ES2115825T3 - Revestimientos conductores que contienen plata. - Google Patents

Revestimientos conductores que contienen plata.

Info

Publication number
ES2115825T3
ES2115825T3 ES94112807T ES94112807T ES2115825T3 ES 2115825 T3 ES2115825 T3 ES 2115825T3 ES 94112807 T ES94112807 T ES 94112807T ES 94112807 T ES94112807 T ES 94112807T ES 2115825 T3 ES2115825 T3 ES 2115825T3
Authority
ES
Spain
Prior art keywords
coatings
silver
conductive coatings
containing silver
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES94112807T
Other languages
English (en)
Inventor
Joanna Oprosky
David Stotka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DMC2 Degussa Metals Catalysts Cerdec AG
Original Assignee
Cerdec AG Keramische Farben
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cerdec AG Keramische Farben filed Critical Cerdec AG Keramische Farben
Application granted granted Critical
Publication of ES2115825T3 publication Critical patent/ES2115825T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/18—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions containing free metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Glass Compositions (AREA)
  • Surface Treatment Of Glass (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Photoreceptors In Electrophotography (AREA)

Abstract

SE PROPORCIONAN RECUBRIMIENTOS CONDUCTIVOS QUE CONTIENE PLATA. LOS RECUBRIMIENTOS ESTAN PREPARADOS A PARTIR DE COMPOSICIONES QUE CONTIENEN UN MATERIAL CON PARTICULAS DE PLATA, UNA FRITA DE VIDRIO DE BAJA COCCION Y SIN PLOMO Y UN VEHICULO LIQUIDO ORGANICO. LA COMPOSICION SE RECUBRE SOBRE UN SUBSTRATO Y SE CUECE PARA FUNDIR EL RECUBRIMIENTO CONDUCTIVO QUE CONTIENE PLATA CON EL SUBSTRATO. LOS RECUBRIMIENTOS ENCUENTRAN UNA PARTICULAR APLICACION EN EL CAMPO DE LUCES TRASERAS DE AUTOMOCION. LOS RECUBRIMIENTOS SON DE ESPECIAL VALOR A LA HORA DE ELIMINAR HUMEDAD DE SOLDADURA A TRAVES DE MIGRACION.
ES94112807T 1993-08-31 1994-08-17 Revestimientos conductores que contienen plata. Expired - Lifetime ES2115825T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/113,666 US5346651A (en) 1993-08-31 1993-08-31 Silver containing conductive coatings

Publications (1)

Publication Number Publication Date
ES2115825T3 true ES2115825T3 (es) 1998-07-01

Family

ID=22350801

Family Applications (1)

Application Number Title Priority Date Filing Date
ES94112807T Expired - Lifetime ES2115825T3 (es) 1993-08-31 1994-08-17 Revestimientos conductores que contienen plata.

Country Status (10)

Country Link
US (2) US5346651A (es)
EP (1) EP0640993B1 (es)
JP (1) JP3574683B2 (es)
AT (1) ATE163488T1 (es)
BR (1) BR9403375A (es)
CA (1) CA2131138C (es)
DE (1) DE69408609T2 (es)
DK (1) DK0640993T3 (es)
ES (1) ES2115825T3 (es)
GR (1) GR3026652T3 (es)

Families Citing this family (53)

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Publication number Priority date Publication date Assignee Title
JP2677161B2 (ja) * 1993-07-08 1997-11-17 双葉電子工業株式会社 蛍光表示管
US5714246A (en) * 1994-05-13 1998-02-03 Ferro Corporation Conductive silver low temperature cofired metallic green tape
US5439852A (en) * 1994-08-01 1995-08-08 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film conductor composition
US5492653A (en) * 1994-11-07 1996-02-20 Heraeus Incorporated Aqueous silver composition
JP3541070B2 (ja) * 1994-11-15 2004-07-07 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 自動車ガラスの厚膜導電体ペースト
US5647901A (en) * 1994-12-14 1997-07-15 Cerdec Corporation High loading, low viscosity medium for ceramic coating composition
JP3019138B2 (ja) * 1995-03-30 2000-03-13 株式会社住友金属エレクトロデバイス 銀系導電性ペースト及びそれを用いた多層セラミック回路基板
GB9518033D0 (en) * 1995-09-05 1995-11-08 Cookson Matthey Ceramics Plc Composition
US5670089A (en) * 1995-12-07 1997-09-23 E. I. Du Pont De Nemours And Company Conductive paste for MLC termination
US5714420A (en) 1995-12-08 1998-02-03 Cerdec Corporation - Drakenfeld Products Partially crystallizing ceramic enamel composition containing bismuth silicate, and use thereof
US5677251A (en) * 1996-04-25 1997-10-14 Cerdec Corporation Partially crystallizing enamel containing crystalline zinc borate seed material
US5629247A (en) * 1996-05-08 1997-05-13 The O'hommel Company High bismuth oxide based flux and paint compositions for glass substrates
FR2757150B1 (fr) * 1996-12-12 1999-01-22 Saint Gobain Vitrage Procede d'emaillage de substrats en verre, composition d'email utilisee et produits obtenus
US5783507A (en) * 1997-01-16 1998-07-21 Cerdec Corporation Partially crystallizing lead-free enamel composition for automobile glass
EP0895252A1 (en) * 1997-07-29 1999-02-03 E.I. Du Pont De Nemours And Company Thick film silver termination composition
ES2170438T3 (es) * 1997-08-08 2002-08-01 Dmc2 Degussa Metals Catalysts Composiciones de vidrio exentas de plomo que presentan un bajo punto de fusion.
US6210805B1 (en) * 1998-01-29 2001-04-03 Asahi Glass Company Ltd. Glass plate provided with a conductive layer, method for its production, conductive paste and window for an automobile
US6071437A (en) * 1998-02-26 2000-06-06 Murata Manufacturing Co., Ltd. Electrically conductive composition for a solar cell
JPH11329073A (ja) * 1998-05-19 1999-11-30 Murata Mfg Co Ltd 導電ペースト及びそれを用いたセラミック電子部品
JP3484983B2 (ja) 1998-07-28 2004-01-06 株式会社村田製作所 導電性ペースト及びガラス回路基板
US6549193B1 (en) 1998-10-09 2003-04-15 3M Innovative Properties Company Touch panel with improved linear response and minimal border width electrode pattern
US6217821B1 (en) * 1999-06-02 2001-04-17 E. I. Du Pont De Nemours And Company Method of forming distortion-free circuits
US6280552B1 (en) * 1999-07-30 2001-08-28 Microtouch Systems, Inc. Method of applying and edge electrode pattern to a touch screen and a decal for a touch screen
US20030134095A1 (en) * 2002-01-16 2003-07-17 Bottari Frank J Method of applying an edge electrode pattern to a touch screen
DE19945866A1 (de) * 1999-09-24 2001-03-29 Dmc2 Degussa Metals Catalysts Verfahren zur Herstellung einer leitfähigen Beschichtung auf Glas oder emailliertem Stahl und hiernach beschichtete Substrate
US20010028343A1 (en) * 2000-02-02 2001-10-11 Bottari Frank J. Touch panel with an integral wiring harness
US7321362B2 (en) 2001-02-01 2008-01-22 3M Innovative Properties Company Touch screen panel with integral wiring traces
US6651461B2 (en) 2001-05-31 2003-11-25 3M Innovative Properties Company Conveyor belt
US6488981B1 (en) * 2001-06-20 2002-12-03 3M Innovative Properties Company Method of manufacturing a touch screen panel
JP3932858B2 (ja) * 2001-10-23 2007-06-20 株式会社村田製作所 導電性ペースト
US6814795B2 (en) * 2001-11-27 2004-11-09 Ferro Corporation Hot melt conductor paste composition
JP3991218B2 (ja) * 2002-12-20 2007-10-17 信越化学工業株式会社 導電性接着剤及びその製造方法
JP4103672B2 (ja) * 2003-04-28 2008-06-18 株式会社村田製作所 導電性ペーストおよびガラス回路構造物
JP2006054091A (ja) * 2004-08-11 2006-02-23 Narumi China Corp 導電性被膜被覆ガラス基板及びその製造方法
JP4815828B2 (ja) * 2005-03-11 2011-11-16 Ｔｄｋ株式会社 導電性ペースト、電子部品、及び電子機器
US7435361B2 (en) * 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
US7832233B2 (en) * 2005-05-18 2010-11-16 Ferro Corporation Method of making staged burnout enamels for second surface firing of multilayer glass structures
US20080057233A1 (en) * 2006-08-29 2008-03-06 Harrison Daniel J Conductive thermal transfer ribbon
US7560401B2 (en) * 2007-04-20 2009-07-14 Johnson Matthey Public Limited Company Frits and obscuration enamels for automotive applications
US7833439B2 (en) * 2007-07-24 2010-11-16 Ferro Corporation Ultra low-emissivity (ultra low E) silver coating
JP4760836B2 (ja) * 2008-01-16 2011-08-31 株式会社村田製作所 導電性ペーストおよびガラス回路構造物
JP5716664B2 (ja) * 2009-06-17 2015-05-13 旭硝子株式会社 電極形成用ガラスフリット、およびこれを用いた電極形成用導電ペースト、太陽電池
JP2014096198A (ja) * 2011-03-02 2014-05-22 Central Glass Co Ltd 自動車用窓ガラスと給電端子の接合方法
EP2718478B1 (en) 2011-06-08 2016-03-23 King Saud University Method for coating a substrate with silver nanoparticles
US10266444B2 (en) 2012-12-14 2019-04-23 Ferro Corporation Method of making multilayer glass structure
EP2896602B1 (en) * 2014-01-16 2017-08-09 Heraeus Precious Metals North America Conshohocken LLC Low-silver electroconductive paste
KR101837476B1 (ko) 2014-04-02 2018-03-12 페로 코포레이션 유리 강도에 있어서 개선된 성능의 전도성 페이스트
JP6324288B2 (ja) * 2014-10-08 2018-05-16 化研テック株式会社 導電性ペースト及び電磁波シールド部材
JP6661670B2 (ja) 2015-06-15 2020-03-11 ジェイ・ダブリュ スピーカー コーポレイション レンズ加熱システム及びｌｅｄ照明システムのための方法
JPWO2017006714A1 (ja) * 2015-07-03 2018-03-08 株式会社村田製作所 導電性ペースト、及びガラス物品
CN110465671B (zh) * 2019-08-08 2022-03-25 湖南诺尔得材料科技有限公司 一种片状银粉的制备方法
KR20220123286A (ko) 2020-01-16 2022-09-06 나믹스 가부시끼가이샤 도전성 페이스트, 전극 및 칩 저항기
CN112479592A (zh) * 2020-12-18 2021-03-12 黄山市晶特美新材料有限公司 一种抗冲击性强且膨胀系数可调的玻璃粉及其制备方法

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Publication number Priority date Publication date Assignee Title
US4029605A (en) * 1975-12-08 1977-06-14 Hercules Incorporated Metallizing compositions
US4369063A (en) * 1981-11-12 1983-01-18 Ciba-Geigy Corporation Silver containing conductive coatings
US4547467A (en) * 1983-06-22 1985-10-15 Burroughs Corporation Dielectric composition and devices using it
US4761224A (en) * 1986-03-10 1988-08-02 Quantum Materials Inc. Silver-glass paste with poly-modal flake size distribution and quick dry vehicle
KR950006202B1 (ko) * 1986-11-03 1995-06-12 시바-가이기 아게 무연(lead-free) 유리 프릿 조성물
US4970178A (en) * 1986-11-03 1990-11-13 Ciba-Geigy Corporation Lead-free glass frit compositions
US4975301A (en) * 1987-08-07 1990-12-04 The O. Hommel Company Glass coating
US4983196A (en) * 1988-01-29 1991-01-08 Ciba-Geigy Corporation Method of molding enamel coated glass sheet without adhesion to die
US4959090A (en) * 1988-09-28 1990-09-25 Ciba-Geigy Corporation Glass enamel coating compositions

Also Published As

Publication number Publication date
US5346651A (en) 1994-09-13
JPH07105723A (ja) 1995-04-21
EP0640993B1 (en) 1998-02-25
DK0640993T3 (da) 1998-09-28
DE69408609D1 (de) 1998-04-02
EP0640993A1 (en) 1995-03-01
BR9403375A (pt) 1995-05-09
CA2131138A1 (en) 1995-03-01
DE69408609T2 (de) 1998-06-18
ATE163488T1 (de) 1998-03-15
JP3574683B2 (ja) 2004-10-06
CA2131138C (en) 2008-04-08
US5417745A (en) 1995-05-23
GR3026652T3 (en) 1998-07-31

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