ES2116426T3 - Formacion de capas semiconductoras dopadas con tierras raras sobresaturadas por cvd. - Google Patents
Formacion de capas semiconductoras dopadas con tierras raras sobresaturadas por cvd.Info
- Publication number
- ES2116426T3 ES2116426T3 ES93480110T ES93480110T ES2116426T3 ES 2116426 T3 ES2116426 T3 ES 2116426T3 ES 93480110 T ES93480110 T ES 93480110T ES 93480110 T ES93480110 T ES 93480110T ES 2116426 T3 ES2116426 T3 ES 2116426T3
- Authority
- ES
- Spain
- Prior art keywords
- reactor
- rare earth
- erbio
- doped
- dvq
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
- H10F77/1223—Active materials comprising only Group IV materials characterised by the dopants
-
- H10P32/12—
-
- H10P14/24—
-
- H10P14/2905—
-
- H10P14/3411—
-
- H10P14/3446—
-
- H10P32/171—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S252/00—Compositions
- Y10S252/95—Doping agent source material
- Y10S252/951—Doping agent source material for vapor transport
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/914—Doping
- Y10S438/918—Special or nonstandard dopant
Landscapes
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
SE DESCUBRE UN PROCESO DVQ PARA PRODUCIR UNA CAPA SEMICONDUCTORA EPITAXIAL, DOPADA CON TIERRA RARA, SOBRE UN SUSTRATO. EL EQUIPO ES UN REACTOR DE DEPOSICION DE VAPOR QUIMICO EN VACIO ULTRA ALTO (DVQVUA) DE 7,6 CM DE DIAMETRO, EN DONDE EL BOMBEO Y LA CARGA DE LA PASTILLA SON HECHOS EN EL MISMO EXTREMO DEL REACTOR. ESTA MODIFICACION PERMITE LA INSTALACION DE UN DEPOSITO (1) DE PRECURSOR CALENTADO SOBRE EL EXTREMO OPUESTO DEL REACTOR. EL DEPOSITO ESTA CONECTADO AL FLANCO DEL EXTREMO DEL REACTOR USANDO UN TUBO (12) DE ACERO INOXIDABLE DE DIAMETRO CORTO. EL REACTOR ES CALENTADO POR CALENTADORES (4) RESISTIVOS EXTERNOS. EL REACTOR ES BOMBEADO ANTES Y DURANTE LA DEPOSICION POR UNA BOMBA (8) TURBOMOLECULAR DE 150 L/SEG RESPALDADA POR UNA BOMBA (9) DE ACEITE DE DOS ETAPAS. LA CAMARA DE INMOVILIZACION DE CARGA ES TAMBIEN BOMBEADA POR UNA BOMBA (10) TURBOMOLECULAR PARA PREVENIR LA CONTAMINACION DE LA BOMBA DE ACEITE. EL PROCESO UTILIZA SILANO O GERMANIO Y UN COMPUESTO DE TIERRA RARA EN LA FASE DE GAS.POR ESTE METODO DE FASE UNICA SE PRODUCEN CAPAS SEMICONDUCTORAS DOPADAS CON TIERRA RARA, SUPERSATURADAS CON LA TIERRA RARA. LA TIERRA RARA PREFERIDA ES ERBIO Y LOS PRECURSORES PREFERIDOS PARA DEPOSITAR ERBIO POR DVQ SON ERBIO HEXAFLUOROACETILOACETONATO, ACETILOACETONATO, TETRAMETILOEPTANODIONATO Y FLUOROOCTANODIONATO. EL PROCESO PUEDE SER USADO PARA PRODUCIR DISPOSITIVOS OPTOELECTRONICOS QUE COMPRENDEN UN SUSTRATO DE SILICIO Y UNA PELICULA DE SILICIO EPITAXIAL DOPADA CON ERBIO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/940,416 US5322813A (en) | 1992-08-31 | 1992-08-31 | Method of making supersaturated rare earth doped semiconductor layers by chemical vapor deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2116426T3 true ES2116426T3 (es) | 1998-07-16 |
Family
ID=25474795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES93480110T Expired - Lifetime ES2116426T3 (es) | 1992-08-31 | 1993-07-30 | Formacion de capas semiconductoras dopadas con tierras raras sobresaturadas por cvd. |
Country Status (11)
| Country | Link |
|---|---|
| US (3) | US5322813A (es) |
| EP (1) | EP0586321B1 (es) |
| JP (1) | JPH0785467B2 (es) |
| KR (1) | KR970008339B1 (es) |
| CN (3) | CN1054234C (es) |
| AT (1) | ATE166491T1 (es) |
| CA (1) | CA2095449C (es) |
| DE (1) | DE69318653T2 (es) |
| ES (1) | ES2116426T3 (es) |
| MX (1) | MX9305267A (es) |
| TW (1) | TW229325B (es) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4873549A (en) * | 1987-03-03 | 1989-10-10 | Mita Industrial Co., Ltd. | Device for detecting the life of an image forming process unit, opening of a seal of the unit and attachment of the unit to an image forming apparatus |
| DE69323884T2 (de) * | 1993-10-20 | 1999-07-22 | Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania | Elektrolumineszente Festkörpervorrichtung und Verfahren zu ihrer Herstellung |
| US6093246A (en) * | 1995-09-08 | 2000-07-25 | Sandia Corporation | Photonic crystal devices formed by a charged-particle beam |
| US5976941A (en) * | 1997-06-06 | 1999-11-02 | The Whitaker Corporation | Ultrahigh vacuum deposition of silicon (Si-Ge) on HMIC substrates |
| US6130471A (en) * | 1997-08-29 | 2000-10-10 | The Whitaker Corporation | Ballasting of high power silicon-germanium heterojunction biploar transistors |
| US6040225A (en) * | 1997-08-29 | 2000-03-21 | The Whitaker Corporation | Method of fabricating polysilicon based resistors in Si-Ge heterojunction devices |
| KR100377716B1 (ko) * | 1998-02-25 | 2003-03-26 | 인터내셔널 비지네스 머신즈 코포레이션 | 광학적 방사를 위해 희토류 원소로 도핑된 실리콘 구조체 및 방사방법 |
| EP1131611A4 (en) | 1998-06-29 | 2003-01-02 | Univ State San Diego | METHOD AND DEVICE FOR DETERMINING HYDROCARBON COMPOUNDS AND THEIR APPLICATIONS THEREOF |
| US6140669A (en) * | 1999-02-20 | 2000-10-31 | Ohio University | Gallium nitride doped with rare earth ions and method and structure for achieving visible light emission |
| US6143072A (en) * | 1999-04-06 | 2000-11-07 | Ut-Battelle, Llc | Generic process for preparing a crystalline oxide upon a group IV semiconductor substrate |
| US6255669B1 (en) * | 1999-04-23 | 2001-07-03 | The University Of Cincinnati | Visible light emitting device formed from wide band gap semiconductor doped with a rare earth element |
| KR100510996B1 (ko) * | 1999-12-30 | 2005-08-31 | 주식회사 하이닉스반도체 | 선택적 에피텍셜 성장 공정의 최적화 방법 |
| US6519543B1 (en) * | 2000-05-09 | 2003-02-11 | Agere Systems Inc. | Calibration method for quantitative elemental analysis |
| US6734453B2 (en) | 2000-08-08 | 2004-05-11 | Translucent Photonics, Inc. | Devices with optical gain in silicon |
| KR100384892B1 (ko) * | 2000-12-01 | 2003-05-22 | 한국전자통신연구원 | 에르븀이 도핑된 실리콘나노점의 형성 방법 |
| US6853447B2 (en) * | 2001-02-12 | 2005-02-08 | Analytical Spectral Devices, Inc. | System and method for the collection of spectral image data |
| US6894772B2 (en) * | 2001-02-12 | 2005-05-17 | Analytical Spectral Devices | System and method for grouping reflectance data |
| JP2002334868A (ja) * | 2001-05-10 | 2002-11-22 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| US20030111013A1 (en) * | 2001-12-19 | 2003-06-19 | Oosterlaken Theodorus Gerardus Maria | Method for the deposition of silicon germanium layers |
| US6771369B2 (en) * | 2002-03-12 | 2004-08-03 | Analytical Spectral Devices, Inc. | System and method for pharmacy validation and inspection |
| US7081664B2 (en) * | 2003-01-22 | 2006-07-25 | Group Iv Semiconductor Inc. | Doped semiconductor powder and preparation thereof |
| US7440180B2 (en) * | 2004-02-13 | 2008-10-21 | Tang Yin S | Integration of rare-earth doped amplifiers into semiconductor structures and uses of same |
| US7163878B2 (en) * | 2004-11-12 | 2007-01-16 | Texas Instruments Incorporated | Ultra-shallow arsenic junction formation in silicon germanium |
| CN100385693C (zh) * | 2005-08-18 | 2008-04-30 | 中国科学院半导体研究所 | 用等离子体处理提高硅基晶体薄膜发光的方法 |
| DE102006031300A1 (de) * | 2006-06-29 | 2008-01-03 | Schmid Technology Systems Gmbh | Verfahren zur Dotierung von Siliziummaterial für Solarzellen, entsprechend dotiertes Siliziummaterial und Solarzelle |
| US20080138955A1 (en) * | 2006-12-12 | 2008-06-12 | Zhiyuan Ye | Formation of epitaxial layer containing silicon |
| KR101711356B1 (ko) * | 2008-06-05 | 2017-02-28 | 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | 란탄족 함유 전구체의 제조 및 란탄족 함유 필름의 증착 방법 |
| US8269253B2 (en) * | 2009-06-08 | 2012-09-18 | International Rectifier Corporation | Rare earth enhanced high electron mobility transistor and method for fabricating same |
| CN102828242B (zh) * | 2012-09-06 | 2015-05-27 | 西安隆基硅材料股份有限公司 | 含有下转换发光量子点的晶体硅及其制备方法 |
| US9481917B2 (en) * | 2012-12-20 | 2016-11-01 | United Technologies Corporation | Gaseous based desulfurization of alloys |
| WO2015017395A1 (en) * | 2013-07-30 | 2015-02-05 | Board Of Regents, The University Of Texas System | Sample transfer to high vacuum transition flow |
| US9850573B1 (en) | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US10364259B2 (en) * | 2016-12-30 | 2019-07-30 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Zirconium, hafnium, titanium precursors and deposition of group 4 containing films using the same |
| US10975469B2 (en) | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
| GB201812765D0 (en) * | 2018-08-06 | 2018-09-19 | Univ London Queen Mary | Substrate layer |
| CN119640395B (zh) * | 2025-02-13 | 2025-07-01 | 清华大学 | 二维单晶稀土化合物纳米片的制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1900116C3 (de) * | 1969-01-02 | 1978-10-19 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zum Herstellen hxxochreiner, aus Silicium bestehender einkristalliner Schichten |
| US4385946A (en) * | 1981-06-19 | 1983-05-31 | Bell Telephone Laboratories, Incorporated | Rapid alteration of ion implant dopant species to create regions of opposite conductivity |
| DE3319134A1 (de) * | 1983-05-26 | 1985-05-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 8000 München | Optoelektronisches bauelement, insbesondere eine laserdiode oder eine leuchtdiode |
| US4618381A (en) * | 1983-05-26 | 1986-10-21 | Fuji Electric Corporate Research And Development Ltd. | Method for adding impurities to semiconductor base material |
| US4800173A (en) * | 1986-02-20 | 1989-01-24 | Canon Kabushiki Kaisha | Process for preparing Si or Ge epitaxial film using fluorine oxidant |
| US4826288A (en) * | 1987-04-09 | 1989-05-02 | Polaroid Corporation, Patent Department | Method for fabricating optical fibers having cores with high rare earth content |
| US5248890A (en) * | 1989-05-13 | 1993-09-28 | Forschungszentrum Julich Gmbh | Valance specific lanthanide doped optoelectronic metal fluoride semiconductor device |
| US5296048A (en) * | 1989-05-31 | 1994-03-22 | International Business Machines Corporation | Class of magnetic materials for solid state devices |
| FR2650704B1 (fr) * | 1989-08-01 | 1994-05-06 | Thomson Csf | Procede de fabrication par epitaxie de couches monocristallines de materiaux a parametres de mailles differents |
| JPH042699A (ja) * | 1990-04-18 | 1992-01-07 | Mitsubishi Electric Corp | 結晶成長方法 |
| US5119460A (en) * | 1991-04-25 | 1992-06-02 | At&T Bell Laboratories | Erbium-doped planar optical device |
| US5107538A (en) * | 1991-06-06 | 1992-04-21 | At&T Bell Laboratories | Optical waveguide system comprising a rare-earth Si-based optical device |
| US5511946A (en) * | 1994-12-08 | 1996-04-30 | General Electric Company | Cooled airfoil tip corner |
-
1992
- 1992-08-31 US US07/940,416 patent/US5322813A/en not_active Expired - Lifetime
-
1993
- 1993-05-04 CA CA002095449A patent/CA2095449C/en not_active Expired - Fee Related
- 1993-07-28 JP JP5185980A patent/JPH0785467B2/ja not_active Expired - Fee Related
- 1993-07-30 ES ES93480110T patent/ES2116426T3/es not_active Expired - Lifetime
- 1993-07-30 EP EP93480110A patent/EP0586321B1/en not_active Expired - Lifetime
- 1993-07-30 DE DE69318653T patent/DE69318653T2/de not_active Expired - Lifetime
- 1993-07-30 AT AT93480110T patent/ATE166491T1/de active
- 1993-08-19 TW TW082106685A patent/TW229325B/zh not_active IP Right Cessation
- 1993-08-30 KR KR1019930017032A patent/KR970008339B1/ko not_active Expired - Fee Related
- 1993-08-30 CN CN93117079A patent/CN1054234C/zh not_active Expired - Fee Related
- 1993-08-30 MX MX9305267A patent/MX9305267A/es not_active IP Right Cessation
-
1994
- 1994-03-09 US US08/207,942 patent/US5534079A/en not_active Expired - Lifetime
-
1995
- 1995-06-06 US US08/468,367 patent/US5646425A/en not_active Expired - Fee Related
-
1999
- 1999-11-09 CN CN99123482A patent/CN1114225C/zh not_active Expired - Fee Related
- 1999-11-09 CN CN99123481A patent/CN1117389C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US5534079A (en) | 1996-07-09 |
| DE69318653D1 (de) | 1998-06-25 |
| CN1114225C (zh) | 2003-07-09 |
| US5322813A (en) | 1994-06-21 |
| EP0586321B1 (en) | 1998-05-20 |
| EP0586321A2 (en) | 1994-03-09 |
| EP0586321A3 (en) | 1996-03-27 |
| MX9305267A (es) | 1994-02-28 |
| CN1054234C (zh) | 2000-07-05 |
| CA2095449C (en) | 1997-09-16 |
| ATE166491T1 (de) | 1998-06-15 |
| CN1255735A (zh) | 2000-06-07 |
| KR940004714A (ko) | 1994-03-15 |
| CN1255736A (zh) | 2000-06-07 |
| DE69318653T2 (de) | 1999-02-04 |
| JPH06177062A (ja) | 1994-06-24 |
| CN1085353A (zh) | 1994-04-13 |
| JPH0785467B2 (ja) | 1995-09-13 |
| CA2095449A1 (en) | 1994-03-01 |
| TW229325B (es) | 1994-09-01 |
| KR970008339B1 (ko) | 1997-05-23 |
| CN1117389C (zh) | 2003-08-06 |
| US5646425A (en) | 1997-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2116426T3 (es) | Formacion de capas semiconductoras dopadas con tierras raras sobresaturadas por cvd. | |
| EP0154483B1 (en) | Improved pulsed plasma process | |
| US6068884A (en) | Method of making low κ dielectric inorganic/organic hybrid films | |
| US6764714B2 (en) | Method for depositing coatings on the interior surfaces of tubular walls | |
| US4363828A (en) | Method for depositing silicon films and related materials by a glow discharge in a disiland or higher order silane gas | |
| US6410463B1 (en) | Method for forming film with low dielectric constant on semiconductor substrate | |
| US7087536B2 (en) | Silicon oxide gapfill deposition using liquid precursors | |
| CA1073405A (en) | Method of coating semiconductor substrates | |
| JP5848862B2 (ja) | カプセル化膜の遮水性能の改善 | |
| ES2096768T3 (es) | Aparato para tratamientos rapidos con plasma y metodo. | |
| KR102023206B1 (ko) | 소자 및 기판의 봉입을 위한 투과 차단체 | |
| KR930005115A (ko) | 저온,고압 상태에서의 실리콘 증착방법 | |
| TW366514B (en) | Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment | |
| ES2090514T3 (es) | Deposicion en fase de vapor de resina de silsesquioxano de hidrogeno. | |
| KR880003413A (ko) | 반도체 기판내로 에칭된 트렌치의 측벽 및 바닥에 예정된 도핑을 생성시키는 방법 | |
| US7351480B2 (en) | Tubular structures with coated interior surfaces | |
| TW200514145A (en) | Method and apparatus for depositing materials with tunable optical properties and etching characteristics | |
| EP1317775A2 (en) | Materials having low dielectric constants and methods of making | |
| Alexandrov et al. | Formation of silicon nitride films by remote plasma‐enhanced chemical vapour deposition | |
| Eley et al. | Relative rate studies for silylene | |
| GT199600008A (es) | Proceso para la produccion de un recubrimiento de proteccionsobre la superficie de un articulo de vidrio o ceramica | |
| Woo Park et al. | Photoluminescence and Electroluminescence from Polymer-Like Organic Thin Films Deposited by Plasma-Enhanced Chemical Vapor Deposition Using Para-Xylene as Precursor | |
| US4597985A (en) | Low temperature deposition of silicon oxides for device fabrication | |
| EP0187826B1 (en) | Fabrication of devices with a silicon oxide region | |
| Vassiliev et al. | The investigation on the deposition kinetics of sub-atmospheric pressure glass films |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
Ref document number: 586321 Country of ref document: ES |