 1995-09-19
EP0620460A1 (en) 1994-10-19
DE69425521D1 (de) 2000-09-21
DK0620460T3 (da) 2000-12-18
KR0179057B1 (ko) 1999-05-15
JPH06300943A (ja) 1994-10-28
EP0620460B1 (en) 2000-08-16
CA2120964C (en) 2004-06-29
DE69425521T2 (de) 2001-04-26
CA2120964A1 (en) 1994-10-17

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