ES2075729T3 - Polvo de aleacion de soldar revestido con parileno. - Google Patents

Polvo de aleacion de soldar revestido con parileno.

Info

Publication number
ES2075729T3
ES2075729T3 ES93102754T ES93102754T ES2075729T3 ES 2075729 T3 ES2075729 T3 ES 2075729T3 ES 93102754 T ES93102754 T ES 93102754T ES 93102754 T ES93102754 T ES 93102754T ES 2075729 T3 ES2075729 T3 ES 2075729T3
Authority
ES
Spain
Prior art keywords
parylene
solder
alloy powder
powder coated
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93102754T
Other languages
English (en)
Inventor
Richard Day Jenkinson
Michael William Sowa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LONDON CHEMICAL Co Inc
Original Assignee
LONDON CHEMICAL Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LONDON CHEMICAL Co Inc filed Critical LONDON CHEMICAL Co Inc
Application granted granted Critical
Publication of ES2075729T3 publication Critical patent/ES2075729T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dental Preparations (AREA)
  • Powder Metallurgy (AREA)
  • Nonmetallic Welding Materials (AREA)

Abstract

SE PRESENTAN POLVOS PARA SOLDADURA RECUBIERTOS CON UNA FINA CAPA DE PARILENO Y PASTAS DE SOLDADURA QUE CONTIENEN LOS POLVOS DE SOLDADURA RECUBIERTOS. LOS POLVOS DE SOLDADURA RECUBIERTOS PUEDEN EXHIBIR UN ALTO GRADO DE RESISTENCIA A LA OXIDACION Y A LAS REACCIONES CON EL FLUJO CONTENIDO EN LA PASTA DE SOLDADURA SIN INTERFERIR SUBSTANCIALMENTE CON LAS CARACTERISTICAS DE REFLUJO DE LA SOLDADURA.
ES93102754T 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno. Expired - Lifetime ES2075729T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/839,581 US5272007A (en) 1992-02-21 1992-02-21 Solder powder coated with parylene

Publications (1)

Publication Number Publication Date
ES2075729T3 true ES2075729T3 (es) 1995-10-01

Family

ID=25280134

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93102754T Expired - Lifetime ES2075729T3 (es) 1992-02-21 1993-02-22 Polvo de aleacion de soldar revestido con parileno.

Country Status (13)

Country Link
US (2) US5272007A (es)
EP (1) EP0556864B1 (es)
JP (1) JP3110582B2 (es)
KR (1) KR930017663A (es)
CN (1) CN1035363C (es)
AT (1) ATE126114T1 (es)
CA (1) CA2090072A1 (es)
DE (1) DE69300337T2 (es)
DK (1) DK0556864T3 (es)
ES (1) ES2075729T3 (es)
GR (1) GR3017675T3 (es)
MX (1) MX9300914A (es)
TW (1) TW279844B (es)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9312328D0 (en) * 1993-06-15 1993-07-28 Lexor Technology Limited A method of brazing
DE4402042A1 (de) * 1994-01-25 1994-06-09 Kunststoff Maschinen Handelsge Mikropartikulierte Reflow-Lötmittel und Verfahren zu deren Herstellung
US5674326A (en) * 1994-09-21 1997-10-07 Motorola, Inc. Solder paste
US5593504A (en) * 1995-04-26 1997-01-14 Church & Dwight Co., Inc. Method of cleaning solder pastes from a substrate with an aqueous cleaner
US5789068A (en) * 1995-06-29 1998-08-04 Fry's Metals, Inc. Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
EP0854768A1 (en) 1995-10-06 1998-07-29 Brown University Research Foundation Soldering methods and compositions
JP3220635B2 (ja) 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US5778638A (en) * 1996-03-06 1998-07-14 Mitsubishi Gas Chemical Company, Inc. Process for preserving solder paste
JP3493101B2 (ja) * 1996-08-15 2004-02-03 三井金属鉱業株式会社 半田粉及びその製造方法、及びその半田粉を用いた半田ペースト
DE19731151C1 (de) * 1997-07-21 1999-01-21 Degussa Lotpaste zum Hartlöten und Beschichten von Aluminium und Aluminiumlegierungen
DE19826756C2 (de) * 1998-06-15 2002-04-18 Juergen Schulze Verfahren zum Verkapseln von feinen Lotmetallpulvern und danach hergestellte Lotmetallpulver
JP4138965B2 (ja) * 1998-10-01 2008-08-27 三井金属鉱業株式会社 無鉛ハンダ粉及びその製造方法
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6506448B1 (en) 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
KR100725075B1 (ko) * 1999-06-01 2007-06-08 알파 메탈즈, 인크. 볼 그리드 어레이 솔더 합금 스피어를 보호 코팅하는 방법
US6488992B1 (en) 1999-08-18 2002-12-03 University Of Cincinnati Product having a thin film polymer coating and method of making
JP3910878B2 (ja) * 2002-05-13 2007-04-25 新光電気工業株式会社 導電性粉末付着装置及び導電性粉末付着方法
CN100457374C (zh) 2003-06-25 2009-02-04 贝洱两合公司 用于金属部件钎焊的钎剂及其制造方法
US7413771B2 (en) * 2003-07-09 2008-08-19 Fry's Metals, Inc. Coating solder metal particles with a charge director medium
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
DE10343655B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
DE10343652B4 (de) * 2003-09-20 2005-09-29 Elringklinger Ag Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit
US7163586B2 (en) * 2003-11-12 2007-01-16 Specialty Coating Systems, Inc. Vapor deposition apparatus
US20050239947A1 (en) * 2004-02-27 2005-10-27 Greenhill David A Polymeric silver layer
DE102004034815A1 (de) * 2004-07-19 2006-03-16 Behr Gmbh & Co. Kg Verfahren zur Herstellung von gefügten Werkstücken
US20070277909A1 (en) * 2004-09-13 2007-12-06 Norihito Tsukahara Solder Paste and Electronic Device Using Same
US7455106B2 (en) * 2005-09-07 2008-11-25 Schlumberger Technology Corporation Polymer protective coated polymeric components for oilfield applications
JP4826630B2 (ja) * 2006-04-26 2011-11-30 千住金属工業株式会社 ソルダペースト
WO2010059924A2 (en) * 2008-11-21 2010-05-27 Henkel Corporation Thermally decomposable polymer coated metal powders
US9682447B2 (en) 2010-08-20 2017-06-20 Henkel IP & Holding GmbH Organic acid- or latent organic acid-functionalized polymer-coated metal powders for solder pastes
CN103945961B (zh) * 2011-09-06 2017-01-18 汉高知识产权控股有限责任公司 用于焊膏的涂覆有二官能或多官能缺电子烯烃的金属粉末
US8816371B2 (en) 2011-11-30 2014-08-26 Micron Technology, Inc. Coated color-converting particles and associated devices, systems, and methods
EP2886244A1 (de) * 2013-12-17 2015-06-24 Heraeus Deutschland GmbH & Co. KG Verfahren zur Befestigung eines Bauteils auf einem Substrat
WO2015146999A1 (ja) * 2014-03-25 2015-10-01 住友金属鉱山株式会社 被覆はんだ材料およびその製造方法
JP5790862B1 (ja) * 2014-12-25 2015-10-07 千住金属工業株式会社 やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ
US10730150B2 (en) * 2017-08-07 2020-08-04 Honeywell International Inc. Flowable brazing compositions and methods of brazing metal articles together using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE449016C (de) * 1927-09-03 Duplex Printing Press Company Maschine zum Giessen von Stereotypplatten
DE448016C (de) * 1925-02-05 1927-08-02 Pathe Cinema Anciens Etablisse Aufwickelvorrichtung fuer Kinematographenfilme
US3300332A (en) * 1966-02-07 1967-01-24 Union Carbide Corp Coated particulate material and method for producing same
US4225647B1 (en) * 1977-12-02 1995-05-09 Richard A Parent Articles having thin, continuous, impervious coatings
US4298407A (en) * 1980-08-04 1981-11-03 E. I. Du Pont De Nemours And Company Flux treated solder powder composition
US4419279A (en) * 1980-09-15 1983-12-06 Potters Industries, Inc. Conductive paste, electroconductive body and fabrication of same
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4818614A (en) * 1985-07-29 1989-04-04 Shiseido Company Ltd. Modified powder
US4758288A (en) * 1987-06-08 1988-07-19 Ronald T. Dodge Co. Encapsulated lithium granules and method of manufacture
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
US5069972A (en) * 1988-09-12 1991-12-03 Versic Ronald J Moldable microcapsule that contains a high percentage of solid core material, and method of manufacture thereof
EP0448016A1 (en) * 1990-03-19 1991-09-25 Union Carbide Chemicals And Plastics Company, Inc. Process for optimizing corrosion protection of coated substrates

Also Published As

Publication number Publication date
EP0556864B1 (en) 1995-08-09
DE69300337D1 (de) 1995-09-14
KR930017663A (ko) 1993-09-20
CA2090072A1 (en) 1993-08-22
ATE126114T1 (de) 1995-08-15
JPH067993A (ja) 1994-01-18
MX9300914A (es) 1993-09-01
GR3017675T3 (en) 1996-01-31
DK0556864T3 (da) 1995-09-25
CN1035363C (zh) 1997-07-09
DE69300337T2 (de) 1996-02-01
CN1079929A (zh) 1993-12-29
JP3110582B2 (ja) 2000-11-20
TW279844B (es) 1996-07-01
US5272007A (en) 1993-12-21
US5328522A (en) 1994-07-12
EP0556864A1 (en) 1993-08-25

Similar Documents

Publication Publication Date Title
ES2075729T3 (es) Polvo de aleacion de soldar revestido con parileno.
AU6395286A (en) Fusible powdered metal solder paste
IE811760L (en) Solder powder composition
EP0655961A4 (en) Tin-bismuth soft solder paste and method of using same.
GB2243623B (en) Low-residue soldering flux containing rosin
GB8923080D0 (en) Welding of coated metals
AU585135B2 (en) Submerged arc welding flux
GB2072710B (en) Coated electrode for are welding flux for coating electrodes and flux-containing coating composition
JPS56169744A (en) Soldering alloy
ES530684A0 (es) Conductor electrico multifilar y procedimiento de soldadura
EP0086575A3 (en) Dental bonding agent composed of aluminum powder plus inert liquid organic carrier
DE59200604D1 (de) Schweiss- und/oder Lötmaterial.
DE3569217D1 (en) Soldering compositions, fluxes and methods of use
WO2003004713A3 (en) Lead-free solder alloy
AU6444580A (en) High density sintered powdered metal alloy
ES8501276A1 (es) Procedimiento para soldar directamente productos semiacabados a base de materiales de contacto sobre soportes de contactos electricos.
JPS54128459A (en) Phosphorrcontaining solder alloy and additive alloy therefor
JPS5433848A (en) Solder flux for bonding nickellchromium alloy wire rod or foil
PL250600A1 (en) Soft solder in the form of paste for soldering and tinning
SU1139040A1 (ru) Припой для пайки алюминия и его сплавов
PL265998A1 (en) Electrode coating wor welding copper and copper alloys
DK551485A (da) Metaloxidovertrukket kobberpulver
JPS541254A (en) Solder alloy for silver electrode lead
JPS54139850A (en) Melt welding of precious metal foil
JPS57102031A (en) Manufacutre of semiconductor element

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 556864

Country of ref document: ES